tds-smt-adhesive-pd955_m.pdf - 第2页
PD 955 M SMT Adh esive 2 / 2 The des cr ip ti ons and en ginee ring da ta sho wn here h ave b een com pil ed by H erae us u sing c omm onl y - acc ept ed proce dures , in conjun ctio n with moder n testing equipm ent, a …
PD955 M
SMT Adhesive
1 / 2
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual
knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the
results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to
determine materials suitability for particular application. The Heraeus logo, Heraeus, Welco
TM
, Microbond® and mAgic®, and the Welco, Microbond
and mAgic figurative mark are trademarks or registered trademarks of Heraeus Holding
GmbH or its affiliates. All rights reserved.
Heraeus Electronics GmbH & Co.KG, 63450 Hanau, Germany
Web: www.heraeus-electronics.com
Technical Data Sheet | File Name: TDS_SMT_Adhesive_PD955_M
Document Number: HET21024-0724-7
Physical Properties
Processing time
at 20 – 30°C (days)
Max. 2
Curing Profile
The standard curing
conditions are 125°C / 3
minutes. As long as the
curing profile is respected,
the adhesive can withstand
reflow conditions according
IPC/JEDEC J-STD-020
1 min / 180 °C
1,5 min / 150 °C
3 min / 125 °C
8 min / 100 °C
Color Red
Applications Dispensing
Key Features
Very wide processing window, no tendency towards
stringing
Excellent adhesion with standard and also with
difficult to glue components
Consistent batch-to-batch quality
Description
PD955 M is a thermosetting single component, solvent-
free polymer adhesive, developed especially for the
surface mounting of SMT components onto PCBs and
for use on bare substrates. This rheology is specially
adapted for high-speed dispensing.
This picture does not show the packaging of PD955 M and is solely intended for
illustration purposes. The products are available in different packaging configurations
and may change over time. Please refer to the latest safety data sheets for safety-
relevant pictograms.
PD955 M
SMT Adhesive
2 / 2
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual
knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the
results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to
determine materials suitability for particular application. The Heraeus logo, Heraeus, Welco
TM
, Microbond® and mAgic®, and the Welco, Microbond
and mAgic figurative mark are trademarks or registered trademarks of Heraeus Holding
GmbH or its affiliates. All rights reserved.
Heraeus Electronics GmbH & Co.KG, 63450 Hanau, Germany
Web: www.heraeus-electronics.com
Technical Data Sheet | File Name: TDS_SMT_Adhesive_PD955_M
Document Number: HET21024-0724-7
Adhesive Conditioning
Remove adhesive from fridge: Before opening the
package leave it for at least 2 hours at room
temperature so that adhesive heats up
Do not open cartridge while adhesive is cold to
prevent condensation
Before using adhesive cartridge: Before inserting
nozzle, press small quantity of glue out of cartridge
until homogeneous glue comes out – during storage
of cartridges, low viscosity glue constituents may be
found on the tip of the cartridge
Cleaning Instructions
Before curing: The adhesive can be removed with Zestron
HC and other Zestron and Vigon cleaning materials. Do
not use alcohol as this will cure the adhesive. Cleaned
dispensing units should be completely dried before
installation.
After Curing: Defective components can be replaced by
heating (with hot air) the cured adhesive joint above 100
°C. After removing the component (torsion movement),
the hot air should be focused on the remaining adhesive
in order to remove it with a sharp tool.
Storage Conditions
Store the SMT-adhesive in originally sealed
containers and avoid exposure to high humidity and
sunlight
Store cartridges with tip pointing downwards
Max. expiration date: Shelf life: Please refer to the
expiry date on the label of the packaged product
Storage condition in the refrigerator at 2 – 10 °C
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Phone +65 6571 7649
electronics.apac@heraeus.com
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