Viscom_Brochure_AOI_iS6059_PCB_Inspection_Plus_en.pdf - 第2页
Simple measurement of standards and exceptional cases Electronic products must function reliably and often meet ver y high safety requiremen ts. Quality and durability are crucial. A gainst this background, rst -class 3…
Exceptional
3D Computing
Power and Reliable
Measurement
Accuracy
3D AOI
iS6059 PCB Inspection Plus
Smart networked automatic optical
inspection of complex assemblies
Camera module
XMplus-II for ultra-fast
image acquisition
Simple measurement of standards and
exceptional cases
Electronic products must function reliably and often meet very
high safety requirements. Quality and durability are crucial. Against
this background, rst-class 3D and software features, high measure-
ment accuracy, and exceptional image quality are expected from
an automatic optical inspection system – as well as a very robust
construction.
When producing for a variety of customers and markets, simple
programming and exible handling are particularly important. In
such cases, it is necessary to cover dierent products in small or
large production quantities exibly while still being able to quickly
and comprehensively detect any manufacturing defects. In the
case of very large quantities, throughput is particularly important.
Viscom takes these and other considerations into account in the
development of new inspection systems.
Line-Integrated Quality Control
for Highest Requirements
Uncompromisingly good imaging thanks to state-of-the-art
sensor technology
High resolution for precise inspection of microscopic components
Large tilted views for the most accurate analyses
Smart verication with optional AI integration
Intuitively simple operation and creation of inspection programs
Fast data processing with powerful frame grabber
Extremely fast handling of the inspection objects
Competent service worldwide – online, by phone, and on site
Inspection of cut voids using a combined 2D,
2½D and 3D approach
Complete rendering with 360View for
verification tasks
Component body detection using 3D methods
STRONG, IMPRESSIVE, INTELLIGENT
also plays an important role today and is equally reliably
covered with the iS6059 PCB Inspection Plus from Viscom.
Sophisticated inspection methods are available to quickly
and fully automatically check whether even the solder
joint of the smallest electronic component is still normal or
is already too thin. Articial intelligence can be grad-
ually integrated into inspection program creation and
verication tasks.
Depending on the weighting between speed and image
quality, the XMplus-II camera module oers suitable
lighting options. As with previous systems from Viscom,
2D, 2½D, and 3D approaches are combinable as desired.
For example, the correct polarity would be quickly checked
in 2D. Results from 3D SPI, 3D AOI, 3D AXI, and 3D MXI
can be smartly brought together for comprehensive
networked quality control. The iS6059 PCB Inspection Plus
is also designed to automatically take additional images
at predetermined positions on instruction from the solder
paste inspection. Solutions such as IPC HERMES 9852 or
IPC CFX are also integrated.
With the 3D-AOI system iS6059 PCB Inspection Plus,
processes are signicantly improved and returns are
consistently avoided. Manufacturing costs can be reduced
in the long term and the high quality of even the most
demanding electronic products can be ensured.
Automatic optical inspection is constantly evolving.
This applies equally to image quality as well as to the
evaluation of results and the networking of inspection
data for the optimization of production processes.
Viscom has been oering the 3D option for its automatic
optical systems since 2013, which has been continuously
developed since then and is now a worldwide standard.
Hardware, algorithms, and applicative possibilities are
meeting increasingly higher requirements. The iS6059
PCB Inspection Plus' nine perspectives, together with the
integrated, individually programmable projector, enable
complete 360-degree views in 3D and precise height
measurements of the smallest components.
In the XMplus-II camera module, for example, the devel-
opers at Viscom have maximized the tilted elds of view.
There is also now even more depth of eld from every
angle. This makes it possible, among other things, to rec-
ognize characters on even higher components. Thanks to
the VEG105 frame grabber and ultra-high-speed lighting,
hardware-accelerated 3D recalculation achieves an un-
precedented level of performance and meets the highest
demands for cycle times with the best image quality and
repeatability. The circuit boards are changed in a matter of
a few seconds.
3D methods have long been established, for example,
for checking the presence of electronic components as
quickly as possible or measuring the exact heights on an
assembly. In addition, reliable 3D solder joint inspection
Classication of inspection results with the vVerify software from Viscom