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Specif ications: TropoSPHERE TM Plas ma System For more information, s peak with your l ocal r epresent ative o r cont act your regional offi ce . North A merica Headquarters Concord, CA +1.925.827.1240 China Shanghai +8…

TropoSPHERE™ Plasma System

Features and Benefits

 Dual cassette load stations to minimize

idle time

 Multi-size capable aligner with minimal

hardware change-over required

 Robust robotic wafer engine

 Integrated wafer recognition for high

reliability wafer handling

 Compact design minimizes floor space

 Unique kits allow fast change-over

between wafer sizes and supports multi-

load for smaller wafer sizes

 Highly uniform treatment and fast

throughput

Superior Plasma Technology for High

Throughput Wafer Processing

The TrophoSPHERE

Plasma System is designed for

high-throughput processing of semiconductor wafers (and

other flat substrates) in sizes ranging from 3 in. to 200mm

(8 in.) in diameter, for wafers held in open cassettes.

The patented plasma chamber design provides exceptional

etch uniformity and process repeatability. Primary plasma

applications include a variety of etching, ashing, and

descum steps. Other plasma processes include

contamination removal, surface roughening, increasing

wettability, and enhancing bonding and adhesion strength.

Application

Wafer processing prior to typical back-end packaging steps

– suitable for wafer-level packaging, flip-chip, or traditional

packaging.

High Throughput Processing

The TropoSPHERE’s integrated semiconductor wafer

handling system provides rapid material transfer for a wide

range of wafer sizes. Processing can be done from most

types of wafer cassettes.

The patented chamber design and control architecture

enables short plasma cycle times with very low overhead,

ensuring that throughput for your application is maximized

and cost of ownership is minimized.

Wafer Cleaning

• Remove contamination prior to wafer bumping

• Remove organic contamination

• Remove fluorine and other halogen contamination

• Remove metal and metal oxides

• Improve spun-on film adhesion

• Clean metallic bond pads

Wafer Etching

• Descum wafer of residual photoresist / BCB

• Pattern dielectric layers for redistribution

• Strip / etch photoresist

• Enhance adhesion of wafer applied materials

• Remove excess wafer applied mold / epoxy

• Enhance adhesion of gold solder bumps

• Destress wafer to reduce breakage

• Improve spun-on film adhesion

• Clean Aluminum bond pads

Specifications: TropoSPHERE

Plasma System

For more information, speak with your local representative or contact your regional office.

North America

Headquarters

Concord, CA

+1.925.827.1240

China

Shanghai

+86.21.3866.9166

EMEA

Maastricht,

Netherlands

+31.65.155.4996

S.E. Asia

Singapore

+65.6796.9500

Korea

Seoul

+82.31.736.8321

Taiwan

New Taipei City

+886.2.2902.1860

India

Chennai

+91.44.4353.9024

www.nordsonmarch.com info@nordsonmarch.com

Published 2014-07-02

Enclosure

Dimensions

W x D x H – Footprint

1094W x 1170D x 1700H mm (10.3W x 46D x 63H in.)

1094W x 1170D x 2185H mm (10.3W x 46D x 86H in.) with

wafer loading doors open

Net Weight

295kg (650lbs)

Effective Footprint – Clearances

Right, Left, Back - 153mm (6 in.), Front - 914mm (36 in.)

min.

Chamber

Volume

5.5 liters (338 cubic inches)

Variable Configuration

75mm, 100mm, 150mm and 200mm Substrate Sizes

Electrodes Powered Electrode Dimensions

305W x 305D mm

12W x 12D in.

RF Power

Standard Wattage

600W

Frequency

13.56 MHz

Gas Control

Maximum Number of MFCs

Control System

Interface

PLC with PC Based Touch Screen Interface

Remote

Interface

Communications

SMEMA, SECS/GEM, Remote HMI

Vacuum Pump

Dry Vacuum Pump

16 CFM, Variable Frequency Drive

Facilities

Power Supply

220 VAC, 20 A, 50/60Hz, Single Phase, 12 AWG, 3-Wire

Process Gas Fitting Size & Type

.25-in. OD Swagelok Compression

Process Gas Purity

Industrial grade or better

Process Gas Pressure

Regulated from .69 bar (10 psig) min. to 1.4 bar (20 psig)

max.

Purge Gas Fitting Size & Type

.25-in. OD Swagelok Compression

Purge Gas Purity

Industrial grade Nitrogen or CDA

Purge Gas Pressure

Regulated from 5.5 bar (80 psig) min. to 6.9 bar (100 psig)

max.

Pneumatic Valves Fitting Size &

Type

.25-in. OD Swagelok Compression

Pneumatic Gas Purity

CDA, Oil Free, Dewpoint <=7°C /45°F, Particulate Size <5

micron

Pneumatic Gas Pressure

Regulated from 5.5 bar (80 psig) min. to 6.9 bar (100 psig)

max.

Vacuum Source

-40 kPa (-5.8 psi)

Exhaust

25.4 mm (1 in.) OD Pipe Flange

Compliance

Certifications

CE Marked, SEMI S2/S8 (EH&S/Ergonomics)

Ancillary

Equipment

Nitrogen Generator (option)

Necessary for Purge Gas Requirements

Chiller (option)

Required When Configured with Cooled Electrode

Hydrogen Kit (option)

Allows System to Use Hydrogen Gas for Processing

Scrubber (option)

Intended for Fluorinated Operations on the System

Shipping

Gross Weight

445 kg (979 lbs)

Number of Packages

Packing Conforms to ISPM 15

Yes