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CondensoX Condensation Soldering In reflow condensation soldering or vapour-phase soldering, soldering is ac - complished with the aid of a hot vapour . Heat transfer in condensation solder - ing is up to ten times highe…
TECHNOLOGY BENEFITS
› Control of the reow prole with patented injection principle
›
Hermetically sealed process chamber
› Controllable vacuum process
› Horizontal, safe transport for the module through the machine
›
No spreading of Galden
®
and active Galden
®
ltering
› Process monitoring with wireless WPS system
CondensoX
Condensation Soldering
In reflow condensation soldering or vapour-phase soldering, soldering is ac-
complished with the aid of a hot vapour. Heat transfer in condensation solder-
ing is up to ten times higher than with convection soldering. This is particularly
suitable for processing large or high-mass boards in a stable process atmos-
phere. The inert heat transfer medium used is perfluorpolyether (Galden
®
).
Our CondensoX series can solder even the most difcult assemblies quickly
and dependably, at temperatures up to 240 °C. In order to improve control of
the condensation phase, Rehm has developed a patented injection process
that allows the soldering procedure to be individually regulated. An optional
vacuum module ensures void-free soldered joints – directly after the sol-
dering process or as a pre-vacuum. Our systems let you adjust parameters,
such as temperature or pressure (vacuum), flexibly according to production
requirements.
CondensoX Condensation Soldering
Smartline
Inline
Inline loading/
unloading
air operation
X-Line
Inline
Inline loading/
unloading
nitrogen operation
XC
Manual
Front loading
XS Smart
Manual
Loading from
the side and front
XM Smart
Manual / Autom.
Loading from
the side
CondensoX-Serie
Nexus
Void free soldering with vacuum
Perfect for different applications
Reliable vacuum processes for improved quality
The vacuum soldering process generates temperatu-
res of up to 450 °C and is an ideal solution for void-free
and flux-free applications. The Nexus not only provi-
des your manufacturing operation with advantages for
the soldering process, but rather for bonding proces-
ses as well.
Without vacuum With vacuum
Up to
450 °C