Brochure_MaxiReflowV1_17.pdf - 第2页
• Winner of the Global T echnology Award. • Worldwide unique: thermally invisible conveyor system. • Maximum process reliability with 100 % parallel align- ment of the conveyor rails. • Efficient residue management ensur…
Total Solutions
for Soldering Processes and
Automated Production Lines
SEHO MaxiReflow
Reflow Soldering System SEHO MAXIREFLOW
• Winner of the Global Technology Award.
• Worldwide unique:
thermally invisible conveyor system.
• Maximum process reliability with 100 % parallel align-
ment of the conveyor rails.
• Efficient residue management ensures long mainten-
ance intervals.
• Optimum, powerful heat transfer.
• Low, component-sensitive set temperatures.
• Flexible temperature management due to a high num-
ber of heating zones.
• Effective, multi-stage cooling zone.
• High machine availability.
• Automatic recording of machine and process data
with comfortable software tools.
• Nitrogen control ensures low operation costs.
• MaxiReflow 3.0 available in three basic versions:
- with 7 heating zones
- with 8 heating zones, designed for nitrogen operation
- with 10 heating zones, designed for nitrogen operation
• MaxiReflow 3.6 available in two basic versions:
- with 10 heating zones, designed for nitrogen operation
- with 12 heating zones, designed for nitrogen operation
• MaxiReflow 4.5 available in two basic versions:
- with 11 heating zones, designed for nitrogen operation
- with 13 heating zones, designed for nitrogen operation
SEHO MaxiReflow: Maximum Soldering Results
SEHO MaxiReflow, which won a Global Technology
Award, sets a milstone in soldering technology.
The system is equipped with a revolutionary, thermally
invisible conveyor system, an effective and component-
sensitive heat transfer technology as well as a highly
efficient residue management with process gas cleaning.
Maximum process reliability, maximum soldering
quality and maximum machine availability arrive at
one conclusion: SEHO MaxiReflow.
M A X I R E F L O W
M A X I R E F L O W
Maximum Parallelism: The LowMassConveyor
The new ‘LowMassConveyor’ transport system of the
MaxiReflow has shown itself to be extremely innovative and
unique worldwide.
The chain guide profiles are carried by continuous steel
cables in this transport system, each of which is spanned with
a tensile force of 14,700 newton through the entire system.
This ensures an absolute parallel alignment of the profiles.
Extremely slender chain guide profiles which are ‘thermally
invisible’ can thus be utilized at the same time.
A similar principle is used for the center support, which cannot
be ‘seen’ on the temperature profile either, completely inde-
pendent from its position.
This innovative transport system has a further advantage for
the area of maintenance.
Only one adjustment mechanism is still required within the
process zone because the parallel alignment of the chain
guide profiles is not achieved within the oven by means of
spindles but solely by means of tensile force from the
spanned cables.
This method results in less potentially corroding surfaces on
which the contaminated process gases can condense,
whereby the outlay on maintenance and the extent of
possible wear are reduced to a minimum. This does not only
save time but also money in your production.
Of course, the MaxiReflow soldering systems are available
with a dual conveyor system as well to realize maximum
production volumes.
Maximum Cleaning Results:
The Residue Management
The significantly increased temperatures of the lead-free pro-
cess inevitably lead to more evaporation from paste, com-
ponents, PCB, solder mask etc. as well as products of
chemical reactions between them.
Therefore, an efficient residue management with cleaning of
the process gas is an absolute must for a modern reflow
soldering system.
The MaxiReflow is equipped with a new and highly efficient
multi-stage process gas cleaning system which ensures long
maintenance intervals. This guarantees a remarkable cost
reduction in your production and additionally makes for a high
machine availability.
Up to 99 % void-free solder connections with the Voidless Pressure Chamber that can be inte-
grated in the peak area: Effective and Safe!
All of the heated zones are directly connected to the system
for cleaning the process gas. Moreover, the process gas is
conducted within the hot area up to the cleaning point, in order
to guarantee that the condensation is controlled. The cleaning
system itself is the first cold point that the process gas meets:
a double-walled, cooled condensing cyclone.
The cleaned process gas afterwards is conducted to the last
preheat zone. This principle enables high temperature
differences between the last preheat zone and the first peak
zone.
Maximum Heat Transfer:
Perfect Temperature Management for Perfect Soldering
Results
Provided with the unique tangential blower technology and a
perfect gas leading system, the MaxiReflow systems exactly
deliver what you expect from your reflow soldering machine:
excellent and repeatable soldering results.
A very homogeneous heat distribution throughout the entire
conveyor width, combined with moderate gas velocities are
ensured by a large volume of ventilated process gas and
especially adapted slot nozzles. This gas leading concept
completely excludes any shadowing or unintended move-
ment of components.
The special shape of the nozzles and the optimized gas
leading principle FDS (Flow Dynamic System) make for an
ideal, highly efficient heat transfer to the printed circuit boards
and thus enable the most effective and component-sensitive
heating of the product with set temperatures on a low level.
This helps a lot to fullfil today’s requirements concerning the
narrow process window of the lead-free soldering process. All
the components will be soldered reliably whereas the tem-
perature impact on the entire assembly and the Delta T will be
reduced significantly. The FDS principle simultaneously se-
parates the individual heating zones thermally from each
other and prevents build-up of an undesirable laminar flow.
Flexibility of the MaxiReflow systems is also given in terms of
the temperature management. Depending on the application
the machine may be equipped with different heating zone
configurations. This enables a very precise and flexible
reaction to all material- and process-related conditions - for
perfect soldering results.
In case of frequently changing products and truly different
temperature profiles, the emission-free express exhaustion
leads to remarkable time savings, thus contributing to a
reduction in manufacturing costs. Here, the temperature in
the process chamber is reduced to a significantly lower level
within shortest time.
Maximum Efficiency: The Multi-Stage Cooling Concept
The multi-stage, temperature-controlled cooling area of the
MaxiReflow provides special flexibility and ensures stress-
free cooling of your assemblies. It consists of active, closed
cooling modules that are equipped with integrated heat
exchangers. These heat exchangers are supplied with
cooling water that either may be provided by an internal water
chiller, or by a direct on site water connection.
Maximum Supervision: The Control Unit
The modular control concept is open-ended and consequent-
ly a system ready for new developments or additions and it
constantly offers the opportunity to meet new challenges.
The software is easy to use and provided with a comprehen-
sive management data tool for documentation and analyzing
purposes.
The machine may be equipped with a nitrogen control system
which ensures consistently high quality of your products and
enables you to have manufacturing costs under control.
Excellent Reflow Soldering: SEHO MaxiReflow