TrueFlat-DataSheet-Revision-01-07-Web.pdf - 第2页
To contact BTU please go to www.btu.com/support-contact-sales.htm 308 258 208 158 108 58 8 0.0 0.7 1.4 2.1 2.8 3.5 4.2 4.9 5.6 6.3 Te mperature (Celsius) Minutes (slope degrees/second) LEAD FREE PROFILE Fu rnace Control …
Built for Today. Ready for Tomorrow.
Pyramax reflow ovens have a long and successful history in semiconductor packaging
applications such as flip chip, curing, reflow and die attach applications. Requirements for
end-use devices continue to drive miniaturization while demanding greater semiconductor
performance and capability. These requirements can create manufacturing challenges such as
substrate warpage and die tilt.
BTU’s new TrueFlat Technology addresses these problems by applying a low pressure suction
to the bottom of substrate carrier, holding the substrate flat throughout the reflow process. The
optional TrueFlat Technology system fits within the existing Pyramax footprint without using expensive
vacuum pumps and specialized vacuum transport carriers. Recipe transfer and operation are easy to
implement while Pyramax’s legendary thermal performance and process repeatability are maintained.
Uniform flatness
through consis-
tent suction force
throughout entire
thermal process.
SPECIFICATIONS
Model Pyramax150N
Temperature Rating 350°C
Operating Temperature 200-350°C
Atmosphere Air/Nitrogen
Transport System Dual Lane Rail Edge Conveyor
(Carrier size defined at time of order)
Suction Range Room Temp. 1.0—1.8 IWC
150°C 0.95—1.50 IWC
250°C 0.75—1.25 IWC
300°C 0.70—1.15 IWC
Substrate Thickness ≤ 0.3 mm
Carrier Width ≤ 160 mm per lane
(consult factory for other widths)
* All specifications are subject to change without notice
0
50
100
150
200
250
Z1 Z2 Z3
Z4 Z6Z5
Z7 Z8 Z9
Z10 Z12Z11
Temp Profile°C
Tg 140°C Suction IWC
Zone
• Easy process
transfer
• Low maintenance,
no vacuum pump
• Superior thermal
uniformity
Key Benefits
• Eliminates Die Tilt
• Improves Yield
• No New Carriers Required
• Z-Axis Control of Warpage
Key Features
• Recipe Controlled Suction
• Data Available in SECS/GEM
• High Power Heaters
• Dual Lane Rail Transport
• No New Substrate Carriers
Required
To contact BTU please go to www.btu.com/support-contact-sales.htm
308
258
208
158
108
58
8
0.0 0.7
1.4 2.1 2.8 3.5 4.2 4.9 5.6 6.3
Te mperature (Celsius)
Minutes (slope degrees/second)
LEAD FREE PROFILE
Furnace
Control
Unit
Speed
Controller
Pressure
Tr ansducer
CLOSED LOOP
CONVECTION CONTROL
BTU’s exclusive Closed Loop Convection Control
provides maximum flexibility in process control.
• Side-to-side recirculation enhances
temperature uniformity
• Guaranteed process repeatability, system to
system, site to site
• Unmatched convection efficiency reduces zone
temperature setpoints.
Pyramax with TrueFlat Technology enables
z-axis control during the reflow process.
• Dual lane edge rail operation
• Recipe controlled suction
• Field-proven reliability
Headquarters | United States
BTU International, Inc
23 Esquire Road
North Billerica, MA 01862, USA
T 1-978-667-4111
F 1-978-667-9068
E btuhq@btu.com
Asia Pacific
BTU Shanghai, China
T +86-21-58669098
F +86-21-58669231
E btuasia@btu.com
Europe
BTU Europe Ltd., UK
T +44 (0) 1252 660010
F +44 (0) 1252 660011
E sales@btu.co.uk
© 2012 BTU International. | An AMTECH Company | All rights reserved.
Revision 01, 2017