西门子SIPLACE S25 HM-设备性能参数_EN.pdf - 第2页
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High Speed SMD Placement System
Spec f c
a
to
S
SIPLACE S-25 HM
SPECIFICATION
1
Subject to change
without notice.
Edition 2
1001-S-25-600-e
Order No
E80002-P104-A409-X-7600
Machine Description 3
Line Design 4
Placement Heads 5
Head Modularity
Placement Accuracy
Component Range
12-Nozzle Collect & Place Head for High Speed
Component Placement
6-Nozzle Collect & Place Head for High-Speed Large
Component Placement
Nozzle Changer
PCB Conveyor 10
Single Conveyor
Dual Conveyor
Ceramic Substrate Centering (Option)
PCB Bar Code for Production-Controlled Manufacturing
(Option)
Component Supply 14
Changeover Table
Tape Feeder
Bulk Case Feeder
Stick Magazine Feeder
Guard for Feeder Locations
Matrix Tray Changer (Option)
Component Bar Code Scanner for Set-Up and Refill Check
(Option)
SIPLACE External Set-Up Station (Option)
Vision Sensor Technology 21
PCB Vision Module
PCB Position Recognition
Bad Board Recognition
Position Recognition of Feeder
Algorithms to determine the X-/Y-Position and the Rotation
Angle of Components
Standard Component Vision Modules for 12- and 6-Nozzle
Collect & Place Head
Machine Criteria 26
Placement Accuracy
Placement Reliability
Mapping (Option)
SIPLACE Software Architecture 29
Line Computer / Station Computer
High Speed SMD Placement System
SIPLACE S-25 HM