ND S1 Brochure.pdf - 第2页
Specifications: Model number ND S1 System projects specification Check System camera 5 m ega-pixel Lighting system Surrounded RGB FOV 48mm*40mm(20 μm) Processing time per frame <0.7s Check content area,volume,height,s…
Features:
1. Software system:
Operation system: Windows 7 Ultimate 64bit
1) Identification system:
Feature: 3D raster camera(double is optional)
Operate interface: Graphical programming, easy to operate, Chinese and English system switch
over
Interface: 2D AND and 3D truecolor image
MARK: Can choose 2 common mark point
2) Programme: Support gerber, CAD input, offline and manual program
3) SPC
Offline SPC: Support
SPC Report: Anytime Report
Control Graphic: Volume, area, height, offset
Export content: Excel, image(jpg, bmp)
2. Control system
1) Host: Industry control PC, intel 6 core cpu, 16GDDR, 1T
2) Displayer: 22 inch lcd widescreen display
Solder Paste Inspection Machine ND S1
Specifications:
Model number
ND S1
System
projects
specification
Check
System
camera
5 mega-pixel
Lighting system
Surrounded RGB
FOV
48mm*40mm(20 μm)
Processing time per frame
<0.7s
Check content
area,volume,height,shape,offset, continuous tin
electrodeposit
Shortage types
Tin statues(less, more,offset,out of line,height)
Max test height
400 μm
Solder scope
0.2mm×0.2mm~12mm×12mm
Height detection precision
1 μm
Repeatedly(volume,area,
height)
<1 μm@3sigma
Repeatedly and
reproducibility
<10%
Software
System
Operation system
Windows 7 Ultimate 64bit
Identific
ation
system
feature
3d raster camera(double is optional)
Operate interface
Graphical programming, easy to operate, Chinese and
English system switch over
Interface
2D AND and 3D true color image
MARK
Can choose 2 common mark point
programme
Support gerber,CAD input,offline and manual program
SPC
Offline spc
support
Spc report
Anytime report
Control graphic
Volume, area, height, offset
Export content
Excel, image(jpg,bmp)
Mechanical
Pcb transfer system
900±30mm
Substrate fixing mode:edge lock plate,automatic board
in and out and adjustment system, match SMEMA
Min pcb size
50mm×50mm
Max pcb size
500mm×460mm
PCB thickness
0.6mm~6mm
plate edge clearance
up： 3mm down： 3mm
transfer speed
1500mm/s(MAX)
Plate bending compensation
<2mm
X
、
Y
platform
Driver equipment
AC servo motor system
Setting accuracy
<1 μm
Moving speed
600mm/s
Control
System
host
Industry control PC, intel 6 core cpu,16GDDR,1T
Displayer
22 inch lcd widescreen display
Other
Parameter
External sizes
L (1090mm) ×W (1290mm)×H (1534mm) Not including
light,keypad,display
Machine weight
750kg
Power requires
AC220V±10%,50/60HZ,1.8kVA
Compressed air requirement
4~6Kg/cm²
Environment temperature
10~40℃
Relative humidity
30-80%RH
Highlights:
High speed can achieve maximum throughput 3D raster projection head
High precision mechanical platform Supports Offline SPC
Plate bending compensation solution Man-machine interface with easy operation