FuzionSC_Platform_brochure.pdf - 第2页

Build better. Build more. Spend less. Empowered by know-how Universal Instruments’ solutions include not only best-in-class equipment, but also proven in-depth process knowledge, applica- tion expertise and integration e…

www.uic.com

email: universal@uic.com

AMERICAS

Tel. 1-800-432-2607 or

Tel. +1-607-779-7522

CHINA, SHENZHEN

Tel. +86-755-2685-9108

CHINA, SHANGHAI

Tel. +86-21-6495-2100

EUROPE

Tel. +421-2-4930-96-60

subject to change.

MC-6454A 08/19

semiconductor performance

at surface mount speeds

Build better. Build more. Spend less.

Empowered by know-how

Universal Instruments’ solutions include not only best-in-class

equipment, but also proven in-depth process knowledge, applica-

tion expertise and integration experience to ensure your equipment

delivers your product at the highest possible yield and reliability, and

at the lowest possible cost.

Achieve best accuracy at highest speed over largest area

• ±10µm accuracy, < 3µm placement repeatability

• High throughput up to 10K cph Advanced Packaging Assembly

Solutions (APAS), 30K cph standard applications

• Populate the largest panels to process higher die counts

All-in-one platform for any assembly challenge

• Place broad range of die and components on one platform

• Placement capability from ANY feeding option

• Place on ANY substrate

Leverage process expertise and years of experience

• Advanced Process Lab focused on realizing rapid product

introduction, maximizing yield and optimizing reliability

• APAS applications since 1990; thousands of platforms, all markets

System-level solutions for next-generation challenges

Bringing high productivity to advanced packaging assembly

Traditional advanced assembly methods can no longer keep pace with today’s

higher-volume, higher-complexity production demands. Universal’s FuzionSC™

Platform oers a complete solution to today’s most challenging semiconductor

packaging applications by combining extreme accuracy with surface mount

performance. FuzionSC is the ideal solution for Flip Chip, System-in-Package (SiP),

2.5D, Package-on-Package (PoP), Wafer and Panel-level Fan-out, Embedded, and

Conformal Shielding applications.

With the largest component range of any advanced packaging pick-and-place solu-

tion, FuzionSC has the inherent capability to assemble a complete module on a single

machine, placing both die and passives precisely and seamlessly. This enables you to

move quickly and cost-eectively to your next product while getting to market faster,

minimizing operating costs and enjoying long-term asset protection.

Building Better

New Benchmark

Achieve best accuracy at highest speed over largest area

±10µm accuracy, < 3µm placement repeatability

• High-stiness frame, within 1µm from corner to corner

• Proprietary VRM linear motor: thermally stable, dual-drive, 1µm resolution

• Optimized motion control for sub-micron repeatability

• Environmental thermal management

• High-resolution optics, mapping and calibration routines

• Two-step precise global ducial nd

• Look before pick

• Top Alignment Process (TAP)

• Accuracy Management System (AMS) validates accuracy while in production

• AOI feedback and placement adjustment

High throughput up to 10K cph APAS, 30K cph standard applications

• Dual-drive VRM linear motor with fast motion response and settling times

• Available dual-beam congurations with multiple heads

• Multiple heads/spindles reduces number of cycles from pick to place

• Gang pick and gang dip maximizes cycle time eciency

• On-the-y vision with large eld of view

Populate the largest panels to process higher die counts

• Traditional platforms follows wafer form factor, limiting assembly size

• Populate panels without sacricing speed or accuracy

• Achieve a 7X processing increase!

300mm

~71K mm

625mm x 813mm

~508K mm

All-in-one platform for any assembly challenge

Place broad range of die and components on one platform

• High-accuracy ip chip, bare die, surface mount, and odd-form

• Full range of die: 0.5–40mm, 0.05–4mm thick

• Advanced vision algorithms, programmable lighting, bump recognition down to 20µm

• SMT: 01005–55mm square and up to 25mm tall

• Supports solder/ux dipping and pin transfer

• 150–5000g placement force (lower-force options available), dynamic force control

Placement capability from ANY feeding option

• Wafer, tray, tape, tube, and bulk

• Supports wafers up to 300mm and multiple die part numbers

• Tape: 4 x 1mm (01005) up to 56mm

• Matrix tray: supports stationary and automated stackable feeders (2x2, 4x4, JEDEC)

All-Around Performer

Place on ANY substrate

• Thin, thick, narrow, and large assembly area

• Substrates, wafers, lead frames, ceramics, glass, ex, and laminates

• Reel-to-reel systems

Bare Die

Flip Chip

Chip

LED

Tant Cap

SOIC

TSOP

DPAK

QFP

BGA

PLCC

CSP

Electrolytic Cap

Connectors

CCGA

BNGA

Odd-Form

Pin-in-Paste