DEK R2R Technical Specification.pdf - 第2页
2 DEK R2R Machine Standar d Configuration Standard Configuration Specification Machine Alignment Capability >2 .0 C pk @ +/- 25 µm, (± 6 Sigma) # Process Alignment Capability >2 .0 C pk @ +/- 25µm, (± 6 Sigma) # Th…
DEK R2R Platform
Technical Specification
Part No. 192763 – Issue 08 – August 2014
2
DEK R2R
Machine Standard Configuration
Standard Configuration
Specification
Machine Alignment Capability
>2.0 C
pk
@ +/- 25µm, (±6 Sigma) #
Process Alignment Capability
>2.0 C
pk
@ +/- 25µm, (±6 Sigma) #
Throughput
500 mm/min*
Substrate Handling Capability (Reel Width)
Min 100mm to Max 508mm **
Maximum Printable Area
480mm (X) x 508mm (Y)**
Substrate Thickness
0.1mm (minimum) ***
Image Print Gap
1.5mm (minimum) ****
Transport System
R2R transportation system capable of handling continuous & flexible substrate
Operator Interface
Colour TFT touch screen display, keyboard and trackball with DEK Instinctiv
TM
software.
Operating System
Windows XP
Camera
Green Digital Camera using IEEE 1394 interface
Multi-channel. LED lighting. FOV 5mm x 8.5mm
Camera Positioning
Rotary motors and encoders with 4 micron resolution
Substrate Fixture
Extended board clamps
Screen Mount
C Chase
Stencil Loading
Automatic stencil loader incorporating squeegee drip tray
Stencil Alignment
Motorised via actuators X, Y, and Theta
Under Screen Cleaning (USC)
Blue Under Stencil cleaner, (300mm, 400mm or 520mm)
Fully programmable with wet/dry/vacuum wipe with external solvent tank
Vacuum Assist for USC
On board vacuum unit, 35 litres/sec airflow
Statistical Process Control
On board, reported via operator interface (QC-CALC)
Temperature / Humidity Sensor
Monitoring of the process environment
ISCAN Machine Control
Motion control using CAN BUS network
Squeegee
Clamped double trailing edge squeegee (1 set included)
Tooling
Specific media tooling designed to accommodate customer’s product
(1 specific tooling set included)
Machine Interface
Upline and Downline FMI included
Documentation
Hard copy manuals compromising:
Operator, Installation, Electrical & Pneumatic Drawings.
On board technical manuals and tutorials supporting operator functions.
DVD containing manuals and tutorials
#DEK’s machine accuracy and repeatability qualification is certified by 3rd party and undertaken using production environment process variables. Print Speeds, Print Pressures,
Rising Table and Camera Movements are included in the process capability figure.
*Based upon: 250mm Index Length, 25mm Print Speed and 5kg Pressure.
**Please contact ASM Product Manager to discuss product and process further.
***0.02mm substrate has been cycled through the R2R machine without printing. Please contact DEK Product Manager to discuss product and process further.
****Dependant on material thickness and flexibility.
3
DEK R2R
R
Machine Standard Configuration
Process Parameters
Specification
Print Pressure
0kg to 20kg
Print Speed
2mm/sec to 150mm/sec*
Print Gap
0mm to 6mm
Substrate Separation
Speed: 0.1mm/sec to 20mm/sec
Distance: 0mm to 3mm
Index Length
50mm to 480mm
Print Modes
Print / Print
Print / Flood
Flood / Print
Transport Direction
Left to Right
*For faster print speed capabilities please contact ASM Product Manager to discuss product and process further.
Vision
Specification
Vision System
Cognex
Fiducial Recognition
Automatic fiducial teach and find incorporating 0.1mm fiducial capture
Fiducials
2 or 3
Fiducial Types
Synthetic fiducial library or unique pattern recognition
Fiducial Size
0.1mm to 3mm
Fiducial Error Recovery
Auto lighting adjustment
Auto fiducial search
Camera Lighting
Software controlled programmable LED lighting
Operating Environment
Specification
Temperature
10° to 35° C (50° to 95° F)
Humidity
30% to 70% relative humidity (non-condensing)
ESD Capability
Black transport belt and guides with surface resistivity if greater than 10
6
ohms.
Chase
Specification
Screen Frame Size
(W) 736mm x 736mm x (H) 38mm
(W) 29” x (L) 29” x (H) 1.5
Screen Frame Thickness
25mm to 38mm (1” to 1.5”)
Image Position
Front
Centre
Custom