Momentum_II_BTB.pdf - 第3页
Precision and Performance in a Compact and Flexible Configuration Space-saving Configuration without Compromise The MPM Momentum ® II BTB is a space-saving 200 mm shorter than the standard Momentum. Configured for Back-t…
Momentum® II
BTB gives Momentum® II
users greater flexibility
in line configuration.
Now you can leverage
Momentum’s superior print
performance capabilities
into dual lane output with
an overall smaller footprint.
Momentum’s
Patented Technology
• EnclosedFlow™ Print System
• Paste Management System
• EdgeLoc™ Board Clamping
• RapidClean™
• StencilVision™
• Closed-loop
SPI Print Optimizer
• Benchmark™ 5.0
Momentum® II BTB
Get More Throughput with Less Space and Less Investment
Momentum® II BTB features a smaller footprint than the standard
Momentum platform. Back-to-Back configuration allows dual lane
processing for higher throughput without increasing line length or capital
investment. Dual lane provides the flexibility to print multiple products
in a single SMT line, such as top and bottom side, same side, or mother/
daughter boards making the BTB the most flexibile model in the proven
Momentum platform.
With the MPM® Momentum® II BTB, you get all the accuracy and
performance that the proven Momentum platform is known for. Most
of the features and options available for Momentum series printers are
available with the Momentum II BTB. MPM Momentum II BTB printers
are offered in two different throughput configurations for optimum
flexibility in line balancing.
Precision and Performance in a
Compact and Flexible Configuration
Space-saving Configuration without Compromise
The MPM Momentum® II BTB is a space-saving 200 mm shorter than the standard Momentum.
Configured for Back-to-Back (BTB) processing, it enables dual lane processing with two machines,
conserving floor space and creating a shorter manufacturing line length, but without sacrificing
volume or yields. Momentum® II BTB is also designed with all-front access to the entire electrical
system, solvent reservoirs, etc. so that no extra space is required for accessibility between the
machines in BTB setup. MPM Momentum® II BTB printers feature the same ±11 micron alignment
repeatability, with wet print accuracy of ±17 microns @ 6 sigma, Cpk ≥2.0, designed in and
independently verified. MPM Momentum printers are fast, precise, and highly reliable, with
performance unmatched by any other printer in their class.
Optimizing Productivity through Flexibility
Momentum® II BTB optimizes operator utilization rates for dual lane lines, and utilization of
factory floor space. What’s more, individual units can be easily redeployed as needs change.
Available with optional shuttle conveyors.
Momentum® II BTB New Features
¡ Newly designed cover set with larger
window and wider access inside the printer.
¡ Quick release squeegee for faster changeover.
¡ Adjustable stencil shelf
for exibility handling board varieties.
¡ EdgeLoc II and EdgeLoc+
for precise board clamping.
¡ New jar paste dispenser
for increased productivity.
¡ Solder paste roll height monitoring and
paste temperature monitoring
for yield improvement and traceability.
¡ Upgraded Benchmark GUI with
customizable production page and
Quickstart program.
¡ Windows 10 operating system.
Momentum® II BTB
Innovative Standard and Optional Features
NEW Paste Height Monitor
The Paste Height
Monitor is designed to
prevent defects caused
by inadequate volumes
of paste on the stencil.
It combines advanced
software and sensor technology to accurately monitor the
paste bead for volume consistency. Upper and lower limit
roll-height monitoring eliminates insufficient or excess paste
volumes. It is a non-contact solution that can automatically
add more paste to the stencil as it is needed.
NEW Paste Temperature Monitor
Temperature monitoring
ensures proper paste
viscosity to avoid
bridging and voiding.
MPM patent-pending
paste temperature
monitor allows paste
to be measured in the
cartridge or on the
stencil.
NEW Automatic Paste Dispensing System
Dispense for standard
cartridges or choose the
new patent-pending
jar dispenser. Paste
is released in precise,
measured amounts
across the stencil in a
clean, uniform bead. Deposition volumes, frequency and
placement are user programmable.
NEW Quick Release Squeegee
New quick release
squeegee blades makes
changing blades quick
and easy with no tools
required. It takes less
than 30 seconds to
change the blade.
Updated Benchmark™ User Interface
Easy to learn and use for the average operator, MPM’s
Benchmark software is powerful yet intuitive, and facilitates
rapid setup, assists with operational tasks, and makes
changeover quick and
easy. The software
has been upgraded
to Windows 10 and
new production tools
and new Quickstart
programming to make it
even easier to use.
NEW EdgeLoc™ Board Clamping
The EdgeLoc system
uses a side snugging
technique that removes
the need for top clamps
which interfere with the
PCB to stencil contact.
The result is optimal gasketing and more volumetrically
consistent edge-to-edge prints. With EdgeLoc II, robust
flippers engage to secure the board across the top edge
ensuring board flatness then move out of the way once
the board is firmly gripped from the side. EdgeLoc+ board
clamping can change between edge and top clamping
simply through software.
NEW Adjustable Stencil Shelf
Provides the exibility to handle all stencil sizes with
a simple adjustment of the shelf. The robust design
provides better stability on all stencil sizes.
OpenApps™
MPM’s OpenApps is an open architecture source code which
provides the capability of developing custom interfaces in
support of Industry 4.0 initiatives and communication with
Manufacturing Execution Systems (MES). ITW EAE is the rst
SMT company to oer open software architecture.