SpinSAM Datasheet EN.pdf - 第2页
DS-SpinSAM-150424 For more inf ormation, speak with your Nordson represent ative or c ontact your Nordson re gional oice Nordson T est & Inspection Europe, SEA, Africa ti-sales-eu@nordson.com Nordson T est & Ins…
www.nordson.com/TestInspect
The SpinSAM automated inspection tool delivers high throughput and better sensitivity for accurately locating defects
in wafer based assemblies. Successful applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS,
over-molded wafers and more. Eiciently spin scan up to 4 wafers simultaneously with matched transducers,
wafers can be inspected over the widest frequency range ever achieved in a production environment.
Waterfall transducer provides non-immersion scanning which minimizes risks of
contamination and false bond indications.
Operator-Free Inspection and Analysis
SPINSAM
Acoustic Inspection
DS-SpinSAM-150424
For more information,
speak with your Nordson
representative or contact
your Nordson regional oice
Nordson Test & Inspection
Europe, SEA, Africa
ti-sales-eu@nordson.com
Nordson Test & Inspection
Americas
ti-sales-us@nordson.com
Nordson Test & Inspection
China
ti-sales-cn@nordson.com
Nordson Test & Inspection
Japan
ti-sales-jp@nordson.com
Nordson Test & Inspection
Singapore
ti-sales-eu@nordson.com
Nordson Test & Inspection
Taiwan
ti-sales-tw@nordson.com
Nordson Test & Inspection
Korea
ti-sales-korea@nordson.com
www.nordson.com/TestInspect
Full wafer scans take less
than six minutes
A 100 μm scan (from wafer load to wafer
load) takes less than six minutes. Wafers
also enter and leave the system completely
dry. The SpinSAM also includes a bar coded
reader for recipe verifications and uploads
parameters, triggers calibration requests and
historical records.
High Eiciency
EFEM robot to provide faster exchange of
wafers. Wafers are returned to the FOUP
without requiring any additional alignment.
Fastest data collection
possible 41 WPH @ 100 μm
A key feature of the SpinSAM is the use of a
continuous non-stop scan path. Using four
combined scanners (each capable of 10
WPH @ 100 μm) provides unmatched speed.
Back-to-back jobs can also be scheduled.
Once the last FOUP is loaded, another job
can start.
Uniform, streak free images
Continuous water avoids trapping air
resulting in streak free, uniform images as
well as a clean operation with no moving
parts above the scanner. With minimal water
exposure, wafers are scanned and dried in
place to decrease processing steps.
System
Footprint 2750 W x 2230 D x 2240 H mm
System Weight
Scanner 1700 kg (3747 lbs)
EFEM 900kg (1984 lbs)
Total weight 2900 kg (6363 lbs)
Power Supply
200-240 VAC, 50/60 Hz, 100A Three
Phase 4 or 5 wire
Typical Power
Consumption
Full Load Amps – 50A
Air Supply
CDA 0.62-0.90 MPa Peak 900 L/Min
@ 1000kPa
CDA typical 900 lpm @ 650kPa
DI Water
Temperature: 10-50°C
Resistivity minimum: 5MΩ-cm
Pressure: 0-10-0.50 MPa
Flow 6 L/Min
Water DI typical Single use 4 lpm; Recirculated 1lph
Process Chilled
Water
Temperature: 2 -18°C
Pressure 0.10 - 050MPa
Flow 2-8 L/Min
PCW typical 4 lpm Recirculated only
Recirculate Water
Switch from single use water to
recirculate and reduce water usage
and maintain critical temperatures
using an inline water purification and
filtration system.
Operating
Environment
15 -30°C
Humidity <85% (non-condensing)
Operating System Windows 10 64-bit
Standard Warpage
Handling
+/- 1mm
PCW typical 4 lpm Recirculated only
SPINSAM
Acoustic Inspection
Options
Warpage
Create clear and focused images with
built in handling of warped wafers
+/- 1.5mm warpage.
OCR wafer reader
Read and report laser scribed
wafer ID
200mm
System configured to handle 200mm
wafers
H Series Transducers
H050/050 12.7 mm Focal Length F2 50 MHz
H115/050 12.7 mm Focal Length F2 115MHz
H230/025 6.4mm Focal Length F4 230MHz
H230/0375 9.5 mm Focal Length F2 230MHz
Customized
transducers
For specific applications
available upon request
Wafers Per Hour (300mm standard configuration)
200
μm Pixel Pitch
95 WPH
100
μm Pixel Pitch
41 WPH
50
μm Pixel Pitch
12 WPH
25
μm Pixel Pitch
3 WPH