Horizon 8EE Technical Specification.pdf - 第6页
6 DEK Horiz on 8 EE Machine Footpri nt
5
DEK Horizon 8EE
Machine Productivity Options
Process
Specification
Print Method
Paste roll height monitor
Stencil Frame
VectorGuard®
Stencil Positioning
Semi automatic loading incorporating squeegee drip tray*
Vacuum Assist for Under Stencil Cleaner
Venturi vacuum unit
* Need to remove drip tray when using ProActiv
Transport
Specification
Substrate Support
Vacuum tooling capability
Vacuum tooling sensor
Vacuum cups
Grid-Lok® Tooling
Substrate Fixture
Foil-less clamps
250mm over the top clamps
Snuggers (edge clamping)
Cycle Time Improvement
10 seconds to 8 seconds
Vision
Specification
HawkEye®750 Functionality
Enabled
Software & Communications
Specification
Statistical Process Control
On board, reported via operator interface (QC-CALC)
Handling & Cleaner Options
Specification
Under Stencil Cleaning
Blue large board cleaner (600mm)
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y) – Long Board Option
Data Capture
Specification
Product Data Capture
ProDEK closed loop
Other
Specification
MMI
Left hand side
6
DEK Horizon 8EE
Machine Footprint
7
DEK Horizon 8EE
Disclaimer
In line with ASMAS Group policy of continual improvement, this specification is periodically up-issued to reflect the latest DEK platform
enhancements and it is provided with an issue state, which is displayed on the front page.
Please note the following:
• This information is provided in good faith; it is believed to be accurate and sufficient for the intended purpose
• This information remains the property of ASMAS Group
• ASMAS Group are not liable for the consequences of applying this information
• ASMAS Group are free to alter this information without notice
The legal form of this notice can be read at http://www.asm-smt.com/disclaimer