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A-Series Hybrid Memor y : Chip and Memor y IC shooting A single machine solution Guaranteed placement quality , y ear after y ear : • Machine accuracy verifi cation ser vices • Placement force verifi cation ser vices Accur…
Reduce your DRAM, DDR and SSD production costs
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Date of release: February 2012. 9498.389.0071.1
ASIA-PACIFIC
Assembléon Asia Ltd.
T: + 852 2167 1000
EUROPE
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T: +31 40 272 3000
THE AMERICAS
Assembléon America Inc.
T: +1 770 751 4420
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Single machine solution for combined high speed chip and memory IC shooting
•
Up to 121,000 cph (IPC 9850) chip placement speeds
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Up to 48,000 cph (IPC 9850) memory IC placement speeds
Fully optimized for memory IC’s from tray or tape
•
Up to 6 easy to use tray stackers for a total of up to 180 thin Jedec trays
•
Trolleys for fast switch between tray and tape when supply from changes
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A-Series Hybrid
About Assembléon
Assembléon is a global provider of smart solutions for the electronics assembly
industry. Founded by Royal Philips Electronics in the mid eighties, the company
has more than 30 years of experience in component placement. Assembléon
uniquely uses parallel placement technology for industry leading results in quality
and accuracy. Its products are highly acclaimed by critical industries like the
automotive,telecom, computing, aerospace, semiconductor and embedded
components in substrate manufacturing. Assembléon now brings the benefi ts of
parallel placement into the world of memory module manufacturing.
Memory
Technical specifi cations
Maximum output per hour for 165 kcph (121 kcph IPC 9850) 99 kcph (79 kcph IPC 9850)
passive components
Maximum Memory IC speed (IPC 9850) 48 kcph 48 kcph
Placement quality < 1 dpm < 1 dpm
Placement accuracy CpK>1 35 micron for chips 35 micron for chips
30 micron for memory IC’s 30 micron for memory IC’s
Minimum component size 0.4 x 0.2 mm (01005) 0.4 x 0.2 mm (01005)
Maximum component size 45 x 45 mm (1.77 x 1.77”) 45 x 45 mm (1.77 x 1.77”)
Maximum component height 10.5 mm (0.41”) 10.5 mm (0.41”)
Programmable placement force 1.5 to 8 N 1.5 to 8 N
Maximum board size:
Standard 515 x 390 mm (20.28 x 15.35”) 475 x 390 mm (18.7 x 15.35”)
Optional 800 x 457 mm (31.5 x 18”) 800 x 457 mm (31.5 x 18”)
Minimum board size:
Standard 50 x 50 mm (2 x 2”) 50 x 50 mm (2 x 2”)
Optional 50 x 25 mm (2 x 1”) 50 x 25 mm (2 x 1”)
Transport direction Left to right (optional: right to left) Left to right (optional: right to left)
Board thickness ≥ 0.3 mm ≥ 0.3 mm
Average power consumption 3 kVA 2.5 kVA
Average air consumption per head 10 Nl/min 10 Nl/min
Max. tape feeding positions:
Single lane feeders 130 76
Twin tape feeders 260 156
Feeding options Tape, tray, re-use Tape, tray, re-use
Data interfaces CAMX CAMX
Footprint excl. feeders (LxW) 3,720 x 1,705 mm (146.46 x 67.13”) 2,760 x 1,705 mm (108.66 x 67.13”)
AX-501 Hybrid
AX-301 Hybrid
A-Series Hybrid Memory
: Chip and Memory IC shooting
A single machine solution
Guaranteed placement quality, year after year:
•
Machine accuracy verifi cation services
•
Placement force verifi cation services
Accuracy 25 microns
CpK > 1.0
IC shooting
•
Max. board size
515 x 390 mm
•
Board thickness
from 0.3 mm
Re-use feeder
•
Reduce your cost of
rejects
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Correct and re-use your
rejected components
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Production not interrupted
With memory module prices being under constant price
pressure or when demanding the best quality memory
devices, the A-Series Hybrid Memory brings you IC
placements at chip shooting speed with the highest quality
and effi ciency at the lowest costs per placement.
•
Per robot: 1 head and 1 nozzle for guaranteed full process
control of a single component
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Up to 3 parallel working twin robots for IC shooting speeds
up to 48,000 cph (IPC 9850)
•
Up to 20 parallel working compact robots for chip
placement rates of up to 121,000 cph (IPC 9850)
Unique fl exibility and effi ciency
Service & support solutions
Flexible output on same footprint
•
Simply replace 1 standard by 2 compact robots
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Avoid under or over capacity in a fl uctuating market demand
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Rent extra capacity for saving 20% on initial investments
Package fl exibility
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Trolleys allow easy switch between tray and tape when
memory devices change package type
•
Trolley exchanges within 60 seconds
High speed and effi cient tray shooting
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Extremely easy and friendly operator handling
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Replenishes up to 30 Jedec trays in less than a minute
without interrupting production
0402/0201/01005
without cracking
Tray stacking
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Up to 30 jedec trays
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Replenishment on the fl y
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High speed tray feeding
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Easy to use
Tape and reel
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High speed chip and
memory IC feeding
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Supports tape splicing
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Intelligent feeder
This machine consumes only
70 Nl/min compressed air
Save energy
•
Line performance monitoring
and line optimization services
MES solutions
The A-Series Hybrid memory solution has unique parallel placement process
capabilities and high accuracy robots, combining the requirements of high speed
chip and IC placement into one single machine solution at the highest possible
placement quality.
•
Standard and compact
robots
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Scaleable from 30 kcph
to 121 kcph (IPC 9850)
Chip Shooting robots
*at 2000 components per panel
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Scaleable memory IC
shooting speeds from
16 kcph to 48 kcph
Twin IC shooting robots
Placement force
Accuracy
SSD DDR3