RV-2-3DH_SPE_EN.pdf - 第9页

R V -2- 3D H PRODUCT SPEC I FI CA TIONS 6 The maxim um payl oad o f the board is 4 kg. When y ou con v ey a boar d o f weight more than 1 kg, you lower the c onv eyance speed, and pl ea se use it . Let me carry i n a boa…

RV-2-3DH PRODUCT SPECIFICATIONS

4. Applicable Boards

 Applicable board specification

Item Specification

External board dimensions

■ Standard head

L 50 mm × W 50 mm to L 410 mm × W 300 mm

■ Longer-sized Specifications

L 50 mm × W 50 mm to L 630 mm × W 300 mm

■ Marking specification (RV - 2 - 3 DH only)

L 50 mm × W 50 mm to L 330 mm × W 250 mm

Board thickness 0.3 to 8.0 mm

Maximum board height

Standard Top side: 40 mm Bottom side: 70 mm

* 20 to 60 mm can be accommodated as the height on the top side by

changing the height of lighting.

(Selectable at the time of purchase)

Payload

4.0 kg or less (The transfer speed is changed variably according to the

payload.)

* Please consult us if the weight exceeds the limit.

∗ The maximum board dimensions need to be changed according to the board weight and shape.

Loading a board having a part whose height exceeds 40 mm on the top side or 70 mm on the bottom

side may damage the board or cause the device to malfunction. The above dimensions provide

clearances from the shafts and lights when boards are transferred and inspected.

If a part or solder is installed/applied within 3 mm of either end of the board in the transfer direction, the

board cannot be transferred or positioned.

Board W

Board L

Transfer rail part

RV-2-3DH PRODUCT SPECIFICATIONS

The maximum payload of the board is 4 kg. When you convey a board of weight more than 1 kg, you

lower the conveyance speed, and please use it. Let me carry in a board after cooling off enough so that

board surface temperature is as follows 60℃ Celsius after reflowing it. It causes belt damage, the loser

when it cannot cool off enough. (exchange indication 0.5 years)

Marking can not be used with inspection data with Longer-sized selection enabled for Longer-sized and

marking unit combination equipment. Marking can be used only in normal board mode.

RV-2-3DH PRODUCT SPECIFICATIONS

5. Inspection Function Specification

Item Specification

Types of boards that can be

inspected

After solder printing, before reflow, after reflow

Parts that can be inspected

Square chips of 0402 or more, cylindrical chips, tantalum capacitors,

aluminum chip capacitors, transistors, SOP/QFPs (0.3 mm or greater

pitch), connectors, leads of discrete parts

* If resolution 5.0 μm / pixel, Square chip 0201 or more, SOP / QFP (0.2

mm or more pitches)

Inspection item

Lack of parts, offset, polarity, front-side back, no solder, bridge, solder

amount, disconnected insertion part, etc