BF-3Si SPI_CN.pdf - 第2页
BF-3Si E-mailsakicorpsakicorp.com Saki Corporation Saki Corporation Headquarters Ogawa Building, 4-14-7, Nakanobu, Shinagawa-ku, T okyo, apan, 142-0053 TEL +81-3-5788-6280 F A +81-3-5788-6295 lobal etwork http…
BF-3Si
Insufcient solder
Bridge
Smearing
Excess solder
Swelling
No solder
Black & White Image
Color Image
Solder Paste Inspectiion based on
3D data
Compatibility with Saki BF-2 AOI Systems
Data Analysis
2D and 3D Inspection
High Speed and Precision Inspection System
Closed Loop Function
BF-3Si
The user-friendly Saki's BF2 operating system allows network
compatibility with all Saki BF2 AOI series.
The newly developed Phase Measurement Prophilometer Technology
with LCOS(Liquid Crystal On Silicon) ensures high inspection
repeatability. The height and volume inspection repeatability is rated
+/- 3µm, with a Gauge Repeatability and Reproducibility(GR&R) of less
than 10%. BF-3Si is one of the world's fastest solder paste inspection
systems in 2 projection solder paste inspection systems.
Not only measuring the shape solder paste, BF-3Si enables to feed back
inspection data to front-end process which extremely minimize solder
defects to the post-process.
Advanced analysis capability is achieved by integrating original,
state-of-the-art Saki 3D measurement technology. This allows
the system to easily rotate, enlarge, and reduce images.
Process-control chart can be shown in real time, and past data can
be shown by the hour.
BF-3Si inspects PCB with a combination of 2D images and 3D
images. The coordinates adjustment is corrected by detecting
fiducial mark from 2D images and the height information is accurately
calculated by zero point adjustment of each PAD from 3D images.
In-Line 3D Solder Paste Inspection System
BF-SPIder-L
PAT.P
BF-3Si
E-mailsakicorpsakicorp.com
Saki CorporationSaki Corporation
Headquarters
Ogawa Building, 4-14-7, Nakanobu,
Shinagawa-ku, Tokyo, apan, 142-0053
TEL +81-3-5788-6280 FA +81-3-5788-6295
lobal etwork
http//www.sakicorp.com
Product Specications
Model Name BF-3Si
Horizontal Resolution 18
μ
m
Vertical Resolution 0.33
μ
m
Repeatability 2
μ
m （3 σ） or less
PCB Size 50 x 60 - 460 x 510 mm
PCB Thickness 0.6 - 3.2 mm
PCB Warp +/- 2 mm
PCB Clearance Top ： 40 mm
Bottom ： 40 mm
Inspection Categories Height, Volume, Area, Bridge, Shift, Form
Camera(Image capture)
CMOS Area Camera
Lighting
2-way Projection System with Multistage Ring Light
FOV Size 36 mm × 36 mm
Inspection Speed 33.7
5 cm
2
/s
PCB Load/Unload Time Approx. 5 sec.
Conveyor Method Flat Belt Transfer
Conveyor Height 900 +/-20 mm
Width Adjustment Automatic
Operating System Windows 7 English Version
System Requirements
Electric Power Single Phase ～ 200 to 240V +/-10%,
50/60Hz
Power Consumption 1.3kVA
Air Requirement 0.5 MPa, 5 L/min (ANR)
Usage Environment 15
°
C (59
°F)
to 30
°
C (86
°F)
/
15 to 80% RH (Non-condensing)
Dimensions
W x D x H
1040 x 1440 x 1470 mm
(40.94 x 56.69 x 57.87 in.)
Weight Approx. 870 kg (1,918 lbs)
Optional Systems
BF2-Editor
BF2-Monitor
S
900 mm
(766 mm) 470 mm
1440 mm
1040 mm
(1100 mm)
2000 mm
1470 mm
S
External View
©
2014 Saki Corporation. All Rights Reserved.
Specifications contained in this brochure are subject to change without notice.
This brochure was made out in May 2014.
SJ264DCF1-02E