Essemtec_-_Archerfish_All-in-One_Production_Brochure_EN.pdf - 第2页
UNIQUE SOL UTION FOR ELE C TRONIC PRODUC TION Solder Paste Jetting, Glue Jetting, Pick and Plac e & other pr ocess solutions c ombined on a single platform. l Placement, solder paste & other jet dispensing l Up t…
UNIQUE SOLUTION FOR
ELECTRONIC PRODUCTION
Solder Paste Jetting, Glue Jetting & Pick and Place
UNIQUE SOLUTION FOR
ELECTRONIC PRODUCTION
Solder Paste Jetting, Glue Jetting, Pick and Place & other
process solutions combined on a single platform.
l
Placement, solder paste & other jet dispensing
l
Up to 4 placement-axes and 3 dispense processes
l
Monitoring sizes, volume & weight of jetted dots
l
Process control adjustment and dot stabilisation
l
Improve time to market/ NPI/ Immediate repair
l
No waiting for stencil, process variation adaptation
l
Jetting in cavities, Pin in paste jetting
l
PCB design freedom - all programmable
l
2.5D placement and dispensing applications
l
Gerber ile conversion and CAD data import
l
One click production ile generator
l
Real time visualisation
l
Connectivity SECS/GEM, iTac, OIC, Hermes
l
One space saving platform for all processes
l
Decrease of costs (no additional printer or stencils)
l
Zero changeover time
combined all-in-one.
process control
.
highest flexibility.
software for all processes.
cost optimization.
COMPATIBLE WITH ALL
ADVANCED ESSEMTEC
PLATFORMS
EXPANSION IN ANY DIRECTION.
ADAPTIVE FROM PROTOTYPING
TO HIGH SPEED PRODUCTION.
Dynamic Shockwave Technology. Adaptable for
different jettable pastes (T4-7). Adaptable for special
applications (nozzle, tappet, temperature etc.).
Adaptable with needles for deep cavities. Super fast
Plug n‘ Play change of luidic and settings.
The systems grow synchronously with the custo-
mer’s requirements for performance and processes.
Conigurable heads with 1-4 placement-axes. Multi
lexible feeder concept for up to 280 lanes. Largest
component spectrum 008004 up to 80 x 80 mm.
Wide range of dispensing applications such as
SMT Glue, LED Encapsulation, Silver Epoxy, Dam
and Fill, Underill, Cavity Fill, 2.5D dispensing and
more. Process parameters can be changed freely
and optimized for any particular process.
optional.
solder paste jetting. pick and place. other dispensing solutions.
Glue Jet Solder Paste Time Pressure Screw Volume
Valve Jet Valve Valve Valve Valve
Full process control & traceabilty meeting automotive standards, Adaptation &
stabilisation, Integration & datatransfer of existing pick&place machines as Diplan,
UniCam, Cogiscan etc., Cleaning Station, High Precision Scale, Heat-/Vacuum Tables
Media Heating Needle and jet heating system
Level Detection Automatic syringe level detection
Integrated Inspection 2D defect detection for dispensing & pick and place
Increase Boardsize Table extension to increase the processable board size