Condenso_Series.pdf - 第10页

10 Condenso series Condenso X C Optimal r e sults with the smallest footprint The Conde nsoXC is a spac e-sav ing, power ful sy stem for labor ator y app licati ons, s mall seri es pr oduct ion a nd prot o- typ ing. Exa…

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Condensovacuumtechnologyisusedinawiderangeofprocesses.Oxidationisreduced
fordryingandadhesiveprocesses,andsolderedjointreliabilityisincreasedduring
reowsolderingbyreducingvoids.
Condensovacuumtechnology
for void-free results
›
Pre-vacuum:
-Preventionofoxidation,drying(solderpaste,adhesives)
-HomogeneousGalden-gas-distribution(3-dimensionalsoldering)
-Microwaveplasma(pre-cleaning)
›
Vacuumduringreowsoldering:Improvedwetting
›
Vacuumafterreowsoldering:Avoidingvoids
Surfacecontacts
upto99%
Improvedllingof
microviasand
THD-solderjoints
Minimumofvoids
(particularly important on
power electronics)
Improved
wetting
WithVacuumWithoutVacuum
Condenso series | Vacuum
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Condenso series
CondensoXC
Optimal results with the smallest footprint
The CondensoXC is a space-saving, powerful system for
laboratory applications, small series production and proto-
typing.Exactprolingbymeansoftheinjectionprincipleand
the option of soldering under an inert atmosphere provides
the optimal soldering results. Void-free soldering can also be
carried out easily with the vacuum option, which increases
thereliabilityofassembliessignicantly.
With a footprint of just 2.3 m², this system is specially de-
signed for small series and is also ideal for prototype produc-
tion. As a batch system, it can be used flexibly, irrespective of
the production environment.
Stableprocessforreliableresults
 Processchamberforamaximumassemblysizeof500x540mm(WxL)
Cameraforprocessobservation
(optional)
Patentiertedinjektionprinziple
Vacuumprocess
(optional)
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LoadingConcept
The possibilities of CondensoXC
Handling
Gentle cooling
Frontloadingwithpre-assembledproductcarriers
The CondensoXC is manually loaded with pre-as-
sembled product carriers from the front on the
operator’s side. In this way, the assemblies can
be easily placed on and removed from the inter-
changeable product carriers. The product carrier
is on a rail system to ensure full access to the
working area. Assemblies up to 500 x 540 mm
(W x L) can be placed on the product carriers.
Gentlecoolingprocessesbyconvection
After the soldering process, the assembly is
cooled by convection to the required temperature.
After cooling the bulkhead opens automatically
and the product carrier can be completely pulled
out on a rail for easy unloading. In addition, a
water-cooled cooling zone is optionally available
to enhance the cooling capacity.
3.
1. 4.
2.
1. Loading
2. Soldering/Vacuum
3. Cooling
4. Unloading
cooling
gentle