vt-x750_q331-e1-03.pdf - 第2页
2 times Inspection speed VT -X700 70.9 seconds Inspection speed VT-X750 34.8 seconds * or more * Exclude load and unload Components BGA × 2 LGA × 2 QFP × 4 Connector × 2 Chip, etc. × 1,500 160 mm Voi d No n- wet BG A , 3…
7591925684
393
5271550557
2000
1645
900
789 168
680 439
PL
Front Rail Fixed
Position
FL
522
1550
Keyboard stroke 104
Keyboard height 870
Monitor stroke 165
Monitor center1349
VT-X750
In-line Full Inspection System
Dimensions
VT-X750
Specifications
Hardware configuration /
Function
EtherNet / IP™ is the trademark of ODVA.
EtherCAT
®
is registered trademark and patented technology, licensed by Beckhoff Automation GmbH, Germany.
[ Unit : mm
]
Item
Description
Model
Type
Inspection object
Inspection items
Method
Resolution
X-ray source
X-ray detector
Size
Weight
Component clearance
Warpage
Footprint
Weight
Conveyor height
Power supply
Rated power
X-ray leakage
Air supply
Safety standard
Imaging
system
PCBA
Main body
VT-X
750
VT-X
750
-XL
H-FR
6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program)
3, 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program)
10,15,20,25,30µm/pixel
(selectable in the inspection program)
FR
Micro-fucus closed tube
Flat panel detector
900 ±20 mm
Single phase, 200 to 240 VAC, 50/60 Hz
Less than 0.5 μSv/h
0.4 to 0.6 Mpa
BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices, POP, Press-fit CN, etc.
Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications)
3D-slice imaging by using parallel CT
H-FR
50x50
～
610x515mm (2x2 to 24x20 inch), Thickness
：
0.4
～
5.0mm (0.4
～
3.0mm in 3μm resolution) 100x50
～
1200x610mm, Thickness
：
0.4
～
15.0mm
Less than 4.0 kg (with component mounted) Less than 15kg
Top:Less than 40 mm, Bottom:less than 39 mm
Top: Less than 40 mm, Bottom: Less than 40 mm
Less than 2.0 mm (Less than 1.0
ｍｍ
in 3μm resolution)
1,550(W) x 1,925(D) x 1,645(H) mm
2,180
(
W)×2,510
(
D)×1,735
(
H)mm
Less than 3.0 mm
Approx. 3,100kg Approx. 5,350kg
2.4kVA 2.58kVA
CE, SEMI, NFPA, FDA
Under Acquiring
CE, SEMI, NFPA, FDA *Under Acquiring
VT-X700
VT-X750
VT-X700
VT-X750
2,180
mm
1,550
mm
1,925
mm
2,500
mm
1,720
mm
1,645
mm
45
%
Footprint
5.45 m²
2.99 m²
VT-X700
VT-X750
reduced
630
mm
In-line length
shorter
High-speed automated X-ray CT inspection system
VT-X750
N E
W
Cat. No. Q331-E1-03
1017(0917)
2
times
Inspection speed
VT-X700
70.9 seconds
Inspection speed
VT-X750
34.8
seconds *
or more
* Exclude load and unload
Components
BGA
×
2
LGA
×
2
QFP
×
4
Connector
×
2
Chip, etc.
×
1,500
160
mm
Void
Non-wet
BGA, 3D rendering image
240
mm
The VT-X750 improves upon previous Omron 3D-CT technology making it the fastest X-Ray inspection system to date *¹.
The automated inspection logic has been improved for many parts such as IC heal fillets, stacked devices (PoP), through hole
components, press-fit connectors, and other bottom terminated parts.
Increasing automated inspection speed and expanding inspection logic enables full, in-line inspection coverage by 3D-CT
method.
*1. By an internal investigation in October, 2020.
In-line full inspection coverage
OMRON’s unique 3D-CT reconstruction algorithms provide excellent solder shape recognition
and defect detection.
Quantitative analysis allows for an automated inspection process which minimizes the risk of
escapes while providing fast and repeatable operation.
Dense and dual sided board
design can provide challenges
for X-Ray inspection.
However, Omron's 3D-CT tech-
nology can overcome such
design restraints.
Design
constraint free
Visualize solder joint strength
8 FOV’s
Visualize
solder joint
strength
S
P
S
C
Innovation to maximize ROI.
VT-X750
Best Quality at the Minimum Q-cost.
S
S
Security
Safety
To achieve “Zero down time” during the SMT production process,
OMRON supports machine operation globally by preventative
maintenance, emergency support and machine monitor with
remote access.
Zero down time
This dynamic approach enables a comprehensive analysis
using Omron AI with quantitative decision making based on
conventional inspection standards for OK / NG judgment.
(3D cross-sectional display functionality has been integrated into the screen,
making the inspection criteria settings easier to understand.)
* Simulation pertains to specific parts.
Patent Pending
Omron Patent
AI
Dynamic Approach using Omron AI
Operation safety
• High speed imaging technology
The VT-X750 provides the shortest X-ray exposure time without
sacrificing inspection image quality.
• X-ray source at the bottom
By locating the X-ray source under the board, both exposure
and dosage is physically reduced to the more important
devices mounted on the top.
• Low energy-cut lter
Standard equipped filter reduces X-ray exposure further
minimizing damage concerns to memory products.
• Ultratrace leakage dose
Exposure dosage to operator is less than 0.18 mSv *² per a year. This is less
than one-tenth compared with that from natural environment.
• OMRON’s safety components
The VT-X750 complies with CE, SEMI S2/S8 and
other safety standards by utilizing OMRON’s latest
generation of safety controller and light curtain
products.
• X-ray shielding box, made in Japan
The machine shielding quality is ensured through
three surveys (twice at the factory in Japan and once on site).
Reduce radiation exposure
*2. Teaching operation for one hour per day.0.5μSv/h x 1h/day x 365days = 0.183mSv
Production line
Cloud
Remote access
via mobile
communication
network
Monitoring
Machine
record
Maintenance
Remote
support
Trouble shooting
Root cause
analysis
Remote Support
Monitor the machine's status and eliminate production down time.
Industrial
open network
Machine control
open network
Criteria setting by Auto-Judge reduces
the dependency on a dedicated programmer
Omron AI simulates the optimum tact and exposure dosage for
each part and automatically determines the corresponding
conditions for the X-ray inspection process.
Patent Pending
Accelerated simulation for
production preparation
Omron AI assists in the quick creation of new programs. Along
with automated program generation using CAD data, Omron AI
automatically tunes the parts library using inspection result data.
Faster creation of new programs
P
C
Productivity
Capability
2
times
Inspection speed
VT-X700
70.9 seconds
Inspection speed
VT-X750
34.8
seconds *
or more
* Exclude load and unload
Components
BGA
×
2
LGA
×
2
QFP
×
4
Connector
×
2
Chip, etc.
×
1,500
160
mm
Void
Non-wet
BGA, 3D rendering image
240
mm
The VT-X750 improves upon previous Omron 3D-CT technology making it the fastest X-Ray inspection system to date *¹.
The automated inspection logic has been improved for many parts such as IC heal fillets, stacked devices (PoP), through hole
components, press-fit connectors, and other bottom terminated parts.
Increasing automated inspection speed and expanding inspection logic enables full, in-line inspection coverage by 3D-CT
method.
*1. By an internal investigation in October, 2020.
In-line full inspection coverage
OMRON’s unique 3D-CT reconstruction algorithms provide excellent solder shape recognition
and defect detection.
Quantitative analysis allows for an automated inspection process which minimizes the risk of
escapes while providing fast and repeatable operation.
Dense and dual sided board
design can provide challenges
for X-Ray inspection.
However, Omron's 3D-CT tech-
nology can overcome such
design restraints.
Design
constraint free
Visualize solder joint strength
8 FOV’s
Visualize
solder joint
strength
S
P
S
C
Innovation to maximize ROI.
VT-X750
Best Quality at the Minimum Q-cost.
S
S
Security
Safety
To achieve “Zero down time” during the SMT production process,
OMRON supports machine operation globally by preventative
maintenance, emergency support and machine monitor with
remote access.
Zero down time
This dynamic approach enables a comprehensive analysis
using Omron AI with quantitative decision making based on
conventional inspection standards for OK / NG judgment.
(3D cross-sectional display functionality has been integrated into the screen,
making the inspection criteria settings easier to understand.)
* Simulation pertains to specific parts.
Patent Pending
Omron Patent
AI
Dynamic Approach using Omron AI
Operation safety
• High speed imaging technology
The VT-X750 provides the shortest X-ray exposure time without
sacrificing inspection image quality.
• X-ray source at the bottom
By locating the X-ray source under the board, both exposure
and dosage is physically reduced to the more important
devices mounted on the top.
• Low energy-cut lter
Standard equipped filter reduces X-ray exposure further
minimizing damage concerns to memory products.
• Ultratrace leakage dose
Exposure dosage to operator is less than 0.18 mSv *² per a year. This is less
than one-tenth compared with that from natural environment.
• OMRON’s safety components
The VT-X750 complies with CE, SEMI S2/S8 and
other safety standards by utilizing OMRON’s latest
generation of safety controller and light curtain
products.
• X-ray shielding box, made in Japan
The machine shielding quality is ensured through
three surveys (twice at the factory in Japan and once on site).
Reduce radiation exposure
*2. Teaching operation for one hour per day.0.5μSv/h x 1h/day x 365days = 0.183mSv
Production line
Cloud
Remote access
via mobile
communication
network
Monitoring
Machine
record
Maintenance
Remote
support
Trouble shooting
Root cause
analysis
Remote Support
Monitor the machine's status and eliminate production down time.
Industrial
open network
Machine control
open network
Criteria setting by Auto-Judge reduces
the dependency on a dedicated programmer
Omron AI simulates the optimum tact and exposure dosage for
each part and automatically determines the corresponding
conditions for the X-ray inspection process.
Patent Pending
Accelerated simulation for
production preparation
Omron AI assists in the quick creation of new programs. Along
with automated program generation using CAD data, Omron AI
automatically tunes the parts library using inspection result data.
Faster creation of new programs
P
C
Productivity
Capability