Introduction-Chinese(SM320).pdf - 第37页
1-5 Chip 0402 Chip 0603 Chip 1005 QFP 52 0.65 P QFP100 0.5 P QFP168 0.3 P QFP256 0.4 P QFP304 0.5 P BGA256 1.0 P BGA □ 12 0.5 P BGA □ 17 0.75 P BGA □ 42 1.27 P , Connector 75mm 1.27 P XY : ± 0.05 θ : ± 5.0 XY …
Samsung Component Placer SM320 Introduction
1-4
FOV25mm
FOV15mm FOV10mm
Chips
1005~22mm 0603 ~ 12.0mm 0402 ~ 7.0mm
IC,
Connector
22.0mm , Lead
Pitch : 0.5mm
12.0mm , Lead
Pitch : 0.5mm
7.0mm , Lead
Pitch : 0.4mm
BGA
, Ball
Pitch : 0.75mm
12.0mm , Ball
Pitch : 0.75mm
7.0mm , Ball
Pitch : 0.5mm
1.2.2.2. Stage Vision
1-3.
(Vision
)
Components
区
分
准
FOV35mm
FOV20mm FOV45mm
Chips 1005~17mm
IC,
Connector
32.0mm , Lead
Pitch : 0.4mm
17.0mm , Lead
Pitch : 0.3mm
42.0mm , Lead
Pitch : 0.5mm
BGA
32.0mm , Ball
Pitch : 0.75mm
17.0mm , Ball
Pitch : 0.5mm
42.0mm , Ball
Pitch : 1.0mm
MFOV()54.0mmBGA75.0mm
ConnectorPitch
(Local Agent)
1.2.3.
1-4.
Specification (mm)
1-5
Chip 0402
Chip 0603
Chip 1005
QFP 52 0.65 P
QFP100 0.5 P
QFP168 0.3 P
QFP256 0.4 P
QFP304 0.5 P
BGA256 1.0 P
BGA □12 0.5 P
BGA □17 0.75 P
BGA □42 1.27 P,
Connector 75mm 1.27 P
XY : ±0.05 θ : ±5.0
XY : ±0.08 θ : ±5.0
XY : ±0.10 θ : ±5.0
XY : ±0.08 θ : ±0.5
XY : ±0.06 θ : ±0.25
XY : ±0.04 θ : ±0.2
XY : ±0.05 θ : ±0.1
XY : ±0.06 θ : ±0.1
XY : ±0.12 θ : ±0.4
XY : ±0.07 θ : ±0.3
XY : ±0.10 θ : ±0.5
XY : ±0.10 θ : ±0.3
XY : ±0.18 θ : ±
0.25
1.2.4.
PCB
Nozzle
1.2.4.1.
: 1608 chip
Samsung Component Placer SM320 Introduction
1-6
IPC
1.2.4.1.1.
1-5.
SM320
Chip 18500 CPH (1608)
16000 CPH (SOP16)
IPC(Pick Up)
5500 CPH (QFP100)
IC
5500 CPH (BGA256)
IPC(Pick Up)
(1 msec ).
PCB
C/S Center( - STS)