ConnX-ELITE-August.pdf - 第2页
For sales, service and manufacturing locations, visit www.kns.com © 2017 Kulicke & Sof fa Industries Inc. Specifications may change without notice. The ConnX ELITE logo, ConnX ELITE, K&S logo and Kulicke & So…
ConnX
PS
ELITETM is the latest High Speed Wire Bonder in the industry leading
Power Series. Updated motion control systems and the Quick Suite
TM
processes deliver maximum productivity and simplified process optimization.
ConnX
ELITE is the new standard in interconnection for Discrete and Low Pin
Count packages.
The Power Series of
Semiconductor Assembly
Equipment from K&S has
established itself as the
leading equipment. These
products reinforce two key
principles, the Powerful
performance built into
these products, and the
Power of K&S as the
Technology Leader of its
market space for more
than six decades.
The Power Series has set
new standards for
performance, productivity,
upgradeability, and ease of
use. The technical success
and customer acceptance
of the Power Series of
products since their
introduction are evidence
of the K&S continued
commitment for providing
products with the Power to
handle not only today’s
most challenging
packaging applications,
but also tomorrow’s.
From K&S —
the most Powerful name in
Package Assembly
Features
▪ Bondable Area of 56 mm x 80 mm
▪ 3.0 µm accuracy @ 3 sigma
▪ New High Speed X-Y-Z motion control and
vision systems
▪ New proprietary Quick Suite provides robust
process performance at maximum UPH
▪ Interactive Programmable Look Ahead Vision
for ease of set-up for maximum throughput
▪ Complete Illumination System with automatic
adjustment for PRS robustness
▪ Single 2X magnification optics
▪ Auto SHTL and NSOL Recovery for improved
MTBA performance
▪ Auto-BITS self-teach and optimization
▪ Dual Frequency transducer allows two
selectable frequencies for each bond
▪ Options
◦ Bonding Ag-Alloy, PdCu and Cu wire
◦ 2X/4x Dual Magnification Optics
◦ Cover Gas Kit for Bare Copper Leadframe
Wire Bonding Solutions
◦ Field upgrade path to ConnX
PS
ELITETM LA
Automatic Wire Bonder
For sales, service and manufacturing locations, visit www.kns.com
© 2017 Kulicke & Soffa Industries Inc. Specifications may change without notice. The ConnX ELITE logo,
ConnX ELITE, K&S logo and Kulicke & Soffa are trademarks of Kulicke & Soffa Industries, Inc.
BB-027-08/2017
Power Series
Wire Bonders include:
User interface that retains
the familiar K&S look and
feel; minimal training
needed to become familiar
with new performance
enhancing and productivity
increasing features
CE Certification
Semi E10 Compliance for
Run Time Statistics and
MTBA / MTBF calculations
Upgradeability with
Power Pack Upgrade Kits
Programmable Power
Supply System to bond
through factory power
spikes or dips
Industry leading K&S Tray
and Gripper Magazine
Handling system
Full KNet PLUS
compatibility and readiness
WIRE BONDING CAPABILITY
Bonding Area
X Axis: 56 mm
Y Axis: 80 mm
Total Bond Placement Accuracy
3.0 μm @ 3 sigma
Pattern Recognition/Optics/Vision
Progressive Scan Vision Engine
CCD Video Camera
- 2X Magnification Optics
- 2X/4X Dual Magnification Optics (Optional)
Standard User Processes
Power Series is compatible with all K&S legacy bonder
processes
Premium Processes
Quick Suite Processes
Power Series Xpress Loop Processes
Power Series Advanced Loop
Power Series Low Loop
SSB Suite, 25K Wires
LOOPING CAPABILITY (with 25.4 μm wire diameter)
Maximum Wire Length
7.6 mm
Minimum Loop Height
100 μm Standard & Worked Loops
70 μm Folded & Reverse Loops
50 μm Ultra-low Loop with Power Series Low Loop
Wire Sway
Wire length < 2.54 mm: 25 μm @ 3 sigma
Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma
CONVERSION TIMES
Same Leadframe Type: < 4 min
(Heat block insert & clamp changes, program load from disk)
Different Leadframe Type: < 8 min
(Leadframe width & length changes, magazine size change,
heat block insert & clamp change, program load from disk)
KNET PLUS ASSEMBLY EQUIPMENT NETWORK
KNet PLUS improves efficiency and productivity, by
monitoring equipment status in real-time. It collects data and
controls process programs locally or from anywhere on a
customer’s network. Contact your K&S Sales Representative
to learn more.
MATERIAL HANDLING CAPABILITY
Package/Leadframe Dimensions
Length: 63 to 300 mm
Width: 15 to 92 mm
(L/F smaller than 25 mm will require
optional Narrow Leadframe Kit)
Thickness: 0.10 to 0.9 mm
(L/F thicker than 0.9mm will require
optional Flat Boat Kit)
Die Pad Downset: Up to 2.3 mm
Magazine Dimensions
Width: 20 to 98 mm
Length: 70 to 305 mm
(Magazine shorter than 127 mm will require
optional Short Magazine Handler kit)
Height: 50 to 178 mm
Slot Pitch: 1.27 to 25 mm
Max. Weight: 5.22 kg
MAN-MACHINE INTERFACE
Monitor
17” color LED LCD display
Durable Control Panel
Function keys and dedicated buttons, and
user-friendly mouse
Compatibility
Maxµm Series bond programs are upwardly
compatible with Power Series Bonders
Industry-Recognized User Interface
Simple pull-down menus. Color-overlays of wire
groups for easy programming and teach
FACILITY REQUIREMENTS
Minimum Air Pressure
3.52 kg/sq cm (50 psi)
Nominal Air Consumption (flow rate)
185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
Input Voltage
Standard
200 - 240 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Optional
100 - 115 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Power Consumption
1.5 KVA (nominal), 2.6 KVA (max.)
Footprint
Base machine with MHS
889 mm wide x 990 mm deep (35” x 39”)
Weight (estimated)
Machine 556 kg (1226 lbs)
Machine & Crate 670 kg (1477 lbs)
Automatic Wire Bonder