Brochure_GoReflowV1_17.pdf - 第3页

Minimum Costs of Ownership: Good for the Environment and for Y our Budget A flux management system which is integrated in the peak and cooling area ensures the lowest possible maintenance requirements and thus maximum ma…

• Compact machine technology for small and medium-

sized production series.

• High number of heating zones, exclusively with full

convection, to guarantee perfect soldering results.

• Efficient and homogeneous energy transfer with opti-

mized process gas circulation.

• Flux management system ensures minimum main-

tenance requirements.

• Low costs of ownership.

• High process reliability.

• Inline integration with matching interfaces.

• Unbeatable price-performance ratio.

• Two basic systems are available:

- GoReflow 1.8:

with five heating zones and 1850 mm heated area

- GoReflow 2.3:

with seven heating zones and 2350 mm heated area

SEHO GoReflow:

The Powerful Soldering System for Small to

Medium-Sized Production Series

With a heating zone length of 1850 mm or 2350 mm the

convection reflow soldering systems GoReflow 1.8 and

GoReflow 2.3 are ideally suited for small to medium-sized

production series.

The machines are not only featured with an outstanding

attractive design, above all the GoReflow systems convince

with their well-engineered concept and excellent soldering

results.

The GoReflow systems are characterized by flexible applica-

tion for single- or double-sided reflow processes, in high-tem-

perature processes and for curing adhesives and underfills.

A Small Machine ... But Great Performance

G O R E F L O W

The Process Area:

High Flexibility is Guaranteed

Five respectively seven heating zones and an average

working speed of 0.40 - 0.55 m/min. for the GoReflow 1.8 and

0.55 - 0.70 m/min. for the GoReflow 2.3 provide maximum

flexibility in temperature profiling, particularly for the lead-free

soldering process.

The GoReflow systems are designed for soldering in ambient

atmosphere. A high volume of circulated process gas, which

is generated with axial fans, specially adapted slot nozzles

and a re-circulation of the process gas on the sides, ensure a

very homogeneous heat distribution over the complete trans-

port width at simultaneously low flow velocities.

Thus, a very good heat transfer to the assemblies is realized

so that the set temperatures of the oven can remain on a

lower level.

This helps a lot to fulfill today’s requirements concerning the

narrow process window of the lead-free soldering process: all

the components will be soldered whereas the temperature

impact on the components is reduced significantly.

For special applications requiring nitrogen, the peak area can

be inerted.

The GoReflow systems are equipped with a fan cooling unit,

circulating ambient air, which is used for cooling of the

assemblies after the reflow process. Horizontal slot nozzles

ensure a directed air flow and thus an effective cooling of the

boards.

Minimum Costs of Ownership:

Good for the Environment and for Your Budget

A flux management system which is integrated in the peak

and cooling area ensures the lowest possible maintenance

requirements and thus maximum machine availability. The

process gas thereby is sucked off the process area and

directed through a stainless steel filter. Flux residues are

collected in a PE plastic bottle and therefore are easy and

environmental-friendly to dispose.

The very efficient insulation of the process chamber as well as

the well-engineered axial fan concept do not only ensure

stable temperature conditions during the process. Moreover,

they guarantee an extremely low heat loss and thus lowest

possible energy costs.

The average energy consumption during operation is only

8 kW for the GoReflow systems!

The Conveyor System:

Flexible and Reliable

Depending on the production requirements there is a choice

of different conveyor concepts available for the GoReflow

systems: a belt conveyor, a chain conveyor or a combination

of belt and chain conveyor.

Thus, assemblies with a maximum working width of up to

410 mm can be processed absolutely reliable.

The chain conveyor system is particularly featured with its

high parallelism. Maximum reliability is ensured by stable

guidings and the compensation of temperature-related ex-

pansions.

Width adjustment is made electrically via switches.

Systems with chain conveyor, of course, are available with

center support which may be positioned horizontally, using a

switch at the machine entrance, and which can be lowered.

Thus, warpage of thermally sensitive assemblies is avoided.

This special chain center support features a very small

surface to ensure that no heat will be withdrawn from the

assemblies to be soldered.

The Control System:

Versatile and User-Friendly

The micro processor control of the GoReflow systems is pro-

grammed for process reliability and system control. It offers all

technical features of a mass production unit. A touch display

guarantees the machine operation in a simple and ergonomic

manner.

Via USB interface, machine and process data may be recor-

ded easily, and sensors at the inlet and outlet for pass-through

control ensure high reliability.

Of course, the GoReflow systems also may be integrated into

a fully automated production line. Communication with pre-

ceding or subsequent machines is made via a SMEMA inter-

face.

Small machine - great performance:

SEHO GoReflow

Soldering is our Passion

G O R E F L O W

Technical Data and Machine Options

Technical changes without notice.

Headquarters Germany

SEHO Systems GmbH

Frankenstrasse 7 - 11

97892 Kreuzwertheim

Germany

Phone +49 (0) 93 42-889-0

Fax +49 (0) 93 42-889-200

E-Mail info@seho.de

Website www.seho.de

Americas

SEHO North America, Inc.

1445 Jamike Avenue Suite # 1

Erlanger, KY 41018

USA

Phone +1-859-371-7346

Fax +1-859-282-6718

E-Mail sehona@sehona.com

Website www.sehona.com