Nexus_en.pdf - 第2页
V oid-free soldering with vacuum Ideal for a great v ariety of applications The Nexus guarantees high-quality results with a reow process using contact heat in a vacuum. It thus meets the highest requirements of power e…
www.rehm-group.com
Contact Soldering with
and without vacuum
Nexus
Contact soldering
up to
400 °C
Void-free soldering with vacuum
Ideal for a great variety of applications
The Nexus guarantees high-quality results with a reow process using contact heat in
a vacuum. It thus meets the highest requirements of power electronics, in the advanced
packaging and semiconductor area.
The Nexus contact soldering system is best suited for void-free soldering of different
devices (e.g. IGBT) on DCB substrates. The combining of materials that are normally highly
dissimilar takes place in the vacuum at a reduced pressure at temperatures up to 400 °C
(optional 450 °C). The reduced pressure thereby helps to minimise oxidation on the compo-
nents and on the solder itself. The transfer of heat is via heat contact surfaces or optional
by radiation. The Nexus system is predominantly used in small and medium production
lines as well as in the eld of laboratory.
Contact
Soldering
Reliable and flexible
3
Oxide and void-free joint surface between chip and interconnected device
Integrated or separate cleaning and de-scaling processes
Simple proling and fast heating and cooling rates
Assembly under high level of vacuum
Integration of drying and degassing processes
Optimum dispersal of waste heat
Reliable contact soldering
The Nexus makes it possible!
The Rehm Thermal Systems vacuum soldering oven is ex-
ceptionally well suited for production facilities which pursue
flux-free and void-free soldering in various inert gases (N
2
,
H
2
, N
2
/H
2
95/5).
The use of lead-free and lead-containing pastes and pre-
forms with/without flux is also possible. Miniaturization in
the elds of advanced packaging and semiconductors can
be further developed by means of vacuum technology.