Advanced 3D Solder Paste Inspection (SPI) Microelectronics - V310i SPI.pdf - 第2页
Maximum Board Size (L x W) 470mmx500mm (18.5"x19.6") Minimum Board Size (L x W) 50mmx50mm (2"x2") Maximum Board Thickness 4mm (0.15") Minimum Board Thickness 0.2mm (0.00787") Maximum PCB W e…
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advanced 3d solder paste inspection (spi) v310i microelectronics
Specifications
Features (solder-paste-inspection-system-api-v310i-series-features.php)
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V310i Optimus (for Advanced Packaging and Microelectronics) : Advanced 3D Solder Paste
Inspection (SPI)
The new 3D SPI system for advanced packaging and microelectronics is a newly launch solder paste vision platform that
resolve challenging and miniature defects detection with automation & flexibility.
System SPI for Advanced Packaging
Inspection Capabilities Missing, XY Offset, Height, Area, Volume, Bridge and Micro Bridge.
Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection
Board Level Traceability Camera-Read Barcodes; External Barcode Reader Configured
System Hardware 25MP
Operating System Windows 10 (64-bit)
Optical Resolution & FOV Size 22.5mmx22.5mm @ 4.5μm telecentric lens
Inspection Speed 25MP CoaXPress @ 4.5µm Resolution: 7-15cm²/sec
3D Technologies Phase Shift Profilometry’s (PSP) Methodology
Lighting Module Multi-Segment LED Lighting
Board Dimension
Maximum Board Size (L x W) 470mmx500mm (18.5"x19.6")
Minimum Board Size (L x W) 50mmx50mm (2"x2")
Maximum Board Thickness 4mm (0.15")
Minimum Board Thickness 0.2mm (0.00787")
Maximum PCB Weight 3kg
Top Clearance of PCB 10mm
Bottom clearance of PCB 70mm
PCB Edge Clearance 3.5mm
PCB Transport Height 875mm-965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
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