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3D WIRE BOND INSPECTION & METROLOGY
Large Automotive Supplier Selects CyberOptics SQ3000™ Multi-Function
system for 3D Wire Bond Inspection and Metrology
The growing amount of electronics within modern vehicles has made the inspection process for wire bonds
increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed
the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire
bonds and loop heights. After consideration of competitive products, a large global automotive supplier selected
CyberOptics’ SQ3000™ 3D Multi-Function system for inspection and metrology to address their wire bonding
inspection needs.
Challenge
The wire bonds between semiconductor devices are trending
towards micro sizes in current applications. In some cases, there
are hundreds or thousands of terminations on wire bonds,
which can also overlap. These bonds command stringent quality
requirements and must be terminated precisely in order to
produce a functional bond shape. The overall appearance and
quality of the wires is crucial for successful performance—any
damage can inhibit proper functionality of ICs and the systems
powered by ICs. In the automotive sector, this means parts such
as lighting, camera systems, and lidar sensors all rely on the
quality of wire bonds.
Along with the uptick in electronics within vehicles has come the need to package increasingly more features and
capability in any given area, consequently leading to smaller devices and more challenging inspection. Greater
optical resolution is required to produce a high-quality image from which a reliable measurement can be derived.
Automotive suppliers have a responsibility to ensure the functionality and safety of their vehicles, and missteps
in the wire bonding stage of the assembly process can have disastrous consequences in the future, potentially
threatening customers’ safety and leading to recalls costing billions of dollars. One customer, a global automotive
supplier, sought a system to inspect loop height and shape, bonding quality, and bonding position on wires as
small as 80m . This supplier serves large automotive brands with reputations and quality standards to uphold,
and required a reliable system with advanced inspection capabilities.
Continued >
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2021. CyberOptics Corporation. All rights reserved. Specications subject to change without notice. 8030171 Rev A
For more information on CyberOptics products, services, or solutions, visit our website at www.cyberoptics.com.
Solution
CyberOptics provided the SQ3000 with dual high-speed and high-
resolution Multi-Reection Suppression™ (MRS™) sensors. Previously,
there was not a 3D AOI system on the market that could support
the company’s in-line speeds. The supplier had formerly used a
competitor’s products but gradually phased out the systems in favor
of CyberOptics’ solutions. After utilizing both companies’ systems,
the customer found that CyberOptics provided superior resolution
and more advanced software and measurement capabilities for their
application. They now use 100% CyberOptics for their 3D wire bond
and loop height inspection needs.
The SQ3000 oers the resolution and software tools to apply direct
x-y oset and height measurements to wire bonds and loops, in addition
to complete SMT failure detection. The coordinate measurement (CMM)
capability enables the customer to perform many more advanced
metrology-based measurements, resulting in improved quality control
process eciency.
Speed and ease-of-use also add signicant value—CyberCMM™ software
powers coordinate measurement attainment in seconds not hours, and
an intuitive interface with multi-touch and 3D image visualization tools
minimizes time spent in training and operator interaction.
Unique AI (Autonomous Image Interpretation) software speeds
programming and lends the exibility to model real production scenarios
where a measurement is not applicable. AI autonomously performs
pixel-by-pixel image analysis and learns real-world variations; as a result,
operators save time otherwise spent adjusting parameters or tuning algorithms.
Benet Summary
The SQ3000 for 3D AOI provides a multitude of features well suited for bond quality inspection as well as loop
height and loop quality inspection. Advanced optical engineering delivers ultra-high resolution at production
speeds, with industry-leading Multi-Reection Suppression (MRS) sensor technology that meticulously identies
and rejects reections caused by shiny components.
Easy-to-use CyberCMM software reduces training and operation time, while providing direct 3D measurements
and SMT failure detection. With superior measurements, reduced false failures, and quick implementation,
CyberOptics’ SQ3000 Multi-Function system – for AOI, SPI, and CMM – has recognized a signicant ROI and
improved the auto supplier’s yields, processes, as well as its reliability amongst customers.
About CyberOptics
CyberOptics Corporation is a leading global developer and manufacturer of high-precision 3D sensing technology
solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor capital
equipment markets to signicantly improve yields and productivity. By leveraging its leading edge technologies,
the Company has strategically established itself as a global leader in high precision 3D sensors, allowing
CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota,
CyberOptics conducts worldwide operations through its facilities in North America, Asia, and Europe.