Essemtec_-_Archerfish_All-In-One_Solution_EN_2021.pdf - 第2页
UNIQUE SOL UTION FOR ELE C TRONIC PRODUC TION Solder Paste Jet Printing, Glue Jetting, Pick&Plac e and other pr ocess solutions c ombined on a single platform. l Placement, solder paste & other jet dispensing l U…
UNIQUE SOLUTION FOR
ELECTRONIC PRODUCTION
Solder Paste Jet Printing, Glue Jetting and Pick&Place
UNIQUE SOLUTION FOR
ELECTRONIC PRODUCTION
Solder Paste Jet Printing, Glue Jetting, Pick&Place and other
process solutions combined on a single platform.
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Placement, solder paste & other jet dispensing
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Up to 4 placement-axes and 3 dispense processes
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Monitoring sizes, volume & weight of jetted dots
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Process control adjustment and dot stabilisation
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Improve time to market/ NPI/ Immediate repair
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No waiting for stencil, process variation adaptation
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Jetting in cavities, Pin in paste jetting
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PCB design freedom - all programmable
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2.5D placement and dispensing applications
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Gerber ile conversion and CAD data import
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One click production ile generator
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Real time visualisation
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Connectivity SECS/GEM, iTac, OIC, Hermes
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One space saving platform for all processes
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Decrease of costs (no additional printer or stencils)
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Zero changeover time
combined all-in-one.
process control
.
highest flexibility.
software for all processes.
cost optimization.
COMPATIBLE WITH ALL
ADVANCED ESSEMTEC
PLATFORMS
EXPANSION IN ANY DIRECTION.
ADAPTIVE FROM PROTOTYPING
TO HIGH SPEED PRODUCTION.
Dynamic Shockwave Technology. Adaptable for
different jettable pastes (T4-7). Adaptable for special
applications (nozzle, tappet, temperature etc.).
Adaptable with needles for deep cavities. Super fast
Plug n‘ Play change of luidic and settings.
The systems grow synchronously with the custo-
mer’s requirements for performance and processes.
Conigurable heads with 1-4 placement-axes. Multi
lexible feeder concept for up to 280 lanes. Largest
component spectrum 01005 up to 80 x 80 mm.
Wide range of dispensing applications such as
SMT Glue, LED Encapsulation, Silver Epoxy, Dam
and Fill, Underill, Cavity Fill, 2.5D dispensing and
more. Process parameters can be changed freely
and optimized for any particular process.
optional.
solder paste jet printing. pick and place. other dispensing solutions.
Glue Jet Solder Paste Time Pressure Screw Volume
Valve Jet Valve Valve Valve Valve
Full process control & traceabilty meeting automotive standards, Adaptation &
stabilisation, Integration & datatransfer of existing pick&place machines as Diplan,
UniCam, Cogiscan etc., Cleaning Station, High Precision Scale, Heat-/Vacuum Tables
Media Heating Needle and jet heating system
Level Detection Automatic syringe level detection
Tray Slider/ Changer Unique system to increase the amount of trays
Increase Boardsize Table extension to increase the processable board size