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1 2 T urnkey Chemical Supplies • Al&CuPadCleaning • AlandCuPadActivation • ElectrolessNi,Pd,Ag,Cu • ImmersionAu&Ag • CyanideorCyanide-Free • SpecialSolutionsforNi&AgPad  Cleanin…

Advanced Packaging Equipment

Solder Jetting & Laser Bonding

www.pactech.com

1 2

Turnkey Chemical Supplies

• Al&CuPadCleaning

• AlandCuPadActivation

• ElectrolessNi,Pd,Ag,Cu

• ImmersionAu&Ag

• CyanideorCyanide-Free

• SpecialSolutionsforNi&AgPad

 Cleaning/Activation

• Photoresists&Solvents

Our mission is to reshape conventional soldering fundamentals with our contactless and stress-free

solder jetting technology. Our innovation radically supports the manufacturing needs by continuously

evolving into dierent applications.

PacTech – Packaging Technologies

Laser solder jetting technologies since 1995

Wafer Level Packaging

Services

• WaferFrontSidePlating

(electroless plating & electroplating)

• SolderBallAttach

• WaferBacksideMetallization

• WaferRepassivation

• WaferThinning&Dicing

• Otherbackendprocesses

Advanced Packaging

Equipment

• SolderJetting

• SolderReballing

• Soldering&WireBonding

• WaferLevelSolderBalling

• LaserBonding&Assembly

• ElectrolessBumpingLine

• CustomizedEquipmentfor

 Photovoltaic&SolarIndustry

 Assembly

OUR PRODUCTS AND SERVICES

- Laser Solder Jetting

Our laser solder jetting technology is clean, precise, and

exible. The singulation disc will dispense a single solder

ball into the capillary where the laser beam’s thermal ener-

gy melts the solder ball, enabling it to fall onto any solder

position and being reowed immediately. It works with var-

ious solder alloys of dierent melting point and requires no

ux therefore it is clean.

The localized heat and short pulse generated by the laser

assures that minimal thermal stress is applied on the area

beyond the joined surfaces. The single solder ball dispens-

ing mechanism requires no tooling, hence enables exible

soldering location and contactless soldering.

LAPLACE – High Accuracy Placement

and Laser Bonding

Using localized laser heating mechanism, temperature

can be applied selectively in the interconnection areas of

interest without heating up the entire substrate up to the

reow temperature to liquefy and reow an interconnection

of a few microns. With customized bond tool and laser

technology, pick-and-place and assembly reow heating

are accomplished in single step at high accuracy < 5 µm.

Localized heat ensures reliable bonding of large dies while

the in-situ reow supports ultra-small die assembly as

small as 300 µm.

Our unique temperature control mechanism protects

single chip or component from being over-heated and

prevents substrate from warpage and repeating reow

circumstances.

Technology trendsetter in laser solder

jetting over two decades and still growing…

Being the leader in laser solder jetting, our technology has

been introduced into a wide array of applications includ-

ing industrial, medical, automotive, aerospace, and others.

Our innovative specialists have been working closely with

dierent industries to realize new applications and to con-

tribute in future development like we always do.

TEMPERATURE

TIME

Soldering

process

Laser

Capillary

Ball Reservoir

Reowed

solder balls

gas

Bond level

Bond padSubstrate

In-situ Laser Temperature Control & Beam Homogenization

PacTech’s solder jetting technology supports mission in outer space

3 4

High Accuracy Volume Manufacturing

SB² - Jet

Dimension

1262 x 987 x 1845 mm

Workspace

320 x 320 mm

Solder Ball Speed

6 - 8 balls / s

Solder Ball Ø

≥ 40 µm

Accuracy

+/- 3 - 5 µm (1 sigma)

Work Station

Chuck / Tray

Automation

Wafer handler, inline conveyor, JEDEC tray, others

Laser Man. Alignment

–

Laser Auto Alignment ü (3D)

Pattern Recognition

2D Applications

3D Applications

Repair

optional

Products

Wafer pieces, PCB & Flex substrates, single chips, BGAs, CSPs, camera modules,

sensors, Hard Disk Drivers, 3D components, medical applications

Applications Technical Specications

Model

SB²-Jet

SB²-Jet:

Flagship platform of PacTech’s leading edge solder jetting

technology, the SB²-Jet with the high precision gantry is

the most advanced system for automated high-speed se-

quential solder ball attach and laser reow. With accurate,

precise and reliable performance proven in mass volume

production environment, the large working area of this

model is highly exible for a variety of dierent microelec-

tronic substrates and applications.

Hard Disk Drive

Assembly

3D Solder Jetting for

Optoelectronics

A comprehensive version of the SB²-Jet is delivered with

a vision and pattern-recognition system, an after-bump 2D

inspection and an additional repair unit, with optional au-

tomated substrate or wafer handling solution customizable

to support customer-specic products and carriers such

as conveyor, robot or reel-to-reel system, this machine is

ready for in-line production integration.

SB² - M SB² - SM

Dimension

752 x 700 x 1819 mm 1183 x 880 x 1893 mm

Workspace

100 x 100 mm 200 x 200 mm

Solder Ball Speed

3 - 5 balls / s 3 - 5 balls / s

Solder Ball Ø

≥ 100 µm ≥ 60 µm

Accuracy

+/- 15 µm (1sigma) +/- 5 µm (1sigma)

Work Station

Chuck Chuck

Automation

– –

Laser Man. Alignment

ü ü

Laser Auto Alignment

– optional (3D)

Pattern Recognition

optional*

*50 x 100 mm reduced workspace

optional

2D Applications

ü ü

3D Applications

– –

Repair

optional optional

Products

Wafer pieces, substrates,

single chips, BGAs, CSPs, others

Wafer Ø up to 8”, substrates,

single chips, BGAs, CSPs, others

Applications Technical Specications

Model

SB²-SM

SB²-M:

The SB²-M is the smallest available platform in the SB²-se-

ries with ultra small foot print yet sucient work area, being

equipped with semi-automatic solder ball placement, laser

reow and rework functions, it is dedicated to prototyp-

ing and research & development purposes. This model is

commonly used for prototype sample building, reballing,

repair and rework of products.

SB²-SM:

Being a lower cost version of the SB²-Jet without compro-

mising its placement accuracy, the SB²-SM is sequential

solder ball attach and laser reow system that can oper-

ate either in a fully automatic mode or in a semiautomatic

mode. With larger work area than the SB2-M yet relatively

compact foot print than the SB²-Jet, it is ideal for research

& development, prototyping and small volume manufac-

turing.

Prototype Build

Package Rework

Model

SB²-M

Prototype & Rework

SOLDER JETTING SOLDER JETTING