SE3000-DD 3D SPI Brochure EN.pdf - 第2页

2 | SE3000-DD 3D SPI SE3000-DD 3D SPI | 3 Nor dson TES T & INSPEC TION Qualify Y our Design Acous tic Inspection High Speed High Flexibility Automa ted X-r ay Inspection Measuring the Invisible Automa ted X-r ay Metr…

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www.nordson.com/TestInspect
Automated Optical Inspection
SE3000-DD
™
3D SPI
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MRS Sensors
2 | SE3000-DD 3D SPI SE3000-DD 3D SPI | 3
Nordson TEST & INSPECTION
Qualify Your
Design
Acoustic
Inspection
High Speed
High Flexibility
Automated
X-ray Inspection
Measuring the
Invisible
Automated
X-ray Metrology
Making the
Invisible, Visible
Manual
X-ray Inspection
Maximize
Eiciency
X-ray Component
Counting
High Speed
High Resolution
X-ray
Technologies
Improve Your
Yields
Semiconductor
Metrology Sensors
Proprietary Advanced
Technology
Optical Inspection
& Metrology
Test Your
Design
Bondtesters
Exceptional support
from Nordson’s worldwide network
SQ3000
QX600
SQ3000
QX600
SQ3000
QX600
SQ3000
QX600
SQ3000
QX600
SQ3000
QX600
SQ3000
QX600
SQ3000
QX600
Founded in 1954, Nordson Corporation is a market leading
industrial technology company with annual revenues of over
$2.1 billion and more than 7,500 employees worldwide.
Nordson TEST & INSPECTION oers its SMT & Semiconductor customers a
robust product portfolio, including Acoustic, Optical and both Manual
and Automated X-ray Inspection systems, X-ray Component
Counting systems and Semiconductor measurement sensors.
Nordson TEST & INSPECTION is uniquely positioned
to serve its customers with best-in-class precision
technologies, passionate sales and support
teams, global reach, and unmatched
consultative applications expertise.
4 | SE3000-DD 3D SPI SE3000-DD 3D SPI | 5
Feedback, Feed Forward Ready
SE3000 DD fully supports feedback and feed forward
capability with leading Solder Paste Printer and
SMT Mounter vendors respectively. With simple
configuration settings, SE3000 DD gives you the power
to do more with SPI results - optimize printing process,
establish stencil cleaning cycles and fine-tune printer
setup. All this means reduced rework costs, increased
production throughput and improved yields.
Flexibility At Its Best
The SE3000 DD 3D Solder Paste Inspection (SPI) System is an extension of the award-winning SE3000™
3D SPI platform. The dual lane, dual sensor system maximizes flexibility catering to varying PCB widths.
This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting
dierent assemblies and board sizes simultaneously on dierent lanes, or even switching from dual lane to
single lane mode to inspect very large boards.
Not only does the SE3000 DD provide PCB flexibility, it also provides the flexibility to choose two of the same
or two dierent proprietary MRS sensors.
True Measurement, Supreme Quality
Performance at its Best (Accuracy & GR&R)
The SE3000 DD SPI system incorporates the industry leading MRS™ sensor
technology with a finer resolution for the best accuracy, repeatability and
reproducibility - even on the smallest paste deposits.
Combined with the award winning, easy-to-use SPI soware, solder paste
inspection has a new level of precision for the most stringent requirements.
The SE3000 D (dual lane, single sensor) is also available.
Shorter Inspection
Times
Unmatched Accuracy
and Resolution with MRS
Technology
Versatility for Applications
with High Quality
Requirements
All Major Screen Printers CyberOptics
3
350 mm (13.7”)
320 mm (12.5”)
320 mm (12.5”)
510 mm (20”)
510 mm (20”)
(DD)
(D)
(D)
350 mm (13.7”)
(DD)
510 mm (20”)
510 mm (20”)
Dual lane Largeboard
All major
screen
printers.