ab59831-my300lx-specification-april-2022.pdf - 第2页

Specifications MYPr o series MY300LX™ SY S TEM FEA TURES MY300LX On -th e-f ly mo unt ord er optim izati on Vision aut ot each wit h snap-to-grid Autom atic ill umin ation setti ngs Intelligent feeder concept— Agilis Au…

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MYPro series MY300LX
™
pick-and-place
Specifications
April 2022
Specifications MYPro series MY300LX™
SYSTEM FEATURES
MY300LX
On-the-fly mount order optimization
Vision autoteach with snap-to-grid
Automatic illumination settings
Intelligent feeder concept—Agilis
Automatic feeder and component recognition
On-the-fly feeder loading
Dynamic feeder positions
Automatic board stretch compensation
Automatic conveyor width adjustment
Intelligent surface impact control
Tool collision avoidance
Multi-user, multi-tasking system software
Open software interfaces for factory integration
SQL database engine
Programmable light settings fiducial camera
COMPONENT RANGE
HIGH SPEED MOUNTHEAD—MIDAS
Component range
Chip (from 03015), SOIC, PLCC, TSOP, QFP, BGA, flip chip,
odd-shape, surface-mount connectors, through-hole components,
CSP, CCGA, DPAK, Alcap, Tantalum
Component specification
Min: 0.3x0.15mm (0.012x0.006″) (03015)
Max: 140x73x15mm (5.51x2.87x0.59″)
(1) (3)
Max: component weight: 140g
(2)
(1) With 4K vision. Max component size with 2K vision: 140x56x15mm (5.51x2.20x0.59″). Customized tall component capability 22mm (0.86”) available.
(2) Depending on mounthead, mount tool, package, and production altitude.
(3) Components with diagonal larger than 58mm must be presented in the same angle as placed.
HIGH SPEED MOUNTHEAD—HYDRA Z8L
Component range Chip (from 0201), SOT23, SOT223, MELF, SOD, SO14
Component specification
Min: 0.6x0.3mm (0.02x0.01″) (0201)
Max: 8.70x8.70x5.60mm (0.34x0.34x0.22″)
ELECTRICAL VERIFIER (OPTIONAL)
Component range
Resistor, capacitor, unipolar capacitor, diode (forward voltage,
reverse current), Zener diode (reverse voltage), bipolar transistor
(current gain), FET/IGBT (gate threshold voltage). Smallest chip size
1.0x0.5 mm (0.04x0.02″).
PLACEMENT SPEED AND ACCURACY
MY300LX-11/15
Rated speed
(1)
16,000CPH
IPC 9850 chip net throughput
(2, 3)
13,800CPH
IPC 9850 chip tact time
(3)
0.250s
IPC 9850 chip repeatability 3 σ (X, Y, Theta)
(3 , 6)
45µm, 1.8°
IPC 9850 chip accuracy @ Cpk = 1.33 (X, Y, Theta
(5, 7)
75 µm, 2.6°
IPC 9850 fine pitch repeatability 3σ (X, Y, Theta)
(4)
21µm, 0.05°
IPC 9850 fine pitch accuracy @ Cpk = 1.33
(X, Y, Theta)
(4, 5)
35µm, 0.09°
The above specification achieved with a machine configuration including high precision mounthead (Midas),
high speed mounthead (HYDRA Z8L), line scan vision system (LVS), inline conveyor T460 and 15mm
component max height. The IPC 9850 net throughput and accuracy numbers are obtained simultaneously, with
the same machine settings. The rated speed value is obtained under conditions optimized for speed.
(1) Depending on component and application.
(2) According to IPC 9850. Net throughput = (no of partsx3,600)/(board build time+board transfer time).
(3) According to IPC 9850 0402C verification panel.
(4) According to IPC 9850 QFP64/QFP100 verification panel.
(5) According to IPC 9850 Cpk 1.33 = 4σ+offset.
(6) Chip repeatability with high precision head 36μm, 1.5°
(7) Chip accuracy with high precision head, 63μm, 2.2°
FEEDER CAPACITY
8 MM TAPE T460 T640
MY300LX-11 128 112
MY300LX-15 192 176
BOARD HANDLING
INLINE CONVEYOR T460 T640
Maximum board size
460x510 mm (18x20″) 640x510 mm (25x20″)
Minimum board size
70x50mm (2.7x2″) 70x50mm (2.7x2″)
Board thickness range
0.4–6.0mm (0.016–0.24″) 0.4–6.0mm (0.016–0.24″)
Board edge clearance top
3.2mm (0.13″) 3.2mm (0.13″)
Board edge clearance bottom
(1)
3.2mm (0.13″) 3.2mm (0.13″)
Top side clearance (max)
(2)
5.6mm (0.22″) 5.6mm (0.22″)
Bottom side clearance (max)
(3)
32mm (1.25″) 32mm (1.25″)
Maximum board weight 4kg (8.8lbs) 4kg (8.8lbs)
Board transfer height
Conforms to SMEMA standard for board transfer height.
Height adjustable from 880 to 975mm (34.6 to 38.4″).
Operation mode Inline, manual, inline odd-board, left-to-right/right-to-left.
(1) Edge clearance 5.5mm (0.22″) if component taller than 6mm (0.24″). 14.3mm (0.56″) if taller than 19mm (0.75″).
(2) Customized tall component capability 22mm (0.86″) available.
(3) 15mm (0.59″) with support pins.
VISION CAPABILITY
LINESCAN VISION SYSTEM—4K RESOLUTION
Component type Field of View Minimum pitch Minimum lead width
Leaded components
80mm(3.1″)
0.10mm(4mil) 0.05mm(2mil)
Bumped components
80mm(3.1″)
0.15mm(6mil) 0.08mm(3mil)
LINESCAN VISION SYSTEM—2K RESOLUTION
Component type Field of View Minimum pitch Minimum lead width
Leaded components
63mm (2.5″)
0.20mm (8mil) 0.10mm (4mil)
Bumped components
63mm (2.5″)
0.25mm (10mil) 0.13mm (5mil)
AB59831 REV 0003/APRIL 2022
MYCRONIC.COM
SWEDEN
Mycronic AB
PO Box 3141
Nytorpsvägen 9
SE-183 03 Täby
Tel: +46 8 638 52 00
GERMANY
Mycronic GmbH
Tel: +49 89 45 24 24 8-0
UK
Mycronic Ltd.
Tel: +44 1202 723 585
FRANCE
Mycronic S.A.S.
Tel: +33 1 41 80 15 80
NETHERLANDS
Mycronic B.V.
Tel: +31 402 62 06 67
USA
Mycronic Inc.
Tel: +1 978 495 9799
SOUTH KOREA
Mycronic Co. Ltd.
Tel: +82 31 387 5111
CHINA
Mycronic Co., Ltd.
Tel: +86 21 3252 3785/86
SINGAPORE
Mycronic Pte Ltd.
Tel: +65 6281 7997
JAPAN
Mycronic Technologies
Corporation
Tel: +81 42 433 9400
Specifications are subject to change without notice. Mycronic, MYDATA, MYDATA automation and MY; Mycronic 4.0; MYPro, MYPro Line, MY100, MY100e, MY200, MY200HX, MY200DX, MY200SX, MY200LX, MY300, MY300EX, MY300HX, MY300DX,
MY300SX, MY300LX, MY500, MY600, MY600JD, MY600JP, MY600JX, MY700, MY700JD, MY700JP, MY700JX and MYSynergy; Mycronic 4.0; MYSmart, MYC50, MYD10, MYD50, MYT10, MYT50; Mycronic SMD Tower; MYTower; 5, 6, 6+, 7+, 5x, 6x;
ViTECHNOLOGY, VIT; 5K, 5K3D, 8K, 8K3D, 9K, 9K3D; PI, PI Pico, PI Primo; SIGMA Link; HYDRA Speedmount, Midas, ISIC; Agilis, Agilis Linear Magazine (ALM), Agilis Linear Magazine Flex (ALM FLEX), Agilis Stick Magazine (ASM), Agilis Tray Magazine (ATM),
Mycronic Tray Exchanger (TEX), Mycronic Tray Wagon Magazine (TWM); Mycronic Dip Unit (DPU); Mycronic Standard Vision System (SVS), Mycronic Dual Vision System (DVS), Mycronic Linescan Vision System(LVS), Mycronic HYDRA Vision System (HVS);
Mycronic Assembly Process Management (APM) including; JPSys, TPSys, MYLabel, MYPlan, MYCenter, MYTrace, MYCam and FlowLine are registered trademarks or trademarks of Mycronic AB. Mycronic AB is ISO 9001:2015 and ISO 14001:2015 certified.
SOFTWARE
SOFTWARE MODULES (OPTIONAL)
Shared databases
Line mode
PCB ID (2D barcode)
Pre-pick inspection
Barcode software
PRM software
OFFLINE SOFTWARE TOOLS (OPTIONAL)
Data preparation—MYCenter
Optimization and scheduling—MYPlan
Inventory management and kitting—MYCenter
Traceability—MYTrace
Performance monitoring—MYCenter Analysis
MISCELLANEOUS
INSTALLATION REQUIREMENTS
Power requirements
Three phase AC 6.6kVA
(3x2.2kVA)
Power consumption 1.5kW (average)
Voltages
3x200, 210, 220, 230, 240,
250±10%, Y or Delta
Air supply No air required
Noise 70dBA
Air temperature +18 to +35°C (65 to 95°F)
Air humidity <95% RH non condensing
MACHINE WEIGHT
(1)
MY300LX-11 1,600kg (3,500lbs)
MY300LX-15 2,200kg (4,850lbs)
(1) Total machine weight excluding magazines.
DIMENSIONS [mm]
MY300LX-15
2082
1883
1339
1041
1,404.5
1,867
1,325
1,406
81.5
1,438
2,584
113
2,809
1,632
980±5
1,346
167
2082
1883
1339
1041
1,404.5
1,867
1,325
1,406
81.5
1,438
2,584
113
2,809
1,632
980±5
1,346
167
MY300LX-11
2082
1883
1339
1041
1,404.5
1,867
1,325
1,406
81.5
1,438
2,584
113
2,809
1,632
980±5
1,346
167
1632
980 ±5
1346
167
1,765
1,867
1,325
1,406
81.5
1,438
3,304113
3,530