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• • • • V 810 i S2 Series WITH V-ONE INDUSTRIES The smart V810i system that provides the best in class top boar d clearance and industry 4.0 equipped features for quality-assur ed inspection results. WHAT IS V 810 i S2 S…

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810
2
Advanced 3D X-Ray Inspection (AXI)
i
Series
Specification
ViTrox Technologies Sdn. Bhd. [507043-P]
746, Persiaran Cassia Selatan 3, Batu Kawan Industrial Park, 14110 Bandar Cassia, Penang, Malaysia. Tel: [+60] 4 545 9988 Fax: [+60] 4 545 9987 Email: enquiry@vitrox.com
ViTrox Worldwide Sales & Service China Division ViTrox USA (San Jose) ViTrox Technologies GmbH
North America South America Europe Asia Pacific Tel: [+86] 512 6251 9891 Tel: [+1] 970 481 3663 Tel: [+49] 1525 3666666
System
System controller
Operating system
Test Development Environment
User interface
Off-line test development software
CAD conversion tool
Typical test development time
Line Integration
Transport heights
Line communication standard
Barcode readers
Performance Parameters *
Typical image acquisition rate
False Call rate
Minimum features detection capability
Joint pitch
1
Short width
2
Solder thickness
Allowable Panel Characteristics **
Maximum panel size
Minimum panel size
Maximum panel inspectable area
Maximum panel thickness
Minimum panel thickness
Panel warp
Maximum panel weight
Board top clearance
Board bottom clearance
Panel edge clearance
System resolution
100% Press-fit testability
Maximum acceptable panel temperatures
Power and Environmental
Voltage requirement
Air requirement
System footprint (Width X Depth X Height)
Total system weight
Tube Power
Integrated controller with 8 Core Intel Xeon processors
Available in Windows 8 (64 bits)/Windows 10 (64 bits)
Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Optional for off-line PC
Optional software available to translate CAD data to ViTrox’s format
4 hours to 1.5 days to convert raw CAD file and develop application
865 mm - 1025 mm
SMEMA, HERMES
Compatible with most industry standard barcode readers
51.68 cm
2
/sec (8 in
2
/sec) at 19um
500 - 1000 ppm
0.3 mm and above
0.045 mm
0.0127 mm
V810i S2 XXL
660 mm x 965 mm (26"x38")
76 mm x 76 mm (3" x 3" )
654 mm x 965 mm (25.75"x38")
12.7 mm (500 mils)
0.5 mm (20 mils)
Downside < 3.3 mm; Upside < 3.3 mm
15kg
25 mm @ 19 µm resolution
15 mm @ 13 µm resolution
* Calculated from Board Top surface
80 mm
3 mm
19 µm/13 µm
Yes (With PSP2 feature)
40 Deg C
200 – 240 VAC three phase; 380 – 415 VAC three phase wye (± 5) (50Hz or 60Hz)
552kPA (80 - 85 psi) compressed air
2240 mm x 2460 mm x 1980 mm
~5500 kg
130KV and 250 uAmps
Specifications are subject to change.
V810i S2 Series
*Note:
1. Assuming pad width is 50% of pitch.
2. The reported values for minimum feature detection assume that the feature is in a
single plane of focus and that there are no X-ray absorbers in the X-ray path or in the
immediate area of the feature other than those found in a typical multi-layer printed
circuit board.
#2x2 binning camera configuration. Hardware upgrade is required on old system.
**Note:
1. Panels are handled on width edges. Panels with edge cut outs may require the
use of a carrier.
2. Maximum panel size dimensions and weight must include carrier if applicable.
3. Smaller panels are possible with the use of panel carriers.
4. With panels of this thickness, imaging results can be affected by PCBA layout.
5. Measured from the bottom of the panel including a maximum warp.
V810i S2EX
482 mm x 610 mm (19"x24")
76 mm x 76 mm (3" x 3" )
474 mm x 610 mm (18.7"x24")
7 mm (276 mils)
0.5 mm (20 mils)
Downside < 3.3 mm; Upside < 1.5 mm
4.5kg
50 mm @ 23 µm resolution
38 mm @ 19 µm resolution
38 mm @ 10.5 µm# resolution
11 mm @ 11 µm resolution
11 mm @ 6 µm# resolution
* Calculated from Board Top surface
70 mm
3 mm
23µm, 19µm, 11µm, 10.5 µm#, 6µm#
Yes (With PSP2 feature)
40 Deg C
1566 mm x 2145 mm x 1972 mm
~3500 kg
V810i S2 XLT
660 mm x 965 mm (26"x38")
76 mm x 76 mm (3" x 3" )
654 mm x 965 mm (25.75"x38")
12.7 mm (500 mils)
0.5 mm (20 mils)
Downside < 3.3 mm; Upside < 3.3 mm
15kg
50 mm @ 19 µm resolution
31 mm @ 15 µm resolution
13 mm @ 11 µm resolution
31 mm @ 10 µm# resolution
13 mm @ 7.5 µm# resolution
* Calculated from Board Top surface
80 mm
3 mm
19 µm/15 µm /11 µm/10µm#/7.5 µm#
Yes (With PSP2 feature)
40 Deg C
2240 mm x 2460 mm x 1980 mm
~6000 kg
Top View
Back View
Side ViewFront View
www.vitrox.com
[V810i S2 Series] REV04/ 08-2020]
This V810i S2 series image is for reference only, please refer to the actual product.
•
•
•
•
V810i S2 Series WITH V-ONE
INDUSTRIES
The smart V810i system that provides the best in class top board
clearance and industry 4.0 equipped features for quality-assured
inspection results.
WHAT IS V810i S2 Series?
A complete solution for large form factor board.
Rapid programming to support low mix high volume and high mix
low volume inspections.
Advanced defect verification offers quality inspection result.
Smart Factory M2M communication through V-ONE.
Expanded global sales and support coverage.
Recommended by renowned Tier 1 CM and OEM.
BENEFITS
•
•
•
•
•
•
HARDWARE FEATURES
PROGRAMMING FEATURES
Support up to 26 types of extensive industry CAD format.
8 Steps Easy Programming from Scratch to Perfect.
Over 100 robust algorithms threshold and 22 preset joint types for different
production environments.
High Compatibility of Recipe Conversion with minimum effort.
Constant algorithms improvement for Head in Pillow detection.
•
•
•
•
•
COVERAGE
Eligible to various M2M connectivity initiatives such as
IPC-CFX, IPC-HERMES-9852, SECS/GEM, CAMX, REST
and SMEMA.
Certified with ISO 9001: 2015, CE, and TUV, ViTrox’s
products are well designed and manufactured to
deliver reliable and high-quality performance to
fulfill the stringent requirements in various industries
such as Telecommunications, Semiconductor,
Automotive, Medical/ Healthcare, and more.
Consumer
Medical/
Healthcare
Computing
Aerospace
Mobile Devices
Millitary
Industrial
Semiconductor
Others
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Easy ProgrammingCurtain Sensor
Panel In Place (PIP)
Algebraic Reconstruction
Technique (ART)
SOFTWARE FEATURES
V-ONE enabled customizable data analytics feature to help users monitoring process performance and
improving production quality.
API-AXI Linkage Image
Lightning Programming with new interface
design.
X-ray Radiation Monitoring and System Alert to
avoid overexposure of sensitive components.
Algebraic Reconstruction Technique (ART) for
better image quality.
Process & inspection feedback between ViTrox
machine to maximize buyoff effectiveness.
•
•
•
Advanced curtain sensor and outer barrier sensor for
better board detection and protection.
[Only applicable to S2 XLT]
Latest Hybrid Panel in Place (PIP) mechanism for
board edge protection.
[Only applicable to S2 XLT & S2EX]
Multiple Resolution and motorized X-ray tube for
optimum cycle time.
[Only applicable to S2 XLT & S2EX]
Specification
System
System controller
Operating system
Test Development Environment
User interface
Off-line test development software
CAD conversion tool
Typical test development time
Line Integration
Transport heights
Line communication standard
Barcode readers
Performance Parameters *
Typical image acquisition rate
False Call rate
Minimum features detection capability
Joint pitch
1
Short width
2
Solder thickness
Allowable Panel Characteristics **
Maximum panel size
Minimum panel size
Maximum panel inspectable area
Maximum panel thickness
Minimum panel thickness
Panel warp
Maximum panel weight
Board top clearance
Board bottom clearance
Panel edge clearance
System resolution
100% Press-fit testability
Maximum acceptable panel temperatures
Power and Environmental
Voltage requirement
Air requirement
System footprint (Width X Depth X Height)
Total system weight
Tube Power
Integrated controller with 8 Core Intel Xeon processors
Available in Windows 8 (64 bits)/Windows 10 (64 bits)
Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Optional for off-line PC
Optional software available to translate CAD data to ViTrox’s format
4 hours to 1.5 days to convert raw CAD file and develop application
865 mm - 1025 mm
SMEMA, HERMES
Compatible with most industry standard barcode readers
51.68 cm
2
/sec (8 in
2
/sec) at 19um
500 - 1000 ppm
0.3 mm and above
0.045 mm
0.0127 mm
1321mm x 1321mm (52" x 52")
127mm x 127mm (5" x 5")
1321mm x 1301mm (52" x 51.2")
*Dual Stage Inspection with External Rotator
10mm (394 mils)
1.5mm (59 mils)
<2mm downward, 1mm upwards (without PSP), <3mm downward, <1.5mm upwards (with PSP)
25kg
50mm @ 19um
31mm @ 15um
14mm @ 11um
* Calculated from Board Top surface
80 mm
10 mm
19um/15um/11um
Yes (With PSP2 feature)
40 Deg C
200 – 240 VAC three phase; 380 – 415 VAC three phase wye (± 5) (50Hz or 60Hz)
828kPA (120psi) compressed air
3300mm x 3300mm x1990mm
~11000 kg
130KV and 250 uAmps
Specifications are subject to change.
V810i S2 XLW
*Note:
1. Assuming pad width is 50% of pitch.
2. The reported values for minimum feature detection assume that the feature is in a
single plane of focus and that there are no X-ray absorbers in the X-ray path or in the
immediate area of the feature other than those found in a typical multi-layer printed
circuit board.
**Note:
1. Panels are handled on width edges. Panels with edge cut outs may require the
use of a carrier.
2. Maximum panel size dimensions and weight must include carrier if applicable.
3. Smaller panels are possible with the use of panel carriers.
4. With panels of this thickness, imaging results can be affected by PCBA layout.
5. Measured from the bottom of the panel including a maximum warp.
Top ViewBack View
Side ViewFront View
www.vitrox.com
[V810i S2 Series] REV03/ 04-2020]
This V810i S2 series image is for reference only, please refer to the actual product.
ViTrox Technologies Sdn. Bhd. [507043-P]
746, Persiaran Cassia Selatan 3, Batu Kawan Industrial Park, 14110 Bandar Cassia, Penang, Malaysia. Tel: [+60] 4 545 9988 Fax: [+60] 4 545 9987 Email: enquiry@vitrox.com
ViTrox Worldwide Sales & Service China Division ViTrox USA (San Jose) ViTrox Technologies GmbH
North America South America Europe Asia Pacific Tel: [+86] 512 6251 9891 Tel: [+1] 970 481 3663 T
el: [+49] 49 162 6719 461