summitlxi2lr.pdf

Summit S eri es : Summit L Xi Opti m i z ed R ework Pr oc ess for Large PCB Summit S eri es : Summit L Xi Summit S eri es : Summit L Xi CONFIDENCE DELIVERED VJ ELECTRONIX Process Control S olutions TM Unli ke other large…

Summit Series: Summit LXi

Optimized Rework Process for Large PCB

Summit Series: Summit LXi

CONFIDENCE DELIVERED

VJ ELECTRONIX

Process Control Solutions

Unlike other large board systems that are adapted

versions of standard systems, the Summit LXi

platform is the only rework system designed from

the ground up to rework large boards.

The LXi’s new enhanced control system eliminates

the affects of facility variations and supports more

precise calibration, allowing process parameters

to be readily shared between systems in multiple

locations.

Key Features

• Placement - 0.0005” (12µ) mean + 3o

• Top Heater - 2.2kW

• Site Heater - 8.0kW

• Field of View - 80mm

• Max. Board Size - 24”X36” (610mm X 914mm)

• Min. Component Size - 0.001” (25m)

• Compliance - CE

19 Alpha Road, Chelmsford, MA 01824 • (978) 486-4777 • www.vjelectronix.com

Summit LXi

19 Alpha Road, Chelmsford, MA 01824 • (978) 486-4777 • www.vjelectronix.com

Despite the miniaturization achieved with

Surface Mount Technology, increased signal

speeds and functionality require more and more

circuitry to be assembled in close proximity. The

net result is that many components and PCBs

have grown larger and heavier. To satisfy the

Rework requirements of these assemblies, VJ

Electronix offers the Summit LXi Large Board

Automated Rework System.

The Summit LXi is furnished with an X–Y table

and Board Holder that can accommodate a PCB

up to 24” x 36” (610mm x 915mm) and a 8kW

Convection Plenum Bottom Heater for maximum

heat transfer. Increased Top Side and Bottom

Side Clearances, 2.75” (70mm) and 2.0” (51mm)

respectively, and an optical system with an

80mm square Field of View allow very large

components to be handled with ease.

All of the well established unique features such

as Advanced Auto Proﬁ le, Programmable Pick

and Place Force with Component Height Sensing,

Independent Top Heater and Pick-up Tube,

Proprietary Split Imaging together with Precision

Placement capability, Optical/Digital Zoom, and

Automated Data/Event Logging are included.

A variety of optional features such as a Local

(Spot) Bottom Heater, Automatic Solder

Scavenging, and a extra high power 10 kW

Bottom Heater are available to handle the

most challenging applications.

Unequaled Large Board handling capability

together with industry acknowledged standard

features make the Summit LXi the system of

choice for the Rework Area Array Components -

BGA, µBGA, CSP, PoP and SMDs on boards up to

24” x 36”.