2020 DS Xhash Series SMT EN.pdf
X -series SMT setup Flexible Inline AXI Platform Fac eli 2019 X#-series SMT setup The X#-platf orm series is an inline automated X -ray system which c ov ers a wide range of AXI applic ations. It is a exib le platf orm…
X-series
SMT setup
Flexible Inline AXI Platform
Faceli 2019
X#-series
SMT setup
The X#-platform series is an inline automated X-ray system which covers a wide
range of AXI applications. It is a exible platform with very versatile elds of use de-
pending on the application requirements. The SMT setup focuses on components
and solder joints inspection on PCB’s.
The Nordson MATRIX system solutions present a modular inspection concept.
The platforms feature up to 4 advanced technologies in one system: Transmis-
sion X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), O-Axis
technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Tech-
nique).
The X#-series platform is available in the following congurations:
X2# Transmission (2D) + SFT
TM
X2.5# Transmission (2D) + SFT
TM
+ O-Axis (2.5D)
X3# Transmission (2D) + SFT
TM
+ O-Axis (2.5D) + 3D SART
Inspection & Process Software
PC- Station with multi - core processor setup
Windows 10 platform
MIPS 5 Inspection Platform
Advanced algorithm library
CAD import for automatic inspection list generation
Simultaneous Algebraic Reconstruction Technique
(3D SART; X3# only)
Automatic Tree Classication (ATC) for Auto-Rule-Genera-
tion
Oine programming for AXI program generation & simula-
tion, tuning and defect reference catalogue
Verication & Process control
MIPS Verify link with closed loop repair
MIPS Process with real time SPC
Features and Benets
Flexible AXI system for inline setups
Microfocus X-ray tube (sealed tube / maintenance free)
Multiple programmable motion system with servo drives
Digital CMOS atpanel detector
Automatic grey-level and geometrical calibration
Barcode scanner for serial number and product type
selection
Flexible setup for inline pass through or
same-side in/out conguration
Full product traceability
via various Industry 4.0
MES-Interfaces
IPC-CFX ready
Solder Joint
Inspection
PTH Power devices
Cooling plates
X#-series SMT setup
Specications
Applications
Electronic components and solder joint
A unique advanced algorithm library is available for electronic ap-
plications, specically for component and solder-joint inspection
on PCB, hybrid or chip level assembly processes.
All standard SMD and THT/PTH components
BGA & dedicated o-axis head-in-pillow (HIP) algorithm
Comprehensive QFN & gullwing algorithm
Robust solder surface / heatsink void inspection
Pin in paste barel ll measurement
Discrete down to 1005 pitches
For more information,
speak with your
Nordson MATRIX
representative.
Germany/ Headquarters
Feldkirchen (Munich)
+49.89.2000.338.200
info@nordsonmatrix.com
Hungary/ Europe
+36.30.876.5038
hungary@nordsonmatrix.com
Americas
+1.760.930.3301
serviceusa@nordsonmatrix.com
South East Asia
+65.6552.7533
sea@nordsonmatrix.com
China
+86.512.6665.2008
china@nordsonmatrix.com
Japan
+81.3.3599.5920
info@nordsonmatrix.com
Korea
+82.31.736.8321
info@nordsonmatrix.com
Taiwan
+886.963.004.675
cs.taiwan@nordson.com
India
+91 44 4353902
sea@nordsonmatrix.com
Facilities
Dimensions: 1775 mm (H) x 3100 mm (W) x 1760 mm (D)
Adjustable conveyor height (SMEMA) 890 – 980 mm
Weight: 2.800 kg
Safe Operating Temperature: 15° - 28 °C optimal 20° - 25° C
Power Consumption: max. 6 kW
Line Voltage: 400 VAC, 50/60 Hz 3 phase, 16 A/
208 VAC, 50/60 Hz 3 phase, 25 A
Air:
5-7 Bar, < 2 l/min, ltered (30µ), dry, oil free
X-ray Image Chain
X-ray Source (sealed tube)
Energy: SMT Setup
130 kV/40 W
Grey resolution: 14 Bit
CMOS Flatpanel Detector 75 µm pixel size (2,25
MPix)
50 µm pixel size (5 MPix)
Motion System
Multiple axes programmable motion system
Installed axes
x,y (linear drives) sample table
z (servo) magnication
u,v (linear drives) detector movement
Conveyor setup
pass through single lane
in-out same side dual lane
Inspection speed
Transmission (X2, X2.5, X3) up to 3-4 views /s
O-Axis (X2.5, X3) up to 2-3 views /s
3D SART (X3) up to 3 s /FoV
Inspection features
Max. sample size: 510 mm x 400 mm
Max. inspection area: 480 mm x 400 mm
Min. sample size 100 mm x 80 mm
Sample thickness 0,8-10 mm
Max. sample weight: 5 kg
Angle shot capability: up to 40 deg
Resolution down to 3 µm /pix
Assembly clearance
Topside (incl. sample thickness): 100 mm
Bottom side
(excl. sample thickness):
40 mm
Min. edge clearance for clamping: 3 mm
Options
Barcodereader
Low-dose radiation lter
Auto BCR scanning station (x-y gantry)
+49.89.2000.338.200 Phone
+49.89.2000.338.400 Fax
info@nordsonmatrix.com
nordsonmatrix.com
Matrix Technologies GmbH
Kapellenstraße 12
85622 Feldkirchen (Munich)
Germany
Copyright © 2020 Matrix Technologies GmbH
Specication subject to change without further notice
DSB58/01