Viscom_Brochure_iX7059_PCB_XL_en.pdf - 第3页

The iX7059 PCB Inspection XL system inspects ver y long PCBs: up to 1000 mm long by default and up to 1600 mm with external transport tunnel In addition to traditional SMD inspection, the iX7059 PCB Inspection ( XL) also…

When it comes to quality assurance in the production line, cycle

time and inspection coverage play a crucial role. Having 100%

reliable and comprehensive inspection coverage directly impacts

process eciency and ensures consistently high product quality

with zero rejects. A high-precision 3D inline X-ray inspection

solution capable of reliably inspecting hidden solder joints and

complex assemblies with THTs, BGAs, CSPs, QFPs, SSOPs and LEDs

provides optimal rst pass yield results. The innovative 3D X-ray

inspection technology in the iX7059 PCB systems ensures

shorter capture times thanks to a unique dynamic 3D image

acquisition concept and provides excellent 3D slice images by

means of integrated computed tomography – for peerless

measurement precision and maximum throughput rates.

Pioneering Quality Assurance

for Modern Electronics Manufacturing

Complete defect detection on densely populated, thick and even

double-sided PCBs

Smooth handling of very large assemblies such as server boards,

LED applications, semiconductors and 5G electronics

High-precision solder joint inspection, even on extremely small

components and the complex assemblies of high-performance

processors

Measurement of voids in surface soldering to ensure ecient

heat dissipation

Quality inspection on THT solder joints, pin height and degree

of lling, to prevent short circuits

Modern operating software for extremely fast programming and

incredibly simple verication

Service, hotline support and remote maintenance worldwide

SMD component in tombstone position

Voids in a surface solder joint

Not connected BGA solder balls

Void in a THT solder joint

FAST, PRECISE, RELIABLE

The iX7059 PCB Inspection XL system inspects very long PCBs:

up to 1000 mm long by default and up to 1600 mm with

external transport tunnel

In addition to traditional SMD inspection, the iX7059 PCB

Inspection (XL) also provides high-precision, reliable detec-

tion of soldering defects such as head-in-pillow and pores

in BGA and LGA components, voids in surface soldering

well as incorrect ll levels of THT solder joints. This

makes

the iX7059 PCB Inspection (XL) ideal for use in LED lighting,

security technology in the automotive industry, high-end

elecommunications and server technology – anywhere

reliable functionality is absolutely essential.

At the heart of the iX7059 PCB Inspection systems is

CT-based 3D X-ray technology which provides image

recordings at high-speed and high-quality levels. The

combination of a powerful microfocus X-ray tube, state-

of-the-art at panel detector and innovative dynamic

image acquisition produces exact tomographic images

for highest defect detection.

Thanks to its extensive component inspection library, the

new line provides extremely user-friendly and fast pro-

gramming that can be automatically optimized due to the

integrated Viscom verication – a signicant plus when it

comes to creating new inspection programs. The AI-backed

verication technology helps to improve the classication

and releases additional resources. The iX7059 PCB Inspec-

tion

(XL) is the number one choice for ensuring maximum

return on investment and defect-free production of high-

end electronics capable of meeting growing demands.

Defect-free and stable high-end electronics manufacturing

Ensuring complete 3D X-ray inspection in the production

line while at the same time meeting the highest cycle time

requirements is a challenge that Viscom has long over-

come. The new system design of the iX7059 generation

adds space-saving installation, intelligent networking and

extremely simple operation by way of a 24" touch moni-

tor. A big advantage of the new line is its ability to exibly

handle PCB assemblies, even very large PCBs measuring

up to 1600 mm in length and weighing up to 15 kg.

Quality Uplink

3D AOI3D SPIPrinter Placement Oven vVerify3D AXI

MES

Closed loop

Best rst pass yield results

Viscom Quality Uplink provides maximum

quality and process eciency by means of

intelligent networking of 3D SPI, 3D AOI, 3D AXI

and verication station

Dimensions in mm

Front view Top view

Technical Specifications

Side view

www.viscom.com

Headquarters: Viscom AG

Carl-Buderus-Str. 9 - 15

· 30455 Hanover, Germany

Phone +49 511 94996-0

Fax +49 511 94996-900

info@viscom.com

Our international subsidiaries and

representatives can be found at:

iX7059 PCB Inspection iX7059 PCB Inspection XL

X-ray technology

X-ray tube Sealed microfocus X-ray tube

High voltage 130 kV 130 kV (up to 180 kV optional)

Tube current 300 µA 300 µA (500 µA)

Detector Flat panel detector type FPD T2 (FPD T3 optional), 14-bit grayscale depth

Resolution 8.5 - 25 µm/Pixel

3D image capture mode Evolution 4 as standard, Evolution 5 optional for unique dynamic image recordings

X-ray cabinet Designed to meet requirements for fully protected devices in accordance with the

German Radiation Protection Act (StrlSchG) and the German Radiation Protection

Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h

Software

User interface Viscom vVision/EasyPro

Statistical process control Viscom vSPC/SPC, open interface (optional)

Verification station Viscom vVerify/HARAN

Remote diagnosis Viscom SRC (optional)

Programming station Viscom PST34 (optional)

Operating system Windows®

Processor Intel® Core™ i7

Handling

PCB dimensions

Up to 610 mm x 600 mm (24" x 23.6") (L x W)* Up to 1600 mm x 660 mm (63" x 26") (L x W)*

PCB weight Up to 10 kg (22 lbs) Up to 15 kg (33 lbs)

Transfer height 860 - 980mm ± 20mm (33.9" - 38.6" ± 0.8")

Width adjustment Automatic during setup

Clamping Pneumatic

Support area 3 mm (0.1")

Upper transport clearance Up to 50 mm (2")

Lower transport clearance Up to 50 mm (2")

Other system data

Positioning unit Synchronous linear motor

Interfaces SMEMA, IPC Hermes (optional)

Power requirements 400V (other voltages on request), 3P/N/PE, 8A, 4-6bar working pressure

System dimensions

1493mm x 1654mm x 2207mm (58.8" x 65.1" x 86.9") (W x H x D)

Line integration dimension +30mm (1.2") on both sides, plus side tunnel for the extended longboard option

Weight 2245 kg (4949 lbs)*

*Depending on the configuration