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S o l d e r i n g i s o u r P a s s i o n G O W A V E G O W A V E Subject to technical modifications. © by SEHO, D-97892 Kreuzwertheim • Printed in Germany 05 17 34 e T echnical Data and Machine Options Make Y our Produc…
• Flexible and powerful with minimum footprint.
• Usable soldering width up to 340 mm.
• Flexible and robust conveyor system for processing
of soldering frames.
• Efficient PCS control unit.
• Easy and convenient operation with touch screen and
USB interface.
• Precise CAN bus motors.
• Innovative fluxer area with HVLP technology.
• Powerful preheat with programmable stop.
• Up-to-date solder nozzle geometries.
• 100 % lead-free capable.
The wave soldering system GoWave is a powerful soldering
system for those just entering into mass-soldering opera-
tions. The system is suited for electronic productions with
small or medium-sized volumes and also provides an econo-
mic solution for universities, schools and laboratories.
A special feature of this machine is its compact, but perfor-
mance-oriented design. It therefore allows an economical,
automatic wave soldering process at simultaneously low
costs.
The design of the GoWave provides the same basic technolo-
gy found in SEHO’s large wave soldering machines. Offering
a fluxing module, an efficient and powerful preheater, an inno-
vative soldering area and an up-to-date microprocessor con-
trol, this system presents the finest soldering technology in its
class.
Compact ... but with the Technology of a High-End System
The Fluxer Module: Innovative HVLP Technology
The ATS spray fluxing module, developed by SEHO, has
several advantages and is ideally suited for processing of
low-solid fluxes.
The spray head features HVLP technology (high-volume, low
pressure) which generates atomization of the flux with a
comparatively low pressure. This ensures a stable and repro-
ducible spray jet with a very homogeneous spray pattern and
an extremely good boundary at the outer edges to enable a
remarkable reduction of the flux consumption.
Overall, this low pressure system creates considerably less
spray mist which results in a notable reduction of soiling in the
fluxer area. As a result, maintenance requirements are mini-
mized.
G O W AV E
G O W AV E
Maximum Performance for Small and
Medium-Sized Production Volumes: SEHO GoWave
The Soldering Area: Up-to-Date and Low Maintenance
The heart of the GoWave - the soldering area - is featured with
a flexible configuration and therefore the system may be used
for nearly all soldering tasks.
As a standard, the solder pot is provided with a protective
composit coating, developed by SEHO, which is ideally suited
for processing leadfree solder alloys. Our experience is your
gain: the solder pot comes with a warranty of four years!
The solder pot has a modest 185 kg (SnPb) capacity,
ensuring low start-up costs and a short heat-up time which
contributes to a low energy consumption and a remarkable
reduction of the costs of ownership.
Innovative solder nozzle geometries which may be used in a
single wave or dual wave concept guarantee highest flexibili-
ty. This allows flexible processing of the entire product range,
from conventional through-hole assemblies to surface mount
applications and mixed technology. Dual wave configurations
are particularly of advantage if difficult-to-solder assemblies
are to be processed as they usually provide improved hole
penetration and reduced bridging. Typical solder faults thus
can be decreased remarkabely.
All solder nozzles, of course, are suitable for leadfree appli-
cations and can be removed quickly and easily for servicing.
The solder pumps are driven by high precision CAN bus
motors.
To achieve an ideal peel-off, the conveyor angle at the solder
wave may be adjusted manually between 6 degree and 8
degree, depending on the application.
To improve the soldering results particularly when processing
complex printed circuit boards, the soldering area of the
GoWave may be equipped with a local nitrogen inertion unit.
Simultaneously, this minimizes oxidation and dross for-
mation. As a result, maintenance requirements and solder
consumption are reduced remarkabely, with a very positive
effect on the cost of ownership.
The Control Unit: Easy to Operate
The integrated microprocessor control with touch screen
makes for easy programming of the system and ensures re-
producibility of all soldering processes.
The control unit monitors all machine functions and reliably
controls all key process parameters. With the possibility to
save up to 100 soldering programs, the GoWave provides
quick and easy change of parameter settings for soldering of
different printed circuit boards.
A USB data interface as well as recording of operating and
process data ensures uncomplicated tracking and illustration
of the processes.
The Preheat Area: Powerful and Individually Adjustable
The GoWave is featured with an infrared preheat zone with a
total length of 700 mm and has a ceramic glass cover.
The generous width of 400 mm ensures a very even and
reproducible heating of even high-mass printed circuit
boards.
The preheat temperature is individually adjustable up to
420°C. Thus, the system is ideally suited for high temperature
applications, such as lead-free soldering processes.
Of course, the preheat area is separately controlled and
monitored.
The entire preheat and soldering area is covered with a re-
flection tunnel. This enables a very high thermal stability and
reduces energy consumption.
To achieve a higher energy transfer especially when pro-
cessing high-mass printed circuit boards, the control unit may
be programmed to stop the assemblies in the preheat zone.
Soldering is our Passion
G O W AV E
G O W AV E
Subject to technical modifications.
© by SEHO, D-97892 Kreuzwertheim • Printed in Germany 05 17 34 e
Technical Data and Machine Options
Make Your Production Flexible: SEHO GoLean
The GoLean is a highly flexible one-person-workstation with integrated wave
soldering system GoWave. This system ideally fits into a lean production
concept.
The GoLean production concept is featured with a high profita-
bility, particularly in case of a large number of different products
or frequently changing production volumes.
The operator places the assemblies on an inlet conveyor mod-
ule. Afterwards, the assemblies are fluxed, preheated and
wave soldered. Following the soldering process, the boards are
taken over by a lift station and returned to the operator using a
conveyor which is installed at the bottom side of the machine.
Headquarters Germany
SEHO Systems GmbH
Frankenstrasse 7 - 11
97892 Kreuzwertheim
Germany
Phone +49 (0) 93 42-889-0
Fax +49 (0) 93 42-889-200
E-Mail info@seho.de
Website www.seho.de
Americas
SEHO North America, Inc.
1445 Jamike Avenue Suite # 1
Erlanger, KY 41018
USA
Phone +1-859-371-7346
Fax +1-859-282-6718
E-Mail sehona@sehona.com
Website www.sehona.com