SQ3000-PLUS-8030133-REV_A.pdf

SQ3000 ™ + Contact C yberOptics today for mor e information +1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.c om Copyright © 2021. C yberOptics Corporation. All rights reserved. Specicatio…

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SQ3000™ +
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2021. CyberOptics Corporation. All rights reserved. Specications subject to change without notice. 8030133 Rev A
SQ3000
™
+ 3D AOI • SPI • CMM
The Ultimate in Speed, Resolution and Accuracy with
Multi-Function Capability for Advanced Applications
Powered by
MRS™ Technology
Multi-Award Winning
MRS-Enabled Inspection
and Measurement Systems
Inspection Capabilities 5 Micron Ultra-High Resolution MRS Sensor
Inspection Speed
16 cm
2
/sec (2D+3D)
Minimum Component Size
0201 mm (008004 in.)
PCB Size
Minimum: 50 x 50 mm (2 x 2 in.); Maximum: 420 x 320 mm (16.5 x 12.5 in.)
Component Height Clearance
Top: 20 mm ; Bottom: 50 mm
PCB Thickness
0.1 - 5 mm
Component Types Inspected
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors,
header pins, and more
Component Defects
Missing, polarity, tombstone, billboard, ipped, wrong part, gross body and lead damage, and
more
Solder Joint and Other Defects
Gold nger contamination, excess solder, insucient solder, bridging, through-hole pins
3D Measurement Inspection
Lifted Lead, package coplanarity, polarity dimple and chamfer identication
Measurement Gage R&R
<10% @ ±3σ (±30 µm process tolerance)
Z Height Accuracy
0.5 µm on certication target
Z Height Measurement Range
400 µm at spec, 2.4 mm capability
CMM Capabilities
Accuracy XY / Z
2 µm / 0.5 µm
Resolution XY / Z
5 µm / 0.1 µm
Maximum Weight
10 kg
Min./ Max. Feature Height
Min. 10 µm ; Max. 400 µm at spec, 2.4 mm capability
Maximum Feature Size
420 x 320 mm (16.5 x 12.5 in.)
Carrier Thickness
0.1 - 5 mm
Coordinate Measurement
Capability
Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Oset,
X,Y Oset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius,
Coplanarity/ Distance to plane / 2nd Order tting, Dierence / Absolute / 2sqrt / VC, Max /
Min / Ave / Sigma / Plus / Minus / Multiple
Vision System & Technology
Imagers
Multi-3D sensors
Resolution
5 µm
Field of View (FOV)
25 x 25 mm
Image Processing
Autonomous Image Interpretation (AI
2
) Technology, Coplanarity and Lead Measurement
Programming Time
<13 minutes (for established libraries)
CAD Import
Any column-separated text le with ref designator, XY, Angle, Part no info; Valor process
preparation
System Specications
Machine Interface
SMEMA, RS232 and Ethernet
Power Requirements
100-120 VAC or 220-240 VAC (±10%), 50/60 hz, 10-15 amps
Compressed Air Requirements
5.6 Kgf/cm to 7.0 Kgf/cm (80 to 100 psi @ 4 cfm)
System Dimensions
135 x 148 x 175 cm (W x D x H)
Weight
≈1670 kg (3681 lbs.)
Options
Barcode Reader, Rework station, CyberReport SPC Software, Alignment Target
SQ3000™, SQ3000™ X (Large Board), SQ3000™ D (Dual Lane), and SQ3000™ DD (Dual Lane - Dual Sensor) models available
NEW
5 Micron
Ultra-High Res
MRS Sensor
Multi-Reection Suppression (MRS)
Technology
The SQ3000+ is powered by CyberOptics’ proprietary
3D sensing technology with sophisticated fusing
algorithms that enables metrology grade accuracy at
production speed. The result is ultra-high quality 3D
images, high-speed inspection and metrology, and
improved yields and processes.
SQ3000+ oers unmatched accuracy with the
advanced MRS sensor technology by meticulously
identifying and rejecting reection-based distortions
caused by shiny components and surfaces. Eective
suppression of multiple reections is critical for
accurate measurements. The new, ultra-high
resolution 5 micron MRS sensor incorporated into
the SQ3000+ is specically designed for advanced
applications with the most demanding requirements.
SQ3000
™
+ 3D AOI • SPI • CMM
High Precision Accuracy with
Multi-Reection Suppression™ (MRS™)
Sensor Technology
SQ3000+ Multi-Function System with Multi-Reection Suppression (MRS)
sensor technology provides the ultimate combination of high resolution,
high accuracy and high speed for inspection and metrology. It remains
the only system on the market capable of performing AOI, SPI
and CMM in-line.
Enable Smarter, Faster Inspection
Speed programming and tuning with new capabilities including AutoTeach, AutoTune and AutoDene
for faster set-up and a simplied process. AI (Autonomous Image Interpretation) technology is all about
keeping it simple - no parameters to adjust or algorithms to tune. And, you don’t need to anticipate
defects or pre-dene variance either. AI does it all for you, powered by a data-rich, pre-loaded library
and automated scripts that collect and update models all on their own. With AI , you have the power
to inspect the most comprehensive list of features and identify the widest variety of defects. AI oers
precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-
volume applications.
Fast, Scalable SPC Solution
CyberReport™ oers full-edged machine to factory-
level SPC capability with powerful historical analysis
and reporting tools. The software delivers complete
traceability for eective process verication and
yield improvement. CyberReport is designed for
simple set-up and intuitive use, while simultaneously
delivering scalability, fast charting, and an extremely
compact database size.
Intuitive, Easy-to-Use Software
The multi-award winning SQ3000 AOI software is a more powerful
yet extremely simple software suite designed with an intuitive
interface and multi-touch control with 3D image visualization tools.
Ultra-fast programming capabilities bring the ease-of-use to a
completely new level and signicantly speeds setup, simplies the
process, reduces training eorts and minimizes operator interaction
– all saving time and cost.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
Inspection and Metrology Solution for Assembly and Process Improvement
The SQ3000+ with MRS technology is ideal for high-end applications including advanced packaging, mini/
micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced electronics,
008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement
(CMM) applications where quality and reliability are critical.
Faster, Highly Accurate Coordinate
Measurement (CMM) Suite
CyberCMM™, a comprehensive software suite of
coordinate measurement tools, provides highly
accurate, 100% metrology-grade measurement
on all critical points much faster than a traditional
CMM, including coplanarity, distance, height and
datum X, Y to name a few. A fast and easy set-up
can be performed with the world’s rst in-line CMM
system for programming complex applications as
compared to slow, engineering resource-intensive
set-up that typically requires multiple adjustments
with traditional coordinate measurement machines
(CMMs).
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
AOI
SPI
CMM
NEW
5 Micron
Ultra-High Res
MRS Sensor