PowerFusion_Series_Brochure.pdf
The Power Series for Kulicke & Soffa - a new generation of semiconductor assembly equipment for today’s most challenging applications. In continuation of our tradition of innovation and technology leadership, Power S…
The Power Series
for Kulicke & Soffa - a
new generation of
semiconductor assembly
equipment for today’s
most challenging
applications. In
continuation of our
tradition of innovation and
technology leadership,
Power Series products
set new standards for
performance, productivity,
reliability, and ease of
use.
Driven by the most
powerful X-Y-Z motion
control system available
on the market, Power
Series products deliver
the highest levels of
speed, accuracy and
throughput for reduced
cost of ownership.
Power Series from
Kulicke & Soffa - the
most Powerful name in
assembly equipment.
High Performance
Wedge Bonder
K&S PowerFusion
PS
TM
Wedge Bonders are driven
by a new powerful direct-drive motion system and
expanded pattern recognition capabilities which
deliver industry leading productivity and reliability.
Three models of PowerFusion bonders are
available to cover the full range of applications.
The TL Model is the perfect choice for bonding TO
power devices while the HL Model provides the
accuracy and capabilities required to process the
most advanced power semiconductor packages.
The HLx Model can handle extra-wide matrix and
IPM leadframes up to 105mm wide.
Features
Productivity
• IncreasedUPH-Enabledwithdirect-driveservosystemandfasterPRndtimes
• Higher MTBA - Fewer line stoppages with improved pattern recognition
Performance
• Customloopingprolescreatespecializedloopshapesforcriticalapplications
• Greater bond placement repeatability
• Input kicker jam sensor with adjustable force helps prevent leadframe damage
Advanced Power Semiconductor Package Capability
• Enabler for small power packages
• Expanded bondable area
• Wider leadframe capability (105mm Width) - NEW!
• Superior indexing accuracy
Ease of Use
• Post-bond device review feature
• Bond tool replacement without gauges
• Global parameter editing of multiple process programs
CongurationFlexibility
• Link single and dual head machines together
• Large wire, small wire and PowerRibbon conversion kits available
• Up to four in-line non-destruct pulltesters per head
Maintenance and Reliability
• Reduced preventive maintenance requirements on major components
• New direct-drive XYZT motion system eliminates drive belts and leadscrews
• Reduced number of cables and interconnections improves reliability
High Performance
Wedge Bonder
General
Power Requirements:
Single Head: Electrical: 180-240VAC, Single Phase,
50/60Hz, 2.0kVA
Dual Head: Electrical 180-240VAC, Single Phase,
50/60Hz, 4.0kVA
Compressed Air: 3 SCFM, 80psi Clean Dry Air
Nitrogen: Min 40psi - Max 145psi (Small wire only)
Work Height: Adjustable 990mm - 1050mm from Floor
Foot Print:
Single-head: 1346mm (W) x 1219mm (D) x 1676mm (H)
Dual-head: 1828mm (W) x 1219mm (D) x 1676mm (H)
Weight:
Single-head: 500kg Uncrated
Dual-head: 800kg Uncrated
CE Certication: Standard on all automatic Orthodyne wedge
bonders
Motion System
X,Y Axes: Linear motors, 0.1μm Resolution
Bond Area: TL & HL 80mm x 78mm;
NEW! HLx 80mm x 98mm
Z-Axis: Voice Coil, 0.1μm Resolution; 50mm Z-Stroke
Θ-Axis: Direct Drive; ± 220°, 0.0057° Resolution
Repeatability:
±3μm at 3σ (without Pattern Recognition)
Pattern Recognition/Optics/Vision
Vision System: GS4 Pattern Recognition System
New PR Modes: Feature Find; Single Point with Angle
The TL Model is the perfect choice for
bonding single-row to four-row matrix
TO power devices. PowerFusion
PS
’s
industry leading productivity reduces
your manufacturing costs and delivers
optimum pattern recognition and
superior bonding performance. It is
upgradeable to the HL Model in case
advanced interconnect requirements
are needed in the future.
The HL Model is specially designed
to enable large wire, small wire and
PowerRibbon bonding in advanced
interconnect designs. Whether you are
bonding high density power devices
like SO-8 & PDFN or stretching the
wire limit on a matrix D-Pak, the
superior indexing accuracy and
clamping capabilities of the HL Model
deliver consistent quality.
For sales, service and manufacturing locations,
visit: www.kns.com
©2017 Kulicke & Soffa Industries, Inc.
Specications may change without notice.
The Power Series logo, Power Series, K&S logo,
and Kulicke and Soffa are trademarks of
Kulicke & Soffa Industries, Inc.
WB-002-01/2017
Specications
• New Graphical Bond head Set-up aid option (GBS) reduces consumable replacement time and ensures a
repeatable set-up
• New Graphical Tooling Set-up aid option reduces tooling set-up time and improves positioning
• Bond Process Monitoring option (BPM) helps keep tight control of the bonding process consistency
• SECS-GEM option for factory automation and communication
Options
Interconnect Options
Large Wire
Wire Range: 100μm - 500μm Diameter
PowerRibbon
Ribbon Range: 500 x 100μm to 2000 x 250μm
Small Wire
Wire feed angle: 45° or 60°
Wire Range: 25μm - 75μm Diameter
Leadframe Handler
Clamp station: Vertical moving anvil standard; Optional
horizontal moving anvil coming soon.
Strip dimensions:
HLx: NEW! 110-300mm Length; 18-105mm Width;
Max. 3mm Down-set
HL: NEW! 110-300mm Length; 18-80mm Width;
Max. 3mm Down-set
TL: NEW! 110-300mm Length; 18-75mm Width;
Max. 3mm Down-set
Leadframe positioning repeatability:
HLx & HL: ± 15μm @ 3 sigma
TL: ± 35μm @ 3 sigma
Magazine size: NEW! 20-115mm Width; 50-200mm
Height; 115-305mm Length
Magazine pitch: Programmable, 3mm minimum
Non-destruct Pulltesting
In-line Transport Pulltester Option
Pull force: 20-500g, non-destructive
Up to 4 pulltesters per bonder module
Loop height check: yes
Bondhead Pull Test: Large Wire ALC bond head only
The HLx model has all the high
performance capabilities of our HL
model with the added benet of
handling leadframes up to 105mm
wide. Whether you have a current
requirement for wide leadframe
processing or just want to invest in a
exible platform for future leadframe
development, the HLx model is the
best choice for many applications.
NEW!