TDS_InJet_888_CRRD_2F_ENG.pdf - 第3页
InJet ® 888 CRRD – 2F TECHNICAL DATA SHEET 3 www.dct.cleaning R R D C Application name Recommended application Recommended temperature Total cleaning process time Capacity per 8 hours Re ow and soldering parts 30 – 50°C…
InJet
®
888 CRRD – 2F
TECHNICAL DATA SHEET
2
www.dct.cleaning
GENERAL INFORMATION
The InJet
®
888 series cleaning systems represent
unique horizontal Spray-In-Air technology developed
and manufactured by DCT.
Systems with horizontal spraying technology excel in high
pressure and high liquid ow. Thanks to their large process
chamber they have a large capacity basket, which also
facilitates loading and unloading of the cleaned parts.
The basket can be pulled out of the cleaning chamber on
built-in rails or onto a separate loading and handling trolley.
The InJet
®
888 CRRD-2F including 100% closed loop
with processes of cleaning, pre-rinsing, rinsing and drying
technologies. All of the processes are fully automated, and
take place in one process chamber.
TheInJet
®
888 CRRD-2F is designed primarily for removing
ux residues from soldered boards. It is possible to insert
and clean a stencil or misprints at the same time.
The 2F designation refers to a 2-storey solution where
smaller parts can be cleaned in two baskets simultaneously
to maximize cleaning capacity. After easy removal of the
rotation arm, large parts can be cleaned in one (lower)
basket.
Depending on your cleaning requirements,
the DCT project manager, in collaboration
with a local distributor, will advise you
on a suitable water-based cleaning fl uid
and the correct setup of the entire process.
InJet
®
888 CRRD – 2F
TECHNICAL DATA SHEET
3
www.dct.cleaning
R
R
D
C
Application
name
Recommended
application
Recommended
temperature
Total cleaning
process time
Capacity
per 8 hours
Re ow and soldering parts
30 – 50°C 86 – 122 °F 40 min. 240 *
PCB
35 – 55°C 95 – 131 °F 60 min. 2016 *
Stencil, misprint, squeegee
20 – 40°C 68 – 104 °F 20 min. 24
4 INDIVIDUAL PROCESSES
CLEANING PARAMETRES
C
R
D
R
CLEANING
PRE–RINSING
RINSING
DRYING
highly recommended recommended applicable
* PCB eurocards / per 8 hours (calculated for dimension of 100 x 160 mm / 3.94 x 6.3 in)
* * Parts in soldering palette / per 8 hours (320 x 500 x 50 mm / 12,6 x 19,7 x 1,97 in)
* * * Stencils, pumpprints larger than 736 x 736 mm / 29 x 29 in
LEGEND:
InJet
®
888 CRRD – 2F
TECHNICAL DATA SHEET
4
www.dct.cleaning
TECHNICAL PARAMETERS
DIMENSIONS
MINIMUM SERVICE SPACE
AROUND THE MACHINE
1960 mm
77.7 in
1350 mm
53.1 in
1620 mm
63.8 in
600 mm
23.6 in
600 mm
23.6 in
600 mm
23.6 in
1200 mm
47.2 in
open door
1000 mm
39.4 in
metric units imperial units
Dimensions (w x l x h) 1620 x 1400 x 2350* mm 63.8 x 55.1 x 92,5* in
Weight 795 kg 1753 lbs
Ø energy consumption per cycle 3,3 kWh 3.3 kWh
Cleaning and rinsing uid consumption
per cycle
0,2 – 0,5 l 0.05 – 0.13 gal
Compressed air consumption per cycle 1200 l / cycle / 4,5 bar 396.26 gal / cycle / 4,5 bar
Max. dimensions of the cleaned parts ** 850 x 800 x 600 mm 32.7 x 31 x 22.7 in
Exchangeable mechanical lter of cleaning
and rinsing uid
5 – 200 μm 5 – 200 μm
Spraying pressure / 45 °C / 113 °F 2,4 Bar 34.8 PSI
Cleaning uid ow rate 210 l / min 55.5 gal / min
Temperature range setting of the cleaning
and rinsing uid
From ambient temperature to 60°C From ambient temperature to 140°F
Conductivity range settings of the rinsing
uid in the tanks.
0 – 2000 μS/cm * optional 0 – 2000 μS/cm * optional
Temperature range setting of the drying From ambient temperature to 80°C From ambient temperature to 176°F
Noise level < 70 dB < 70 dB
Device control PLC + 8,4“ touchscreen PLC + 8.4“ touchscreen
Volume of storage tanks 85 l 22,4 gal
* Maximum dimensionin operation condition
** The maximum height of the board, if the basket has 2 oors, is 210 mm at a loading angle of 10°.
2350 mm
92.5 in