Viscom_Brochure_Bond_S6053BO-V_en.pdf
High-end solution for in-line inspection Individually configurable transport Compatible with all Visc om bond camera modules Extremely high accuracy and inspection depth Remote diagnosis, hotline and on-site service Bond…
High-end solution for
in-line inspection
Individually configurable
transport
Compatible with all
Viscom bond camera modules
Extremely high accuracy
and inspection depth
Remote diagnosis, hotline
and on-site service
Bond
The S6053BO-V system from Viscom features the highest precision
in automated optical wire bond inspection. With individually
configurable transport options, ceramic substrates of different
characteristics and sizes are reliably inspected.
Wire bonds and SMD assembly are inspected together. High-
resolution cameras capture all bond sites and wires. The Viscom
inspection software is designed for maximum inspection depth
and accuracy. Wire path, dies and component position are only a
part of the inspection. It makes no difference whether the bonds
are of copper, aluminum or gold, or whether ribbon or thick or
thin wires are involved. Even wire dimensions of 17µm are reli-
ably inspected. The system also detects damaged and misplaced
components.
Inspection programs can be created and optimized off-line on a
Viscom programming station. This is supported by image mate-
rial from a previously captured video base. The standard library
contains inspection patterns for die, ball-wedge, wedge-wedge
and security bonds. The inspection scope can be individually ex-
tended. In conjunction with a high-power Viscom SPC evaluation,
numerous conclusions regarding the process can be made.
www.viscom.com
Precise In-Line Inspection
of Wire Bonds
S6053BO-V
Inspection of different
wire diameters
Defect detection on multiwire
connections
www.viscom.com
Headquarters: Viscom AG · Carl-Buderus-Straße 9 - 15 · 30455 Hanover · Tel. +49 511 94996-0 · Fax +49 511 94996-900 · info@viscom.com · www.viscom.com
You will find our international subsidiaries
and representatives under:
#Viscom_S6053BO-V_EN19100003 Subject to technical changes. Windows
®
and Intel
®
Core™ i7 are registered trademarks.
Dimensions in mm*
Front view Top view
Technical Specifications
Side view
S6053BO-V
Transport system
Single track Double track Dual shuttle
Inspection concept
Single inspection
Inspection scope
Bond Ball bond, wedge bond, wire, die/SMD, ribbon
Camera technology
Standard conguration XM Bond HR*
Number of modules per machine 1
Number of cameras 1
Pixel size 4.5 μm/pixel
Software
Software
User interface Viscom EasyPro
SPC
Viscom SPC (statistical process control), open interface (optional)
Verification station Viscom HARAN
Remote diagnosis Viscom SRC (software remote control) (optional)
Programming station Viscom PST34 (optional)
System computer
Operating system Windows®
Processor Intel® Core™ i7
Substrate handling
Max. substrate size
280 mm x 300 mm
(11" x 11.8") (L x W)
280 mm x 130 mm
(11" x 5.1") (L x W)
210 mm x 130 mm
(8.3" x 5.1") (L x W)
Transport clearance 860 - 1180 mm ± 20 mm (33.9" - 46.5" ± 0.8")
Substrate clamping Vacuum or mechanical clamping
Upper transport clearance
Up to 35mm
(1.4")
Inspection speed
> 1000 wire bond connections/min., depending on inspection object characteristics
Other system data
Positioning/handling unit Synchronous linear motors
Interfaces SMEMA, SV70, customer-specific
Power requirements 400 V (other voltages on request), 3P/N/PE, 8 A, 4 - 6 bar working pressure
System dimensions
813 - 1000 mm x 1615 mm x 1055 mm (32" - 39.4" x 63.6" x 41.5") (W x H x D)
Weight 800kg (1764 lbs)
*Other camera technologies and substrate sizes on request