ASM_Datasheet_DEK_UFP_ECO_understencil_cleaning_rolls_EN_210407.pdf
DEK Ultra-Fine Pitch (UFP) ECO understencil cleaning rolls DEK UFP ECO UNDERSTENCIL CLEANING ROLLS Part number Platform Fabric width (mm) Core width (mm) Inner core diameter (mm) Roll max outer diameter (mm) Roll length …
DEK Ultra-Fine Pitch (UFP)
ECO understencil cleaning rolls
DEK UFP ECO UNDERSTENCIL CLEANING ROLLS
Part number Platform Fabric width
(mm)
Core width (mm) Inner core
diameter (mm)
Roll max outer
diameter (mm)
Roll length (m)
SAP DEK
03128525 800071 DEK Micron 515 530 19 56 11
03128531 800072 DEK Micron 400 530 19 56 11
03130297 800073 DEK Micron 300 530 19 56 11
03239913 – DEK TQ (NEW) 400 – – – ~ 22
03128585 800074 MPM 443 457 19.5 64 12
03131628 800075 MPM 443 457 19.5 100 44
03131629 800076 MPM 546 559 19.5 64 12
03131630 800077 EKRA 400 400 13 53 10
03131631 800078 EKRA 500 500 13 53 10
03131632 800080 Panasonic 365 380 19.5 64.5 15
03131633 800082 Yamaha 440 440 25.5 88 25
03131634 800083 Yamaha 530 530 25.5 88 25
03155072 800084 Yamaha 620 620 25.5 88 25
DEK UFP ECO rolls are designed to boost productivity and yield,
reduce defects and decrease manufacturing costs.
The unique 3D architecture of DEK UFP ECO understencil cleaning rolls counters the
risk of contamination as the fabric traps solder paste and solders balls within its pockets.
This is a key dierentiator from paper-based products that allow paste to remain on
the surface of the paper, creating the potential for contamination. Consequently, DEK
UFP ECO rolls not only ensure eective understencil cleaning, they also prevent
contamination-related defects.
Ideal for ultra-ne-pitch apertures inherent with today’s miniaturized devices, DEK UFP
ECO rolls ensure a quick and eective clean. The hydrophilic properties of the bers
provide fast wicking, as solvent is delivered through the fabric to the bottom of stencil
instantaneously so that cleaning is more thorough and solvent consumption is reduced.
Features and benets:
■ Outstanding cleaning performance
■ Reduced solvent consumption by an average of 50%
■ Unique 3D structure traps solder particles away from the stencil,
removing smear
■ Ultra-low linting, Class 1000, ISO6 cleanroom compatible
■ Enhanced vacuum performance
■ Hydrophilic fiber structure for rapid solvent wicking
■ ESD-safe packaging
■ Improved process control
■ Non-abrasive structure of fabric increases stencil and coating life
■ Environmentally-friendly, chloride-free, recyclable
■ Faster, more effective cleaning cycle leading to higher throughput
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Americas:
ASM Assembly Systems USA Inc.
Phone: +888 768 4357 (press 2)
E-mail: smtparts.us@asmpt.com
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ASM Assembly Systems
Phone: +40 722 692 108
E-mail: asm-psp.eu@asmpt.com
Asia:
ASM Assembly Systems
Phone: +65 6877 3900
E-mail: spares.sg@asmpt.com
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Issue 5/03-2021
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All rights reserved.
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Order No.: A10011-ASM-A99-EN
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Printed in Germany
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© ASM Assembly Systems GmbH & Co. KG
The information in this brochure consists only of general descriptions and/or performance features which may not always apply to concrete products as described or which
may change as a result of technical developments or advances. Any specific performance features and/or capabilities will only be binding if contractually agreed upon.
All product names are brands or trademarks of ASM Assembly Systems GmbH & Co. KG or other suppliers. Their use by third parties may violate the rights of their owners.
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