POLYPHOS_Laser_DP_Brochure_210708_PM_CC_E.pdf
ASY S Sets a New Standar d in Laser Competence ASYS pr ovides a br oad product line of depa- neling solutions that range from semi-auto- matic to high-end inline systems. The POL YPHOS CT 7000 and POL YPHOS DP 8000 and 9…
ASYS Sets a New Standard in Laser Competence
ASYS provides a broad product line of depa-
neling solutions that range from semi-auto-
matic to high-end inline systems.
The POLYPHOS CT 7000 and POLYPHOS DP
8000 and 9000 Series machines utilize the la-
test laser technology and are ergonomically
designed with particular focus on reliability,
easy operation and reduced footprint.
The POLYPHOS CT 7000 Series is a machine
platform for laser cutting of metal core PCBs,
respectively IMS (Integrated Metal Substrate) for
e.g. LED luminaires or ceramic substrates like
power semiconductors on DCB substrates. Unlike
the POLYPHOS 8000 Series, the system consists
of a CNC-controlled machine with a precision
cutting head to position the laser beam. Cutting
gas supports the cutting process. Depending on
the application diff erent gases can be used. A
camera is used for machine calibration and off set
correction using fi ducials.
The POLYPHOS DP 8000 Series sets new standards in laser depaneling of rigid and
fl exible PCBs. A hard stone base allows for maximum stability and precision. Diff erent
beam sources are available to adapt to the material. The system is available as a
stand-alone or fully automated inline system. For inline production various product
specifi c carrier transport and systems are available. A camera is used for machine
calibration and off set correction using fi ducials. The system uses a precise XY-axis
system and a digital galvo scanner for a Step&Scan process to optimize throughput
and accuracy.
Features
› High positioning accuracy
› DIN language controlled (CNC) cutting recipes (POLYPHOS CT 7000 and DP 8x00)
› State of the art beam sources and optics for improved cutting result
› Graphic editor for cutting recipes (POLYPHOS DP 9000)
The POLYPHOS DP 9000 Series is a cost-eff ective and throughput-optimized laser
depaneling system for the depaneling of electronic circuits with a thickness of up
to 1.6mm. It enables fl exible automation concepts thanks to various product carrier
options and transport options. In addition, various working areas can be integrated to
meet diff erent panel size and accuracy requirements.
Benefi t from our services
› High quality service team
› 24 hour service hotline
› Short reaction times
› Worldwide maintenance service, operator and process trainings
› Support via remote service
› Worldwide service network
POLYPHOS_Laser_DP_Brochure_210708_PM_CC_E
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POLYPHOS SERIES – DP Laser-Depaneling
POLYPHOS SERIES – CT Laser-Cutting
1
Other dimensions on request
Standard
Option
MFU = Machine capability study
POLYPHOS Series
Model Overview and Options
Subject to change without notice. Some general descriptions
and performance characteristics may not be applicable to all
products. Technical specifications are subject to change without
notice.Only features and technical data provided in purchasing
contract are legally binding. Printed in Germany
POLYPHOS CT
7000
POLYPHOS DP
8000
POLYPHOS DP
8100
POLYPHOS DP
8200
POLYPHOS DP
9000
Technical
Working area
(max. LxW in mm)
1
490x460 305x250 460x305 460x460 180x180 up to 245x245
Machine dimensions
(LxWxH in mm)
1
830x1565x1550 1090×1800×1455 1400x1800x1570 1400x1900x1570 700x1548x1685
Scan field 50x50 up to 80x80 50x50 up to 80x80 50x50 up to 80x80 180x180 up to 245x245
Galvo scanner
Cutting head
Noise Level < 75 dB(A) < 75 dB(A) < 75 dB(A) < 75 dB(A) < 75 dB(A)
NC Axes
Beam Source
DPSS-Laser
with SHG
30 W
40 W
UV-Laser
CO
2
-Laser 150 W
QCW Fiber
Laser
150 W
300 W
Laser-class 1 1 1 1 1
Panel
Panel length (in mm) 20 to 508 20 to 305 20 to 460 20 to 460 20 to 360 / 20 to 400
Panel width (in mm) 20 to 460 20 to 250 20 to 305 20 to 460 20 to 180 / 20 to 245
Panel thickness (in mm) 0.1 to 1.6 (2.0) 0.1 to 1.6 (2.0) 0.1 to 1.6 (2.0) 0.1 to 1.6 (2.0) 0.1 to 1.6 (2.0)
MCPCB/IMS
QCW Fiber
Laser
Ceramic (AIN,
Si
3
N
4
, AI
2
O
3
)
QCW Fiber
Laser
FR4 1.6mm
DPSS-Laser
with SHG
Adapter
Product-specific carrier and
handling systems available
ESD
Ionisation
Vision
Fiducial recognition
“Bad“ mark recognition
Code Read
DB & MES
Hand-scanner
Automatic scanner
“Good/bad” interface
Prod. data management
Traceability function
Output
Segment conveyor
Carrier transport
Access
Sliding cover
Quality
Technical availab. ≥ 98 %
CE declaration
MFU
Sound pressure test
Stress tests
Process capability tests