DS-FlexTRAK SHS-Plasma-Systems-MARCH.pdf
Built on Nordson MARCH patente d plasma te chnology , the FlexTR AK ®–SHS o ers full automation with a high-cap acity F3-S chamber to increase unif ormity and productivity . The chamber architecture remains the same as …
Built on Nordson MARCH patented plasma technology, the
FlexTRAK®–SHS oers full automation with a high-capacity
F3-S chamber to increase uniformity and productivity.
The chamber architecture remains the same as the smaller
FlexTRAK platform, providing a seamless transition between
chambers to scale for increasing production demand.
A FlexTRAK–SHS variant with a standard F3 chamber is
available if the capacity of the F3-S chamber is not required.
The FlexTRAK-SHS provides the following:
Industry-Leading Throughput
• Large capacity F3-S process chamber.
• Simultaneous strip buering and processing.
• Advanced automation and magazine-splitting capabilities.
New Product Development
• Advanced material handling.
• Ability to accommodate increasingly larger strip sizes.
• Sophisticated jam detection.
Application Flexibility
• Plasma chamber eectiveness.
• Congurable process chamber.
• Versatile treatment modes.
Key Applications
• Pre-wire bond plasma treatment on
semiconductor package substrates and lead
frames.
• Pre-underll plasma treatment on ip chip
packages.
• Pre-mold plasma treatment on semiconductor
package substrates and lead frames.
• Plasma treatment of semiconductor package
substrates and lead frames for improved
adhesion.
• Removal/reduction of oxidation on lead
frames.
MARCH FlexTRAK-SHS
Industry-Leading Throughput and Reliability for Semiconductor Packaging Applications
Specications
FlexTRAK-SHS
Enclosure
Dimensions
W x D x H – Footprint 2314 W x 1935 D x 1787 H mm (2293 H mm with light tower)
91.1 W x 76.2 D x 70.5 H in (90.3 H in with light tower)
Net Weight 1305 kg (2,871 lbs)
Eective Footprint –Clearances All sides – 700 mm (27.6 in)
Chamber
Volume F3-S chamber: 9.6 liters (585 in³)
F3 chamber: 5.5 liters (338 in³)
Electrodes
Powered Electrode Dimensions F3-S chamber: 305 W x 610 D mm / 12 W x 24 D in
F3 chamber: 305 W x 305 D mm / 12 W x 12 D in
RF Power
Standard Wattage F3-S chamber: 1000 W
Frequency 13.56 MHz
Gas Control
Maximum Number of MFCs 3
Control System
Interface EPC with PC-based touchscreen interface
Remote Interface
Communications SECS/GEM, Remote HMI
Vacuum Pump
Standard Purged Dry Pump 16 CFM, Variable Frequency Drive
N2 Purged Pump Flow 2 SLM
Facilities
Power Supply 220V, 40A, 50/60 Hz, Single Phase, 12 AWG, 3-Wire
Process Gas Fitting Size & Type .25-in OD Swagelok Compression
Process Gas Purity Industrial grade or better
Process Gas Pressure Regulated from .69 bar (10 psig) min to 1.4 bar (20 psig) max
Purge Gas Fitting Size & Type .25-in OD Swagelok Compression
Purge Gas Purity Industrial grade Nitrogen or CDA
Purge Gas Pressure Regulated from 5.5 bar (80 psig) min to 6.9 bar (100 psig) max
Handler Pneumatic Valves Fitting
Size & Type
10 mm push-in tting
Pneumatic Gas Purity CDA, Oil Free, Dewpoint <=7 °C /45 °F, Particulate Size <5 micron
Handler Pneumatic Gas Pressure 4.5 – 6 bar (65 – 87 psig)
Handler Exhaust Fitting 12 mm push-in tting
Compliance
Certications CE Marked, SEMI S2/S8 (EH&S/Ergonomics)
Ancillary
Equipment
Nitrogen Generator (option) Necessary for Purge Gas Requirements
Chiller (option) Required When Congured with Cooled Electrode
Hydrogen Kit (option) Allows System to Use Hydrogen Gas for Processing
Scrubber (option) Intended for Fluorinated Operations on the System
Shipping
Gross Weight 1505 kg
Number of Packages 1
Packing Conforms to ISPM 15 Yes
July 2024
North America Headquarters
2762 Loker Avenue West
Carlsbad, CA 92010-6603, USA
+1.760.431.1919
FlexTRAK-SHS
For more information, visit our
website to nd your local regional
oce or representative.
We have several global locations to
serve you.
North America
Asia Pacic
EMEA
www.nordson.com/electronics
info-electronics@nordson.com
System Packages
Essential
Reliable, cost-
eective plasma
treatment.
The compact automated system uniformly treats microelectronic components
for advanced semiconductor packaging applications. Low maintenance and
dependability deliver excellent cost-of-ownership.
Productivity
Advanced
throughput.
Accelerate throughput and yield with fully automated plasma processing and
advanced jam detection optimized for thin or warped strips.
Nordson Electronics Solutions builds the future of electronics reliability all across the globe. We’re proud of the decades
of service and solutions we’ve provided to enhance semiconductor reliability. No matter where you are, you’ve likely
manufactured or purchased a product made reliable with our equipment. The FlexTRAK-SHS oers industry-leading
throughput and reliability for semiconductor manufacturing applications, designed to last and provide cutting-edge capabilities
continuing a time-honored tradition.
Explore the FlexTRAK-SHS system packages. Continue to see how we support the future.
For more information, contact us at info-electronics@nordson.com.