Nordson_EFD_Solutions_Mobile_Device_Wearables_Wireless_Brochure.pdf - 第5页
2 Fluid Positioning & Dispensing Applications Display UV resins and adhesives Optically clear adhesives (OCAs) Conductive pastes Other specialty fluids Nordson EFD solutions pr ovide greater pr ecision in multiple di…
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Display
• Edge display seal (LCD and OLED)
• End display seal (LCD and OLED)
• Display/cover glass bonding and gap fill
• Touch panel optical gel coating
• Module/IC driver gap fill
• Flexible printed circuit board (FPC)
reinforcing tab
• Cover on Glass (COG) and Indium Tin
Oxide (ITO) over coating
Camera Module
• Camera module assembly
Gap
between
module and
IC driver
General Assembly
• Primer/PSA applications
• Hydrophobic coating
• Printed circuit board (PCB)
coating and bonding
• Flexible printed circuit board
(FPC) reinforcing tab
• MEMS microphone assembly
• Conformal coating applications
• Thermal compound applications
Speaker
• Microspeaker assembly
Fluid Positioning &
Dispensing Applications
Mobile Device
& Wearables
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Fluid Positioning &
Dispensing Applications
Display
UV resins and adhesives
Optically clear adhesives (OCAs)
Conductive pastes
Other specialty fluids
Nordson EFD solutions provide greater precision in multiple display assembly
applications.
Whether bonding cover glass to LCDs and OLEDs or edge sealing and end
sealing of LCDs and OLEDs, Nordson EFD solutions deliver consistent,
repeatable deposits at high speeds.
Mobile device and wearables manufacturers prefer EFD solutions for gap-fill
applications, in addition to more specialized applications such as optical
bonding and seal bonding dispensing anisotropic conductive fluids in very
narrow spaces.
ACP bonding seal or electrode seal applications involve dispensing between
the display module and driver I/C. As the gap between modules and driver
I/Cs gets narrower and glass thickness gets thinner, non-contact dispensing
is preferred to drive higher productivity.
Recommended Solutions
• PICO
®
XP jet valve
• 781Mini
™
spray valve
• xQR41 Series needle valve
• 797PCP progressive cavity pump
• PRO4 Series automated dispensing system
• OptiSure
™
automated optical inspection (AOI) software and confocal laser
• Unity
™
HiTemp
™
syringe barrels
Benefits: Tighter seals, improved line yields, faster production, reduced
material waste, zero Z-axis movement (with PICO valves), and improved
quality of dispensing.
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Fluid Positioning &
Dispensing Applications
Camera Module
UV-cure adhesives
Adhesives
Epoxies
Other specialty fluids
As camera modules shrink in size, manufacturers need greater accuracy
when bonding lenses to barrels, barrels to camera modules, camera modules
to circuitry, and camera module holders to smart phone bodies.
The slightest overspray bonds components that should not be bonded,
creating more rework, which slows production and lowers yield. Nordson EFD
solutions feature built-in cutoff functionality, in addition to extreme deposit
accuracy, to eliminate overspray.
Other applications utilizing EFD dispensing solutions include, but are not
limited to:
• Die-bonding in packaging
• Frame bonding
• IR cut filter bonding
• Actuator and VCM bonding
Recommended Solutions
• PICO XP jet valve
• PICO jet valve (with needle adapter)
• 781Mini spray valve
• xQR41 Series needle valve
• EV Series automated dispensing system
• OptiSure AOI software
Benefits: Precise deposit accuracy eliminates overspray, increases
throughput, and reduces fluid waste.