Brochure-PacTech-Electroless-Plating-Solder-Bumping.pdf

T ur nkey Solution for Electr oless Plating & Solder Bumping www .pactech.com

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Turnkey Solution for
Electroless Plating & Solder Bumping
www.pactech.com
PacLine 300 – Electroless NiAu/NiPd/NiPdAu
RFID adhesive attach
on antenna
WLCSP, FlipChip
• Low cost, high reliability metal interface
• Mask-less process
• Fully automatic, dry-in dry-out
• In-linetemperature,pH,owcontrol
• Automatic chemical delivery and drain system
• SECS GEM interface
• CN / CN-free chemical options
Substrate Size
4” – 12” wafers, panels up to 650 mm x 650 mm
Substrate Thickness
≥100µm,thinwafersolutionavailableuponrequest
Substrate Materials
Si, GaAs, SiGe, InP, LiTaO3, Ceramics, Laminates, Glass, Quartz,
othermaterialsuponrequest
Pad Material
AlCu,AlSiCu,Cu,Al,AlSi,othermaterialsuponrequest
Machine Throughput
• UPH up to 150 wafers (8”)
• UPH up to 75 wafers (12” / Panel)
ProcessSpecications
Cu and high reliability Au
wirebonding
Clip attach
Major Applications
UniqueTurnkeySupplyandSupport
• Processexpertise,equipmentmanufacturingand
chemicals supply under one roof
• E-less plating solution tailored for all volume demand
• Worldwide second source support via PacTech’s
manufacturing sites in Europe, USA and Asia
• Development support in the time zone of
customer’s R&D center
• Turnkey process transfer to customer possible
at any time
Process
Equipment Chemicals
PacLine 300 – Electroless NiAu/NiPd/NiPdAu
Ultra-SB
2
– Solder Ball Placement
• Optional FOUP wafer handling system
• Optionalprocessautomationwithintegrateduxing
• Optional pre and post placement stencil inspection
for better process control
• Optional integration of Ultra-SB
2
WLR for
automatic yield improvement
• Customizable in-line manufacturing adaptation
• Dedicatedequipmentsolutionforpanellevelisavailable
Substrate Size
4” – 12” wafers, panels up to 650 mm x 650 mm
Substrate Thickness
≥150µm,thinwafersolutionavailableuponrequest
Substrate Materials
Si, GaAs, SiGe, InP, LiTaO3, Ceramics, Laminates, Glass, Quartz,
othermaterialsuponrequest
UBM Material
AlCu,AlSiCu,Cu,Al,AlSi,othermaterialsuponrequest
Solder Alloy Material
SAC, AuSn, PbSn, SnBi, other Eutectic and high lead alloys
Ball Diameter
60µm–760µm
Ball Pitch
>100µm
Machine Throughput
• UPH≥40wafers(8”)
• UPH≥25wafers(12”)
ProcessSpecications
WLCSP FlipChip
Fan-in and Fan-out WLP
Bumping on Substrate
Major Applications
Ultra-SB
2
WLR – Wafer Level Rework
• Integrated 2D AOI
• Integrated rework capability for yield improvement
• Optional AOI map update capability
• Ballsizes:60µm–760µm
• UPH 8” ~25 wafer/hour
• UPH 12” ~15 wafer/hour
Repair bondhead
Removal of rejected solder ball Replacement of removed/
missing solder ball
Wafer
Solder Ball Capillary
Vacuum
Wafer
Solder Ball Capillary
Nitrogen