ke 2070.pdf - 第3页
New Design Head New Design Head ± 50 μ m@Cpk ≧ 1 (0201 and bigger chip parts) (Note1) 1 μ m resolution for XY positioning 260k pulse / rotation resolution for rotation (All head axes) (Note2) Simple and robust. Note1 : ±…
16,000CPH
16,000CPH
with 6 pick & place nozzles.
with 6 pick & place nozzles.
IPC9850. Excluding conveyer
transportation time.
At Laser recognition placement.
M PCB type and front reference
0201 and bigger chip parts
6 parts measuring capability at the same time
Wider parts handling---Up to 33.5 mm square
Higher accuracy by simple and robust structure
MNLA LNC
LNC60
New Concept
New Concept
Laser Align
Laser Align
New Design Head
New Design Head
±50μm@Cpk≧1 (0201
and bigger chip parts)
(Note1)
1μm resolution for XY
positioning
260k pulse / rotation
resolution for rotation (All
head axes)
(Note2)
Simple and robust.
Note1 : ±40μm@Cpk≧1 for 01005 at specified condition
Note2 : Approximately 8K PPR rotational resolution for 2050/2060 Laser Heads
Wider Parts Handling
Wider Parts Handling
Range
Range
01005 placement capability
(0402 in metric)
Up to 33.5 mm square parts by
LNC60 Laser align sensor.
Placement capability for most
of 1.27 mm pitch BGAs.
MNVC function on KE-2070
(optional)
Placement load control
(optional)
Effective
Effective
Speed
Speed
Improvement
Improvement
Speed controlled
Input/Output buffer
conveyer by step
motors
Lower nozzle
changing chance by
6-nozzle head
Easy to Use
Easy to Use
Interchangeability with data,
feeders, nozzles and floor
trolleys
(Note1)
Very similar Man-Machine
dialogs with current machines.
Mouse operation instead of
track ball.
USB available (Note2)
Note1 : MTC and MTS will be re-designed for conforming to RoHS and
only new type of MTC/MTS are available
Note2 : FDD and CD-ROM will be optional.