4000Plus Bondtester Brochure.pdf

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www.nordson.com/TestInspect
Engineered for Excellence
4000Plus Bondtester
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Leading The Way In Bond Testing
Repeatable results
Ribbon pull – With an extensive range
of load tools including hooks and
tweezer jaws, all sizes and types of
ribbons can be tested.
Hot bump/pin pull – A new load
cartridge makes this ground breaking
test even better, especially for
evaluating PCB substrate materials
and low profile solder bumps.
First bond ball pull of copper wires
and pull of studs, bumps and pillars
– For the first time custom pull
jaws enable tensile tests on these
important interconnects.
Fatigue pull and shear – Fatigue
analysis is emerging as an increasingly
important method in evaluating solder
joint reliability. A mix of soware
control and hardware enables fatigue
testing in both pull and shear modes.
Passivation layer shear – A
combination of soware and a special
load tool provides a solution to ball
shear where access is limited by the
passivation layer.
The 4000Plus is the most
advanced bondtester on the
market, oering unsurpassed
accuracy and repeatability.
Developed by the world leader
in bond testing technology, the
4000Plus represents the industry
standard in bond testing.
Highly Configurable
The 4000Plus provides ultimate versatility.
Choose from a range of XY stages up to 300mm
of travel in one axis, and a unique range of load
cartridges including push cartridges up to 50kg,
pull cartridges up to 100kg and shear cartridges up
to 200kg (500kg capable using special fixtures for
shear). An extensive range of load tools provides
for standard and specialized applications. A
wide choice of optics is available to suit every
application. The standard mainframe vertical
working envelope of 120mm will meet most
applications. However please consult factory
for any special requirements.
Irrespective of the industry: semiconductors, or the various
microelectronics sectors of automotive, power, hybrid,
or high reliability, the 4000Plus has the versatility and
accuracy that gives its users total confidence in the quality
of its products. It features the latest patented bond testing
technology, for example the anti-backlash system. The
4000Plus is capable of testing from 250 milligrams right
through to 500kg, catering for both standard and specialized
applications. Remember too, that the 4000Plus builds on
the success of the 4000, so data correlation between the
machines is assured.
Wire Ball
Ribbon Solder ball
Hot bump/pin pull Standard die shear
Cold bump pull Cavity
Copper wire bonds, studs and pillars Passivation layer
Stud bump Low profile zone shear
Vector Wafer bump
Fatigue Fatigue
Push Low profile die shear
Tweezer peel High force die shear
High force pull (up to 100kg) Horizontal stud pull
Vertical stud pull Cu pillar shear
Die pull/flip chip pull Micro bump shear
Pull/Push Test Shear Tests
Extensive Testing Capability
Current and emerging applications are fully catered for
with load cartridges combined with standard and
specialized fixtures to perform shear tests up to 500kg,
pull tests up to 100kg and push tests up to 50kg.
Image Capture System
Quick and simple to set-up, located in close
proximity to the test head to aid faster
testing. Improves test automation.
XY Stage
A range of XY stages are available from
160mm x 160mm right through to 300mm
x 210mm. Including high precision,
higher speed and zone shear options.
In addition to this there is even the
option of a heated work stage up to 400 degrees C at 200kg
max, complete with adjustable temperature control.
Flexural Testing
Fatigue Testing
Torsion Testing
Brittle Fracture Testing
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Data Correlation
Nordson recognizes that data correlation is
fundamental for cross referencing test results
between old and new platforms. Existing users
of Nordson bondtesters (4000 Optima and
4000) can confidently compare data between
old and new machines. Further, we know that
many users collect data on the same product
from multiple machines, either on the same
site or even dierent sites, and need to be
sure that the data will correlate with ultimate
integrity given identical configurations and
test parameters.
Nordson have carried out exhaustive internal
GR&R studies to prove correlation between
old and new machines. The 4000Plus plays
a critical role in data correlation but equally
important is Paragon™, our bond testing
soware. Import and export protocols and
database management tools also ensure data
streams from new, old or multiple machines
can be compared.
Data Integrity
The 4000Plus oers exceptional repeatability
and reproducibility of results, with a total
system accuracy of +/-0.1% of the load range
selected (see detailed specifications).
Ultimate Step Back Accuracy
Control of shear height (step back) is critical to
consistent test results in shear applications.
Nordson has developed a unique patented
anti-backlash system that aids setting
and control of step back. Shear height can
be set and maintained to single micron
accuracy across the range of load cartridges.
Additionally, on the S25G load cartridge
the step back accuracy is a superlative +/- 0.25
microns. The accuracy is qualified through
laser measurement.
Data Traceability
The 4000Plus is calibrated in accordance
with International standards, providing full
traceability and integrity in product testing.
Calibration is performed using O.I.M.L class M1
tolerance weights directly traceable to
National Standards; UKAS or optional NIST
Class 1 weights.
Automatic Load Tool Alignment
The optional self-aligning shear tool sleeves
ensure that the correct load is applied by
compensating for misaligned die attach.
Ultimate step back accuracy
gold ball bond
passivation
layer
silicon
shear
tool
Image Capture System
Borescope Imaging System
Trinocular Camera Slide Alignment Camera System
Paragon
TM
soware’s virtual map for programming a pattern
The 4000Plus test platform oers a
wide range of optical solutions for bond
testing and materials testing, featuring
imaging systems for failure mode analysis,
alignment and live recording of tests.
Image Capture Camera
The image capture system provides high resolution
images for failure mode analysis and fiducial alignment.
Its close proximity to the tool maximizes throughput,
particularly for automated tests. The camera has a built-
in light source to provide optimal illumination and fine
focus is achieved using the precise movement capabilities
of the 4000Plus test platform. A wide range of objective
lenses ensure that the optimal resolution and depth of
field can be achieved with magnifications up to 1500x.
Borescope Imaging System
The borescope provides high magnification imaging, ideal
for precise tool alignment. Based on medical endoscope
technology, it is perfect for ultra fine pitch devices such
as fine wire bonds or very small geometries such as micro
bumps and copper pillars. The borescope contains its
own light source and can be positioned in and out of the
viewing position using its precision slide with constant
focus on the test sample.
Trinocular Camera
The trinocular camera can be attached to any stereo
zoom microscope with a C-mount. With an appropriate
microscope, the field of view can be adjusted from wide
to close up and is ideally suited for macro positioning.
Used in conjunction with the side alignment camera, the
two views (front and side) enable precise tool alignment,
particularly for small, delicate or diicult samples.
Side Alignment Camera
The side view camera is ideal for testing micro features
such as copper pillars, micro bumps and TSVs. The
system enables a secondary view point of feature to be
tested, providing accurate and repeatable tests. The side
alignment camera is attached to the cartridge mount,
giving ultra stable, vibration free, imaging with constant
focus on the tool tip.
All camera systems use a USB connection and can be
field retrofitted.
Image capture camera can be utilized as a fiducial
alignment camera for automation.
You can test faster with the unique vector controls, utilizing
the newly styled key-pad featuring programmable nudge
buttons for precise positional alignment.
Confidence In Your Results Increased Eiciency