FuzionSC_condensed_datasheet.pdf

Semiconductor performance at surface mount speeds Adv anced Packaging Solutions Bringing high productivity to advanced packaging assembly One solution for all advanced packaging challenges  Accuracy: <10µm, speed: 16…

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Semiconductor performance at surface mount speeds
Advanced Packaging Solutions
Bringing high productivity
to advanced packaging assembly
One solution for all advanced packaging challenges
Accuracy: <10µm, speed: 16K cph, area: 813 x 610mm
Any feeding option (wafer, tray, tape, tube, bulk, direct die)
Place high-accuracy actives and passives on one platform
Pick and place on any substrate, including thin/ex
Advanced Process Lab (APL): Leading-edge process and
materials expertise; process optimization, failure analysis
Embedded
Multi-Die
Fan-Out
High-Accuracy
Place
Flip Chip in
Package
Wafer-Level
Packaging
System-in-
Package
Full range of actives and passives:
Size: 008004 – 100 x 100mm
Thickness: 50µm – 25mm
Any substrate format:
Size: 20 x 20mm – 813 x 610mm
Thickness: 50µm – 12.7mm
Comprehensive process development
Advanced capabilities for
advanced applications:
www.uic.com | email: universal@uic.com
MC-6687B
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All rights reserved. All specications are subject
to change.
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FUZIONSC VIDEO (click here)