SSM-EN-ZEVAC-Flyer.pdf - 第4页
DIMENSIONS TECHNICAL DA T A Swiss Engineering Product designation SSM 4A Max. board size 600 x 600 mm Pumping system Solder pump Heat up time Approx. 30 min Cycle duration 0 - 60 s Air pressure 1 - 8 bar Solder tenperatu…
APPLICATION RANGE
SSM 4A UND SSM 9 – REPAIR OF TROUGH HOLE PARTS
Swiss Engineering
Repairs
Damaged components can be replaced.
Prototyping
Prototypes can be equiped and soldered in an ecient way with the SSM 4 and SSM 9.
Retrots
• Components which are missing at production time
• On the soldering side components have to be placed
• A SMD equipped board has to be extended by single wired components
Soldering
When equiping boards with only few components the use of the solderingand desoldering machines SSM 4 or SSM 9 is in most cases
the simplest and most economical way.
Saves time
The system’s ergonomic design speeds up and simplies your work and generates results that comply with the most stringent quality
requirements.
No Restrictions
The SSM 4 and SSM 9 will dependably handle even the most dicult soldering and desoldering jobs:
• Operations on multilayer boards
• Processes components with complex geometries such as DIP switches and long connectors
• Operates on dense mixed technology boards
• Soldering on the assembly side, even between adjacent high components
• Soldering and desoldering of Pin Grid Arrays and sockets
• Soldering on ex boards
OPTIONAL PREHEATER MODULE PH 4
To improve the performance for lead-free applications
The preheater module PH 4 can be used as individual device or
together with the SSM 4A or the SSM 9. By preheating the
PCB before the selective soldering process is carried out the risk
of copper delamination is reduced.The preheater PH 4 uses IR
technology to preheat the printed circuit board on an area of
300 x 300 mm with a performance of 3500 watt.
DIMENSIONS
TECHNICAL DATA
Swiss Engineering
Product designation SSM 4A
Max. board size 600 x 600 mm
Pumping system Solder pump
Heat up time Approx. 30 min
Cycle duration 0 - 60 s
Air pressure 1 - 8 bar
Solder tenperature 200 °C - 300 °C
Max. power consumption 2500 Watt
Power requirements 220 - 230 Volt, 50 Hz
Dimensions (W x D x H) 440 x 800 x 360 mm
Solder content Approx. 16 kg
Weight (without solder) 47 kg
The SSM 4A is used for selective soldering and
desoldering of multipolar trough hole components
(THT). Due to dened process parameters
repeatable results can be achieved.
SSM 4A
DIMENSIONS
TECHNICAL DATA
SSM 9
The SSM 9 is used for selective soldering
and desoldering of multipolar trough hole
components. Due to the programmable
parameters precise and repeatable results
can be achieved, user-independent
Swiss Engineering
SSM 4A UND SSM 9 – REPAIR OF TROUGH HOLE PARTS
Product designation SSM 9
Max. board size 840 x 600 mm
Pumping system Solder pump
Heat up time Approx. 30 min
Cycle duration 0 - 60 s
Air pressure 1 - 8 bar
Solder tenperature 235 °C - 400 °C
Max. power consumption 2500 Watt
Power requirements 220 - 230 Volt, 50 Hz
Dimensions (W x D x H) 440 x 800 x 360 mm
Solder content Approx. 16 kg
Weight (without solder) 75 kg