IConn-ProCu-PLUS-052014PDFA.pdf

IConn PS ProCu PLUS TM is the new State-of-the-Art in Copper Wire Bonding. With its upgraded and enhanced subsytems, it is engineered to deliver all the capability you will need — For Copper today , PLUS tomorrow . IConn…

100%1 / 2
IConn
PS
ProCu PLUS
TM
is the new
State-of-the-Art in Copper Wire
Bonding. With its upgraded and
enhanced subsytems, it is engineered
to deliver all the capability you will
need — For Copper today, PLUS
tomorrow.
IConn ProCu PLUS is prepared to
handle all leading edge copper bonding
challenges.
Our new ProCu5 process offers the
highest level of Copper Process
Capability available. It has many added
controls and improvements over all
existing ProCu processes. ProCu5
enables robust wire bonding production
for Advanced node wafers down to 28
nanometer or below.
The Power Series of
Semiconductor Assembly
Equipment from K&S has
established itself as the
leading capability in
package assembly. These
products reinforce two key
principles, the Powerful
performance built into
these products, and the
Power of K&S as the
Technology Leader of its
market space for more
than five decades.
The Power Series has set
new standards for
performance, productivity,
upgradeability, and ease of
use. The technical success
and customer acceptance
of the Power Series of
products since their
introduction are evidence
of the K&S continued
commitment for providing
products with the Power to
handle not only today’s
most challenging
packaging applications,
but also tomorrow’s.
From K&S —
the most Powerful name in
Package Assembly
Features
▪ ProCu Bond and ProCu SSB Processes
(Patent Pending) New Easy to Use —
Response Oriented Copper Processes
with Higher UPH for most applications.
▪ Enhanced Gas Delivery System design
for optimal Free Air Ball Formation and
the most optimal level of cover gas
consumption.
▪ Programmable Pneumatics Gas
Regulation and Metering.
▪ Pro-Process library Files and Functions
— Recommended Copper Bonding
Processes for 1
st
and 2
nd
bonds, and
Looping. With Easy to Use tools for
storing, cataloging, and re-using golden
processes.
For Copper Today,
Tomorrow
For sales, service and manufacturing locations, visit www.kns.com
© 2014 Kulicke & Soffa Industries Inc. Specifications may change without notice.
The K&S logo and Kulicke & Soffa are trademarks of Kulicke & Soffa Industries, Inc.
BB-012-05/2014
Power Series
Wire Bonders include:
User interface that retains
the familiar K&S look and
feel; minimal training
needed to become familiar
with new performance
enhancing and productivity
increasing features
CE Certification
Semi S2 Safety
Certification*
Semi S8 Ergonomic
Certification*
Semi E10 Compliance for
Run Time Statistics and
MTBA /MTBF calculations
Upgradeability with
Power Pack Upgrade Kits
Programmable Power
Supply System to bond
through factory power
spikes or dips
Industry leading K&S Tray
and Gripper Magazine
Handling system
Full KNet PLUS
compatibility and readiness
* Tested to SEMI S2-0706
(Environmental, Health, and
Safety Guideline for
Semiconductor Manufacturing
Equipment) and S8-0705
(Safety Guidelines for
Ergonomics Engineering of
Semiconductor Manufacturing
Equipment)
COPPER WIRE BONDING CAPABILITY
Ultra Fine Pitch
40 μm pitch
0.6 mil to 1.2 mil copper wire
Gold Wire Pitch Capability in Copper Configuration
35 μm pitch with 0.6 mil gold wire
Bonding Area
X Axis: 56 mm
Y Axis: 80 mm
Total Bond Placement Accuracy
2.0 μm @ 3 sigma
Pattern Recognition/Optics/Vision
Progressive Scan Vision Engine
CCD Video Camera
▪ Dual Magnification Optics (2x & 6x)
▪ Optional Programmable Focus for High Magnification
Standard User Processes
Compatible with all Legacy Processes
Power Series Loops
The Pro Series - Pro-Bond, Pro-Loop, Pro-Stitch ProCu Bond
and ProCu SSB
Pro-Process Library
On Bonder Pull Test - 1
st
bond and 2
nd
bond tail pull
Compatibility
Power Series bond programs are upwardly compatible with
IConn ProCu PLUS models - optimization on the newer bonder is
recommended for full performance
Process Programs are NOT backward compatible. Programs
are taught on a new bonder model will not run on an older model.
LOOPING CAPABILITY (with 25.4 μm wire diameter)
Maximum Wire Length
7.6 mm
Minimum Loop Height
100 μm standard & worked loops
70 μm folded & reverse loops
50 μm ultra-low loop with Power Series Low Loop
Wire Sway
Wire length < 2.54 mm: 25 μm @ 3 sigma
Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma
SET UP & CONVERSION TIMES
If Wire Type remains unchanged, the time estimated below applies.
If Wire Type changes, the time estimated would be doubled.
Same Leadframe Type: < 4 min
(Heat block insert & clamp changes, program load from disk)
Different Leadframe Type: < 8 min
(Leadframe width & length changes, magazine size change,
heat block insert & clamp change, program load from disk)
KNET PLUS ASSEMBLY EQUIPMENT NETWORK
KNet PLUS improves efficiency and productivity, by monitoring
equipment status in real-time. It collects data and controls process
programs locally or from anywhere on a customer’s network.
Contact your K&S Sales Representative to learn more.
MATERIAL HANDLING CAPABILITY
Package/Leadframe Dimensions
Length: 90 to 300 mm
(L/F shorter than 100 mm will
require optional injector kit)
Width: 15 to 92 mm
Thickness: 0.10 to 1.1 mm
Die Pad Downset: Up to 2.3 mm
Magazine Dimensions
Width: 20 to 98 mm
Length: 127 to 305 mm
Height: 50 to 178 mm
Slot Pitch: 1.27 to 25 mm
Max. Weight: 5.22 kg
MAN-MACHINE INTERFACE
Monitor
17” color LCD display
Durable Control Panel
Function keys and dedicated buttons, and
user-friendly mouse
Industry-Recognized User Interface
Simple pull-down menus. Color-overlays of wire
groups for easy programming and teach
FACILITY REQUIREMENTS
Minimum Air Pressure
3.52 kg/sq cm (50 psi)
Nominal Air Consumption (flow rate)
185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
Cover Gas Consumption (flow rate)
Minimum 0.6 liters/min
Maximum 1.5 liters/min
Nominal 1.1 liters/min
Input Voltage
Standard
200 - 240 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Optional
100 - 115 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Power Consumption
1.5 KVA (nominal), 2.6 KVA (max.)
Footprint
Base machine with MHS
889 mm wide x 1009 mm deep (35” x 39.7”)
Weight (estimated)
Machine 590 kg (1300 lbs)
Machine & Crate 670 kg (1477 lbs)
For Copper Today, Tomorrow