Viscom_Brochure_AOI_S3016_ultra_en.pdf

With this machine type, Viscom brings its gr eat THT c ompe - tence into line with its longstanding experienc e in developing high-qualit y 3D inspection systems for SMD production. The S3016 ultra is perfectly suited fo…

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With this machine type, Viscom brings its great THT compe-
tence into line with its longstanding experience in developing
high-quality 3D inspection systems for SMD production. The
S3016 ultra is perfectly suited for inspecting SMD, THT and press-
fit components as well as selective solder joints from below. THT
solder joints, for example, can be precisely inspected in 3D with
intelligent, high-throughput inspection technology from Viscom.
The S3016 ultra is easily and efficiently combinable with a Viscom
verification station. Results can be conveniently evaluated with
data and images from other Viscom inspection stages. Imple-
menting an efficient statistical process control from Viscom is also
an option.
Even under extreme cycle time requirements, the system's
high-performance camera technology ensures the greatest in-
spection depth. Versatile illuminations can be tuned to the spe-
cific task. Previously captured images are evaluated at the same
time an x/y unit moves the camera module beneath the printed
circuit board to the next position – a decisive time advantage.
In addition to measuring pins, Viscom inspection algorithms also
enable fast detection of open solder joints, solder bridges, miss-
ing pins and other defects.
www.viscom.com
3D Solder Joint Inspection
on PCB Bottom Sides
S3016 ultra
Powerful 3D sensor technology
for quality control from below
Shadow-free results by using
eight angled cameras
Versatile handling of many very
different inspection object types
Optional return transport of
the manufactured products
3D AOI
Insufficient wetting (front)
and missing pin (back)
Reliable 3D inspection of
THT solder joints
www.viscom.com
Headquarters: Viscom AG · Carl-Buderus-Straße 9 - 15 · 30455 Hanover · Tel. +49 511 94996-0 · Fax +49 511 94996-900 · info@viscom.com · www.viscom.com
You will find our international subsidiaries
and representatives under:
#Viscom_S3016_ultra_EN20060002 Specifications subject to change without notice. Windows
®
and Intel® Core™ i7 are registered trademarks.
Dimensions in mm
Front view Top view
Technical Specifications
Side view with optional return transport
S3016 ultra
Inspection scope
3D AOI
Selective and wave soldering, standard solder joints according to IPC, press fit
Camera technology
3D camera technology
Z-resolution 0.5µm
Z-range Up to 30mm (1.2")
Angled view cameras
Number of megapixel cameras 8
Orthogonal camera
Resolution 15µm
Field of view 50mmx50mm (2" x 2")
Software
User interface Viscom EasyPro/vVision-ready
Statistical process control Viscom SPC/vSPC, open interface (optional)
Verification station Viscom HARAN/vVerify
Remote diagnosis Viscom SRC (software remote control) (optional)
Programming station Viscom PST34 (optional)
System computer
Operating system Windows®
Processor Intel® Core™ i7
PCB handling
Transport type Single track transport, return transport (optional)
PCB dimensions (L x W)
520mm x 610mm, minimum width 70mm (19.7" x 19.7", min. width 2.8")
Transport height 950-1000mm ±20mm* (37.4" - 39.4" ± 0.8" );
optional return transport: up to 300 mm (11.8")
Width adjustment Automatic
Upper transport clearance Up to 80mm (3.1")*, 100 mm (3,9") (optional)
Lower transport clearance Up to 50mm (2")
Inspection speed
Up to 65cm
2
/s
Other system data
Positioning/handling unit Synchronous linear motors
Interfaces SMEMA
Power requirements 400V (other voltages on request), 3P/N/PE, 8A, 4-6bar working pressure
System dimensions 1094mm x 1620mm x 1692mm (43.1" x 63.8" x 66.6") (W x H x D)
Weight 750kg (1653 lbs)
*Standard conguration, individual adjustments on request