Viscom_Brochure_iX7059_Module_Inspection_en.pdf
DP AK with orthogonal radiation Solder joint inspection of DCB layers Solder joint inspection of chip layers As a result of their high degr ee of efficiency, po wer semicon - ductors such as IGBT s are successfully used …
DPAK with orthogonal radiation
Solder joint inspection of DCB layersSolder joint inspection of chip layers
As a result of their high degree of efficiency, power semicon-
ductors such as IGBTs are successfully used in electric drives as
well as for the transmission of high voltages / DC voltages in the
field of renewable energies. Manufacturers and end customers
alike place requirements on efficiency, performance and safety,
so flawless, durable functionality is the key to ensuring these
requirements can be met in equal measure.
The iX7059 Module Inspection 3D X-ray system offers seamless,
reliable quality assurance in semiconductor production: The fully
automated 3D X-ray inspection with integrated computer tomog-
raphy uses powerful radiographic technology to deliver exact
inspection images of layers that are easy to classify. Its broad in-
spection scope extends to damaged, twisted, missing and incorrect
components, THT solder joints, and concealed blow holes (voids) in
surface soldering. The quality of each individual solder joint of
the wired components determines whether overheating and
consequently short circuits could occur due to a lack of heat dis-
sipation, which must be avoided.
The compact X-ray system is designed for a space-saving inline
setup and offers flawless handling of frame-based power modules
or components on workpiece carriers. Thanks to the intelligent
networking of the Viscom X-ray system within the production
line, processes and quality are optimized over the long term –
exactly as required in a smart factory.
www.viscom.com
Strong Performance for
Highest Quality Demands
iX7059 Module Inspection
More Process Efficiency
with 3D X-ray and
Integrated CT
3D AXI
Reliable inspection for complex and encased
power components thanks to powerful X-rays
Precise solder joint inspection on IGBT modules
and SiC chips protects against overheating
Intelligent void check with measurement of the
air inclusions for flawless heat dissipation
Rapid handling of workpiece carriers and soldering
frames enabling highest throughput rates
Technical Specifications
#Viscom_iX7059_Module_EN21100003 | © Viscom AG. All rights reserved. | Specifications subject to change without notice. Windows® and Intel® Core™ i7 are registered trademarks.
Dimensions in mm
Front view Top viewSide view
www.viscom.com
Headquarters: Viscom AG
·
Carl-Buderus-Str. 9 - 15
· 30455 Hanover, Germany
·
Phone +49 511 94996-0
·
Fax +49 511 94996-900
·
info@viscom.com
Our international subsidiaries and
representatives can be found at:
iX7059 Module Inspection
X-ray technology
X-ray tube Sealed microfocus X-ray tube
High voltage 130 kV (up to 180 kV optional)
Tube current 500 µA
Detector Flat panel detector type FPD T2 (FPD T3 optional), 14-bit grayscale depth
Resolution 9.5 - 25 µm/Pixel
3D image capture mode Evolution 4 as standard, Evolution 5 optional for unique dynamic image recordings
X-ray cabinet Designed to meet requirements for fully protected devices in accordance with the
German Radiation Protection Act (StrlSchG) and the German Radiation Protection
Ordinance (StrlSchV). Radiation leakage rate < 1 µSv/h
Software
User interface Viscom vVision/EasyPro
Statistical process control Viscom vSPC/SPC, open interface (optional)
Verification station Viscom vVerify/HARAN
Remote diagnosis Viscom SRC (optional)
Programming station Viscom PST34 (optional)
Operating system Windows®
Processor Intel® Core™ i7
Handling
Inspection object size Up to 1000 mm x 660 mm (39.4" x 26") (L x W)*
Inspection object weight Up to 15 kg (33 lbs)
Transfer height 860 - 980mm ± 20mm (33.9" - 38.6" ± 0.8")
Width adjustment Automatic during setup
Clamping Pneumatic
Support area 3 mm (0.1")
Upper transport clearance Up to 50 mm (2")
Lower transport clearance Up to 50 mm (2")
Other system data
Positioning unit Synchronous linear motor
Interfaces SMEMA, IPC Hermes (optional)
Power requirements 400V (other voltages on request), 3P/N/PE, 8A, 4-6bar working pressure
System dimensions
1493mm x 1654mm x 2207mm (58.8" x 65.1" x 86.9") (W x H x D)
Line integration dimension +30mm (1.2") on both sides
Weight 2245 kg (4949 lbs), 2810 kg (6195 lbs) for 180 kV option
*Depending on the configuration